IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| JESD-30 代码 | R-XDIP-T14 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | LOGIC CIRCUIT |
| 端子数量 | 14 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| DS8812J | DS7810J | DS7811J | DS7812J | DS8810J | DS8810N | DS8811J | DS8811N | DS8812N | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,PLASTIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,PLASTIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | unknown | compliant |
| Is Samacsys | N | N | N | N | N | N | N | N | N |
| JESD-30 代码 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-PDIP-T14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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