IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,PLASTIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | National Semiconductor(TI ) |
Reach Compliance Code | unknown |
Is Samacsys | N |
JESD-30 代码 | R-PDIP-T14 |
JESD-609代码 | e0 |
逻辑集成电路类型 | LOGIC CIRCUIT |
端子数量 | 14 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
表面贴装 | NO |
技术 | BIPOLAR |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
DS8811N | DS7810J | DS7811J | DS7812J | DS8810J | DS8810N | DS8811J | DS8812J | DS8812N | |
---|---|---|---|---|---|---|---|---|---|
描述 | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,PLASTIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,PLASTIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,CERAMIC | IC,TTL-TO-MOS TRANSLATOR,BIPOLAR,DIP,14PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
Reach Compliance Code | unknown | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
Is Samacsys | N | N | N | N | N | N | N | N | N |
JESD-30 代码 | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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