1K X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
1K × 16 总线串行电可擦除只读存储器, PDSO8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP8,.25 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Samacsys Descripti | Atmel AT93C86A-10SU-2.7 EEPROM Memory, 16kbit, 2.7 → 5.5 V 8-Pin SOIC |
| 备用内存宽度 | 8 |
| 数据保留时间-最小值 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 4.9 mm |
| 内存密度 | 16384 bi |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 16 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 1024 words |
| 字数代码 | 1000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 1KX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 串行总线类型 | MICROWIRE |
| 最大待机电流 | 0.00001 A |
| 最大压摆率 | 0.002 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3.9 mm |
| 最长写入周期时间 (tWC) | 10 ms |
| 写保护 | SOFTWARE |
| Base Number Matches | 1 |
| AT93C86A-10SU-2.7 | AT93C86A-10PU-1.8 | AT93C86A-10PU-2.7 | AT93C86A_07 | AT93C86AY6-10YH-1.8 | AT93C86A-10TU-1.8 | AT93C86AY1-10YU-1.8 | AT93C86A-W1.8-11 | AT93C86A-10SU-1.8 | AT93C86A-10TU-2.7 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 1K X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8 | 1K X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8 | 1K X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8 | 1K X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8 | 1K X 16 MICROWIRE BUS SERIAL EEPROM, DSO8 | 1K X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8 | 1K X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8 | 1K X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8 | 1K X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8 | 1K X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8 |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 组织 | 1KX16 | 1KX16 | 1KX16 | 1K X 16 | 1KX16 | 1KX16 | 1KX16 | 1KX16 | 1KX16 | 1KX16 |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | GULL WING | NO LEAD | NO LEAD | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER | DUAL | DUAL |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 | 符合 | 符合 | - | 符合 | 符合 |
| 厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | - | - | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | SOIC | DIP | DIP | - | SON | TSSOP | MSOP | DIE | SOIC | TSSOP |
| 包装说明 | SOP, SOP8,.25 | DIP, DIP8,.3 | DIP, DIP8,.3 | - | 2 X 3 MM, 0.50 MM PITCH, GREEN, MO-229, MLP-8 | TSSOP, TSSOP8,.25 | VSON, SOLCC8,.2,25 | DIE, | SOP, SOP8,.25 | TSSOP, TSSOP8,.25 |
| 针数 | 8 | 8 | 8 | - | 8 | 8 | 8 | - | 8 | 8 |
| Reach Compliance Code | compli | compli | compli | - | unknow | compli | compli | unknow | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 备用内存宽度 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 | 8 |
| 数据保留时间-最小值 | 100 | 100 | 100 | - | 100 | 100 | 100 | - | 100 | 100 |
| 耐久性 | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 | R-PDIP-T8 | R-PDIP-T8 | - | R-XDSO-N8 | R-PDSO-G8 | R-XDSO-N8 | X-XUUC-N | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e3 | - | e4 | e3 | e3 | - | e3 | e3 |
| 长度 | 4.9 mm | 9.271 mm | 9.271 mm | - | 3 mm | 4.4 mm | 4.9 mm | - | 4.9 mm | 4.4 mm |
| 内存密度 | 16384 bi | 16384 bi | 16384 bi | - | 16384 bi | 16384 bi | 16384 bi | 16384 bi | 16384 bi | 16384 bi |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | - | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 | 8 |
| 字数 | 1024 words | 1024 words | 1024 words | - | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| 字数代码 | 1000 | 1000 | 1000 | - | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | DIP | - | VSON | TSSOP | VSON | DIE | SOP | TSSOP |
| 封装等效代码 | SOP8,.25 | DIP8,.3 | DIP8,.3 | - | SOLCC8,.11,20 | TSSOP8,.25 | SOLCC8,.2,25 | - | SOP8,.25 | TSSOP8,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | - | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | UNCASED CHIP | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | NOT SPECIFIED | - | 260 | 260 | 260 | - | 260 | 260 |
| 电源 | 3/5 V | 2/5 V | 3/5 V | - | 2/5 V | 2/5 V | 2/5 V | - | 2/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 5.334 mm | 5.334 mm | - | 0.6 mm | 1.2 mm | 0.9 mm | - | 1.75 mm | 1.2 mm |
| 串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | - | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
| 最大待机电流 | 0.00001 A | 1e-7 A | 0.00001 A | - | 1e-7 A | 1e-7 A | 1e-7 A | - | 1e-7 A | 0.00001 A |
| 最大压摆率 | 0.002 mA | 0.002 mA | 0.002 mA | - | 0.002 mA | 0.002 mA | 0.002 mA | - | 0.002 mA | 0.002 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 1.8 V | 2.7 V | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 2.7 V |
| 标称供电电压 (Vsup) | 5 V | 2.7 V | 5 V | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 5 V |
| 表面贴装 | YES | NO | NO | - | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Matte Tin (Sn) - annealed | - | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | - | 0.5 mm | 0.65 mm | 0.65 mm | - | 1.27 mm | 0.65 mm |
| 处于峰值回流温度下的最长时间 | 40 | NOT SPECIFIED | NOT SPECIFIED | - | 40 | 40 | 40 | - | 40 | 40 |
| 宽度 | 3.9 mm | 7.62 mm | 7.62 mm | - | 2 mm | 3 mm | 3 mm | - | 3.9 mm | 3 mm |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | - | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| 写保护 | SOFTWARE | SOFTWARE | SOFTWARE | - | SOFTWARE | SOFTWARE | SOFTWARE | - | SOFTWARE | SOFTWARE |
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