262,144-Word x 16-Bit or 524,288-Word x 8-Bit One Time PROM
MR27V402E | MR27V402EMP | MR27V402ERP | MR27V402ETP | MR27V402EJA | |
---|---|---|---|---|---|
描述 | 262,144-Word x 16-Bit or 524,288-Word x 8-Bit One Time PROM | 262,144-Word x 16-Bit or 524,288-Word x 8-Bit One Time PROM | 262,144-Word x 16-Bit or 524,288-Word x 8-Bit One Time PROM | 262,144-Word x 16-Bit or 524,288-Word x 8-Bit One Time PROM | 262,144-Word x 16-Bit or 524,288-Word x 8-Bit One Time PROM |
厂商名称 | - | OKI | OKI | OKI | OKI |
零件包装代码 | - | SOIC | DIP | TSOP2 | SOIC |
包装说明 | - | SOP, | DIP, | TSOP2, | SOJ, |
针数 | - | 40 | 40 | 44 | 42 |
Reach Compliance Code | - | unknow | unknow | unknow | unknow |
ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | - | 80 ns | 80 ns | 80 ns | 80 ns |
备用内存宽度 | - | 8 | 8 | 8 | 8 |
JESD-30 代码 | - | R-PDSO-G40 | R-PDIP-T40 | R-PDSO-G44 | R-PDSO-J42 |
长度 | - | 26 mm | 51.98 mm | 18.41 mm | 27.3 mm |
内存密度 | - | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi |
内存集成电路类型 | - | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
内存宽度 | - | 16 | 16 | 16 | 16 |
功能数量 | - | 1 | 1 | 1 | 1 |
端子数量 | - | 40 | 40 | 44 | 42 |
字数 | - | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | - | 256000 | 256000 | 256000 | 256000 |
工作模式 | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | - | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | SOP | DIP | TSOP2 | SOJ |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
并行/串行 | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 2.5 mm | 5.08 mm | 1.2 mm | 3.75 mm |
最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | - | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | - | YES | NO | YES | YES |
技术 | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | - | GULL WING | THROUGH-HOLE | GULL WING | J BEND |
端子节距 | - | 1.27 mm | 2.54 mm | 0.8 mm | 1.27 mm |
端子位置 | - | DUAL | DUAL | DUAL | DUAL |
宽度 | - | 10.7 mm | 15.24 mm | 10.16 mm | 10.16 mm |
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