CYStech Electronics Corp.
Dual zener diodes
Spec. No. : C334N3
Issued Date : 2003.05.22
Revised Date :
Page No. : 1/3
BZ5239CAN3/BZ5239CCN3
Description
Two ZD5239 diodes are encapsulated in a SOT-23 small plastic SMD package. Two different pinnings
are available.
Pinning
Pin
1
2
3
Description
BZ5239CA
BZ5239CC
K1
A1
K2
A2
A1,A2
K1,K2
Outline
SOT-23
3
1
2
Marking:
(1)BZ5239CA
(2)BZ5239CC
Type
Marking Code
BZ5239CAN3
29A
BZ5239CCN3
29C
Diode configuration and symbol
Thermal Characteristics
•
Maximum Temperatures
Storage Temperature Tstg ................................................................................................... -55~+150
°C
Junction Temperature Tj ............................................................................................................. +150
°C
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) Ptot
..
................................................................................ 230 mW
•
Thermal Resistance, Junction to Ambient
θ
JA
………………………………………………543
℃/W
BZ5239CAN3/BZ5239CCN3
CYStek Product Specification
CYStech Electronics Corp.
Electrical Characteristic
(V
F
=0.9V Max @I
F
=10mA.)
Test Current
I
ZT
(mA)
20
Zener Voltage
V
Z
(V)
9.1
±5%
Z
ZK
I
Z
=0.25mA
(Ω, max)
600
Z
ZT
I
Z
=I
ZT
(Ω, max)
10
Spec. No. : C334N3
Issued Date : 2003.05.22
Revised Date :
Page No. : 2/3
Maximum Reverse Current
I
R
(μA)
3.0
V
R
(V)
7.0
Characteristic Curves
Power Derating Curve
250
100
Reverse Current vs Reverse Voltage
Power Dissipation---PD(mW)
200
Reverse Current (mA)
80
150
60
100
40
50
20
0
0
50
100
150
200
Ambient Temperature --- Ta(℃ )
0
4000
5000
6000
7000
8000
Reverse Voltage (mV)
9000
10000
Forward Current vs Forward Voltage
300
250
200
Forward Current (mA)
150
100
50
0
0
200
400
600
800
Forward Voltage (mV)
1000
1200
BZ5239CAN3/BZ5239CCN3
CYStek Product Specification
CYStech Electronics Corp.
SOT-23 Dimension
Diagram:
L
3
B
1
2
S
Spec. No. : C334N3
Issued Date : 2003.05.22
Revised Date :
Page No. : 3/3
A
Marking:
L4_
29X
V
G
C
D
K
3-Lead SOT-23 Plastic Surface Mounted
Package.
CYStek Package Code: N3
J
H
•
BZ5239CAN3: Common Anode. (Marking Code : 29A )
•
BZ5239CCN3: Common Cathode. (Marking Code : 29C )
*: Typical
DIM
A
B
C
D
G
H
Inches
Min.
Max.
0.1102 0.1204
0.0472 0.0630
0.0335 0.0512
0.0118 0.0197
0.0669 0.0910
0.0005 0.0040
Millimeters
Min.
Max.
2.80
3.04
1.20
1.60
0.89
1.30
0.30
0.50
1.70
2.30
0.013
0.10
DIM
J
K
L
S
V
Inches
Min.
Max.
0.0034 0.0070
0.0128 0.0266
0.0335 0.0453
0.0830 0.1083
0.0098 0.0256
Millimeters
Min.
Max.
0.85
0.177
0.32
0.67
0.85
1.15
2.10
2.75
0.25
0.65
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BZ5239CAN3/BZ5239CCN3
CYStek Product Specification
ARM技术
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
