Microwire BUS 4Kbit(256 x 16bit) EEPROM
| BR93A66-W | BR93A66F-W | BR93A66FJ-W | BR93A66RF-W | BR93A66RFJ-W | |
|---|---|---|---|---|---|
| 描述 | Microwire BUS 4Kbit(256 x 16bit) EEPROM | Microwire BUS 4Kbit(256 x 16bit) EEPROM | Microwire BUS 4Kbit(256 x 16bit) EEPROM | Microwire BUS 4Kbit(256 x 16bit) EEPROM | Microwire BUS 4Kbit(256 x 16bit) EEPROM |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | - | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) |
| 零件包装代码 | - | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | - | LEAD FREE, SOP-8 | LEAD FREE, SOP-8 | LEAD FREE, SOP-8 | LEAD FREE, SOP-8 |
| 针数 | - | 8 | 8 | 8 | 8 |
| Reach Compliance Code | - | compli | compli | compli | compli |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大时钟频率 (fCLK) | - | 2 MHz | 2 MHz | 1.25 MHz | 1.25 MHz |
| 数据保留时间-最小值 | - | 40 | 40 | 40 | 40 |
| 耐久性 | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| JESD-30 代码 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | - | 5 mm | 4.9 mm | 5 mm | 4.9 mm |
| 内存密度 | - | 4096 bi | 4096 bi | 4096 bi | 4096 bi |
| 内存集成电路类型 | - | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | - | 16 | 16 | 16 | 16 |
| 功能数量 | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | 8 | 8 | 8 | 8 |
| 字数 | - | 256 words | 256 words | 256 words | 256 words |
| 字数代码 | - | 256 | 256 | 256 | 256 |
| 工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | - | 105 °C | 105 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | - | 256X16 | 256X16 | 256X16 | 256X16 |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | LSOP | SOP | LSOP | SOP |
| 封装等效代码 | - | SOP8,.25 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE |
| 并行/串行 | - | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 串行总线类型 | - | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
| 最大待机电流 | - | 0.000002 A | 0.000002 A | 0.000002 A | 0.000002 A |
| 最大压摆率 | - | 0.0045 mA | 0.0045 mA | 0.0045 mA | 0.0045 mA |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | - | 2.5 V | 2.5 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | - | 4 V | 4 V | 4 V | 4 V |
| 表面贴装 | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 4.4 mm | 3.9 mm | 4.4 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | - | 5 ms | 5 ms | 10 ms | 10 ms |
| 写保护 | - | SOFTWARE | SOFTWARE | SOFTWARE | SOFTWARE |
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