EEPROM EEPROM S I2C 64k
| 参数名称 | 属性值 |
| Brand Name | STMicroelectronics |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | 0.169 INCH, TSSOP-8 |
| 针数 | 8 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 25 weeks 5 days |
| 最大时钟频率 (fCLK) | 0.4 MHz |
| 数据保留时间-最小值 | 40 |
| 耐久性 | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 长度 | 4.4 mm |
| 内存密度 | 65536 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -20 °C |
| 组织 | 8KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP8,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 1.8/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 串行总线类型 | I2C |
| 最大待机电流 | 0.000001 A |
| 最大压摆率 | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| 写保护 | HARDWARE |
| M24C64-FDW5TP | M24C64-FCU6TP/TF | M24C64-DFCT6TP/K | M24C64-DFMC6TG | M24C64-FCS6TP/K | |
|---|---|---|---|---|---|
| 描述 | EEPROM EEPROM S I2C 64k | EEPROM 64-Kbit serial I2C bus EEPROM | EEPROM 64-Kbit Serial I2C 1MHz 2.5V to 5.5V | EEPROM 64 Kbit Serial I2C 1.7V to 5.5V EEPROM | EEPROM 64kB Serial I2C bus 1.7V 1MHz Fast Mode |
| Brand Name | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| 包装说明 | 0.169 INCH, TSSOP-8 | VFBGA, | VFBGA, | VSON, SOLCC8,.11,20 | VFBGA, BGA5,3X3,14/8 |
| Reach Compliance Code | not_compliant | compliant | compliant | compliant | compliant |
| 最大时钟频率 (fCLK) | 0.4 MHz | 0.4 MHz | 1 MHz | 1 MHz | 1 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PBGA-B4 | R-PBGA-B8 | R-PDSO-N8 | R-PBGA-B5 |
| 长度 | 4.4 mm | 0.795 mm | 1.073 mm | 3 mm | 1.073 mm |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 4 | 8 | 8 | 5 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -20 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | VFBGA | VFBGA | VSON | VFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 座面最大高度 | 1.2 mm | 0.345 mm | 0.33 mm | 0.6 mm | 0.6 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.6 V | 1.7 V | 1.7 V | 1.7 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | BALL | BALL | NO LEAD | BALL |
| 端子节距 | 0.65 mm | 0.4 mm | 0.4 mm | 0.5 mm | 0.2 mm |
| 端子位置 | DUAL | BOTTOM | BOTTOM | DUAL | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | 0.674 mm | 0.959 mm | 2 mm | 0.959 mm |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | - |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 25 weeks 5 days | - | 6 weeks | 12 weeks | 5 weeks |
| 数据保留时间-最小值 | 40 | - | - | 40 | 40 |
| 耐久性 | 1000000 Write/Erase Cycles | - | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C控制字节 | 1010DDDR | - | - | 1010DDDR | 1010DDDR |
| 封装等效代码 | TSSOP8,.25 | - | - | SOLCC8,.11,20 | BGA5,3X3,14/8 |
| 电源 | 1.8/5 V | - | - | 1.8/5 V | 1.8/5 V |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified |
| 最大待机电流 | 0.000001 A | - | - | 0.000001 A | 0.000001 A |
| 最大压摆率 | 0.003 mA | - | - | 0.003 mA | 0.003 mA |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | - | - |
| 写保护 | HARDWARE | - | - | HARDWARE | HARDWARE |
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