Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MK26FN2M0CAC18R

MK26FN2M0CAC18R: 产品描述ARM Microcontrollers - MCU 2M Flash 180MHz WLCSP 169; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小1MB，共92页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

下载文档详细参数选型对比全文预览文档解析

MK26FN2M0CAC18R在线购买

供应商	器件名称	价格	最低购买	库存
	MK26FN2M0CAC18R	-	-	点击查看	点击购买

MK26FN2M0CAC18R概述

ARM Microcontrollers - MCU 2M Flash 180MHz WLCSP 169

MK26FN2M0CAC18R规格参数

参数名称	属性值
Brand Name	Freescale
是否无铅	不含铅
是否Rohs认证	符合
包装说明	5.60 X 5.50 MM, 0.60 MM HEIGHT, 0.40 MM PITCH, WLCSP-169
Reach Compliance Code	compliant
Base Number Matches	1

文档解析

K26系列微控制器提供了多种内存选项，包括程序闪存（Program Flash）和FlexNVM内存。对于实时数据处理，通常需要快速读写能力和足够的存储空间来存储处理过程中的数据。

在K26系列微控制器的内存选项中，FlexNVM内存可能是最适合用于实时数据处理的类型。FlexNVM内存提供了一种灵活的存储解决方案，它可以被配置为包含程序闪存和数据存储，或者仅用于数据存储。这种内存的灵活性使其非常适合于需要快速数据存取和处理的应用场景。

FlexNVM内存的特点包括：

快速的读写速度，适合实时数据处理。
灵活的配置选项，可以根据需要分配为程序存储或数据存储。
高可靠性和耐用性，适合在各种操作条件下使用。

因此，如果你的应用需要快速处理和存储大量数据，并且对内存的读写速度有较高要求，那么FlexNVM内存是一个不错的选择。

文档预览

下载PDF文档

全文
预览

NXP Semiconductors

Data Sheet: Technical Data

K26P169M180SF5

Rev. 4, 04/2017

Kinetis K26 Sub-Family

180 MHz ARM® Cortex®-M4F Microcontroller.

MK26FN2M0VMD18

MK26FN2M0VMI18

MK26FN2M0VLQ18

MK26FN2M0CAC18R

The K26 sub-family members provide greater performance,

memory options up to 2 MB total flash and 256 KB of SRAM, as

well as higher peripheral integration with features such as Dual

USB. These devices maintain hardware and software

compatibility with the existing Kinetis family.

This product also offers:

• Integration of a High Speed USB Physical Transceiver

• Greater performance flexibility with a High Speed Run

mode

• Smarter peripherals with operation in Stop modes

144 MAPBGA (MD)

144 LQFP (LQ)

13 mm x 13 mm Pitch 1 20 mm x 20 mm Pitch

0.5 mm

169 MAPBGA (MI)

9 mm x 9 mm Pitch

0.65 mm

169 WLCSP (AC)

5.6 mm x 5.5 mm Pitch

0.4 mm

Performance

• Up to 180 MHz ARM Cortex-M4 based core with DSP

instructions and Single Precision Floating Point unit

System and Clocks

• Multiple low-power modes to provide power

optimization based on application requirements

• Memory protection unit with multi-master protection

Memories and memory expansion

• 3 to 32 MHz main crystal oscillator

• Up to 2 MB program flash memory on non-FlexMemory

• 32 kHz low power crystal oscillator

devices with 256 KB RAM

• 48 MHz internal reference

• Up to 1 MB program flash memory and 256 KB of

Security

FlexNVM on FlexMemory devices

• 4 KB FlexRAM on FlexMemory devices

• Hardware random-number generator

• FlexBus external bus interface and SDRAM controller

• Supports DES, AES, SHA accelerator (CAU)

• Multiple levels of embedded flash security

Analog modules

Timers

• Two 16-bit SAR ADCs and two 12-bit DAC

• Four analog comparators (CMP) containing a 6-bit

• Four Periodic interrupt timers

DAC and programmable reference input

• 16-bit low-power timer

• Voltage reference 1.2V

• Two 16-bit low-power timer PWM modules

• Two 8-channel motor control/general purpose/PWM

Communication interfaces

timers

• USB high-/full-/low-speed On-the-Go with on-chip high

• Two 2-ch quad decoder/general purpose timers

speed transceiver

• Real-time clock

• USB full-/low-speed OTG with on-chip transceiver

Operating Characteristics

• Two CAN, three SPI and four I2C modules

• Low Power Universal Asynchronous Receiver/

• Voltage/Flash write voltage range:1.71 to 3.6 V

Transmitter 0 (LPUART0) and five standard UARTs

• V-Temperature range (ambient): -40 to 105°C

• Secure Digital Host Controller (SDHC)

• C-Temperature range (ambient): -40 to 85°C

• I2S module

Human-machine interface

• Low-power hardware touch sensor interface (TSI)

• General-purpose input/output

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 6

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................7

2.2.1

Voltage and current operating requirements.....7

2.2.2

LVD and POR operating requirements............. 8

2.2.3

Voltage and current operating behaviors.......... 9

2.2.4

Power mode transition operating behaviors......10

2.2.5

Power consumption operating behaviors.......... 12

2.2.6

EMC radiated emissions operating behaviors...17

2.2.7

Designing with radiated emissions in mind....... 18

2.2.8

Capacitance attributes...................................... 18

2.3 Switching specifications...................................................18

2.3.1

Device clock specifications............................... 18

2.3.2

General switching specifications....................... 19

2.4 Thermal specifications..................................................... 20

2.4.1

Thermal operating requirements....................... 20

2.4.2

Thermal attributes............................................. 20

3 Peripheral operating requirements and behaviors.................. 22

3.1 Core modules.................................................................. 22

3.1.1

Debug trace timing specifications..................... 22

3.1.2

JTAG electricals................................................ 23

3.2 System modules.............................................................. 26

3.3 Clock modules................................................................. 26

3.3.1

MCG specifications........................................... 26

3.3.2

IRC48M specifications...................................... 29

3.3.3

Oscillator electrical specifications..................... 30

3.3.4

32 kHz oscillator electrical characteristics.........32

3.4 Memories and memory interfaces................................... 33

3.4.1

Flash (FTFE) electrical specifications............... 33

3.4.2

EzPort switching specifications......................... 38

3.4.3

Flexbus switching specifications....................... 38

3.4.4

SDRAM controller specifications.......................41

3.5 Analog............................................................................. 44

3.5.1

ADC electrical specifications.............................44

3.5.2

CMP and 6-bit DAC electrical specifications.....48

3.5.3

12-bit DAC electrical characteristics................. 51

3.5.4

Voltage reference electrical specifications........ 54

3.6 Timers..............................................................................55

3.7 Communication interfaces............................................... 55

3.7.1

3.7.2

3.7.3

3.7.4

3.7.5

3.7.6

USB Voltage Regulator Electrical

Specifications.................................................... 56

USB Full Speed Transceiver and High Speed

PHY specifications............................................ 57

USB DCD electrical specifications.................... 57

CAN switching specifications............................ 58

DSPI switching specifications (limited voltage

range)................................................................58

DSPI switching specifications (full voltage

range)................................................................60

3.7.7

Inter-Integrated Circuit Interface (I2C) timing....61

3.7.8

UART switching specifications.......................... 63

3.7.9

Low Power UART switching specifications....... 63

3.7.10 SDHC specifications......................................... 63

3.7.11 I2S switching specifications.............................. 65

3.8 Human-machine interfaces (HMI)....................................71

3.8.1

TSI electrical specifications...............................71

4 Dimensions............................................................................. 71

4.1 Obtaining package dimensions....................................... 71

5 Pinout...................................................................................... 72

5.1 MK26 Signal Multiplexing and Pin Assignments..............72

5.2 Recommended connection for unused analog and

digital pins........................................................................81

5.3 MK26 Pinouts.................................................................. 82

6 Ordering parts......................................................................... 86

6.1 Determining valid orderable parts....................................86

7 Part identification.....................................................................87

7.1 Description.......................................................................87

7.2 Format............................................................................. 87

7.3 Fields............................................................................... 87

7.4 Example...........................................................................88

8 Terminology and guidelines.................................................... 88

8.1 Definitions........................................................................ 88

8.2 Examples......................................................................... 89

8.3 Typical-value conditions.................................................. 89

8.4 Relationship between ratings and operating

requirements....................................................................90

8.5 Guidelines for ratings and operating requirements..........90

9 Revision History...................................................................... 90