Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MK26FN2M0VLQ18

MK26FN2M0VLQ18: 产品描述ARM Microcontrollers - MCU 2 MB Flash 180MHz USB QFP 144; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小1MB，共92页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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MK26FN2M0VLQ18概述

ARM Microcontrollers - MCU 2 MB Flash 180MHz USB QFP 144

MK26FN2M0VLQ18规格参数

参数名称	属性值
Brand Name	Freescale
是否无铅	不含铅
是否Rohs认证	符合
包装说明	20 X 20 MM, 1.60 MM HEIGHT, 0.50 MM PITCH, LQFP-144
Reach Compliance Code	compliant
Base Number Matches	1

文档解析

这份文档是关于Kinetis K26系列微控制器的数据手册，提供了详细的技术规格和特性描述。以下是一些值得关注的技术信息：

处理器性能：K26子系列成员提供了高达180 MHz的ARM Cortex-M4F核心，具备DSP指令和单精度浮点单元，以及高性能的灵活性。
内存选项：提供高达2MB的程序闪存和256KB的SRAM，以及FlexMemory设备上高达1MB的程序闪存和256KB的FlexNVM。
外设集成：包括双USB、两个16位SAR ADCs、两个12位DAC、四个模拟比较器、两个CAN、三个SPI和四个I2C模块等。
通信接口：支持USB高/全/低速OTG、SDHC、I2S模块等。
系统和时钟：具备多种低功耗模式，内存保护单元，以及多种晶体振荡器选项。
安全性：包括硬件随机数生成器、支持DES、AES、SHA加速器等。
定时器：包括多个周期性中断定时器、低功耗定时器、PWM模块等。
操作特性：包括电压/闪存写入电压范围、温度范围等。
人机界面：包括低功耗硬件触摸传感器接口和通用输入/输出。
封装选项：提供了多种封装类型，如144 MAPBGA、144 LQFP、169 MAPBGA、169 WLCSP等。
订购信息：提供了如何确认当前可订购零件号的方法。
相关资源：包括选择指南、参考手册、数据表、芯片错误等。
内存和内存接口、模拟模块、通信接口、安全、定时器等各部分的详细电气特性。
修订历史：记录了文档的修订历史，包括日期和主要变更。

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NXP Semiconductors

Data Sheet: Technical Data

K26P169M180SF5

Rev. 4, 04/2017

Kinetis K26 Sub-Family

180 MHz ARM® Cortex®-M4F Microcontroller.

MK26FN2M0VMD18

MK26FN2M0VMI18

MK26FN2M0VLQ18

MK26FN2M0CAC18R

The K26 sub-family members provide greater performance,

memory options up to 2 MB total flash and 256 KB of SRAM, as

well as higher peripheral integration with features such as Dual

USB. These devices maintain hardware and software

compatibility with the existing Kinetis family.

This product also offers:

• Integration of a High Speed USB Physical Transceiver

• Greater performance flexibility with a High Speed Run

mode

• Smarter peripherals with operation in Stop modes

144 MAPBGA (MD)

144 LQFP (LQ)

13 mm x 13 mm Pitch 1 20 mm x 20 mm Pitch

0.5 mm

169 MAPBGA (MI)

9 mm x 9 mm Pitch

0.65 mm

169 WLCSP (AC)

5.6 mm x 5.5 mm Pitch

0.4 mm

Performance

• Up to 180 MHz ARM Cortex-M4 based core with DSP

instructions and Single Precision Floating Point unit

System and Clocks

• Multiple low-power modes to provide power

optimization based on application requirements

• Memory protection unit with multi-master protection

Memories and memory expansion

• 3 to 32 MHz main crystal oscillator

• Up to 2 MB program flash memory on non-FlexMemory

• 32 kHz low power crystal oscillator

devices with 256 KB RAM

• 48 MHz internal reference

• Up to 1 MB program flash memory and 256 KB of

Security

FlexNVM on FlexMemory devices

• 4 KB FlexRAM on FlexMemory devices

• Hardware random-number generator

• FlexBus external bus interface and SDRAM controller

• Supports DES, AES, SHA accelerator (CAU)

• Multiple levels of embedded flash security

Analog modules

Timers

• Two 16-bit SAR ADCs and two 12-bit DAC

• Four analog comparators (CMP) containing a 6-bit

• Four Periodic interrupt timers

DAC and programmable reference input

• 16-bit low-power timer

• Voltage reference 1.2V

• Two 16-bit low-power timer PWM modules

• Two 8-channel motor control/general purpose/PWM

Communication interfaces

timers

• USB high-/full-/low-speed On-the-Go with on-chip high

• Two 2-ch quad decoder/general purpose timers

speed transceiver

• Real-time clock

• USB full-/low-speed OTG with on-chip transceiver

Operating Characteristics

• Two CAN, three SPI and four I2C modules

• Low Power Universal Asynchronous Receiver/

• Voltage/Flash write voltage range:1.71 to 3.6 V

Transmitter 0 (LPUART0) and five standard UARTs

• V-Temperature range (ambient): -40 to 105°C

• Secure Digital Host Controller (SDHC)

• C-Temperature range (ambient): -40 to 85°C

• I2S module

Human-machine interface

• Low-power hardware touch sensor interface (TSI)

• General-purpose input/output

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 6

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................7

2.2.1

Voltage and current operating requirements.....7

2.2.2

LVD and POR operating requirements............. 8

2.2.3

Voltage and current operating behaviors.......... 9

2.2.4

Power mode transition operating behaviors......10

2.2.5

Power consumption operating behaviors.......... 12

2.2.6

EMC radiated emissions operating behaviors...17

2.2.7

Designing with radiated emissions in mind....... 18

2.2.8

Capacitance attributes...................................... 18

2.3 Switching specifications...................................................18

2.3.1

Device clock specifications............................... 18

2.3.2

General switching specifications....................... 19

2.4 Thermal specifications..................................................... 20

2.4.1

Thermal operating requirements....................... 20

2.4.2

Thermal attributes............................................. 20

3 Peripheral operating requirements and behaviors.................. 22

3.1 Core modules.................................................................. 22

3.1.1

Debug trace timing specifications..................... 22

3.1.2

JTAG electricals................................................ 23

3.2 System modules.............................................................. 26

3.3 Clock modules................................................................. 26

3.3.1

MCG specifications........................................... 26

3.3.2

IRC48M specifications...................................... 29

3.3.3

Oscillator electrical specifications..................... 30

3.3.4

32 kHz oscillator electrical characteristics.........32

3.4 Memories and memory interfaces................................... 33

3.4.1

Flash (FTFE) electrical specifications............... 33

3.4.2

EzPort switching specifications......................... 38

3.4.3

Flexbus switching specifications....................... 38

3.4.4

SDRAM controller specifications.......................41

3.5 Analog............................................................................. 44

3.5.1

ADC electrical specifications.............................44

3.5.2

CMP and 6-bit DAC electrical specifications.....48

3.5.3

12-bit DAC electrical characteristics................. 51

3.5.4

Voltage reference electrical specifications........ 54

3.6 Timers..............................................................................55

3.7 Communication interfaces............................................... 55

3.7.1

3.7.2

3.7.3

3.7.4

3.7.5

3.7.6

USB Voltage Regulator Electrical

Specifications.................................................... 56

USB Full Speed Transceiver and High Speed

PHY specifications............................................ 57

USB DCD electrical specifications.................... 57

CAN switching specifications............................ 58

DSPI switching specifications (limited voltage

range)................................................................58

DSPI switching specifications (full voltage

range)................................................................60

3.7.7

Inter-Integrated Circuit Interface (I2C) timing....61

3.7.8

UART switching specifications.......................... 63

3.7.9

Low Power UART switching specifications....... 63

3.7.10 SDHC specifications......................................... 63

3.7.11 I2S switching specifications.............................. 65

3.8 Human-machine interfaces (HMI)....................................71

3.8.1

TSI electrical specifications...............................71

4 Dimensions............................................................................. 71

4.1 Obtaining package dimensions....................................... 71

5 Pinout...................................................................................... 72

5.1 MK26 Signal Multiplexing and Pin Assignments..............72

5.2 Recommended connection for unused analog and

digital pins........................................................................81

5.3 MK26 Pinouts.................................................................. 82

6 Ordering parts......................................................................... 86

6.1 Determining valid orderable parts....................................86

7 Part identification.....................................................................87

7.1 Description.......................................................................87

7.2 Format............................................................................. 87

7.3 Fields............................................................................... 87

7.4 Example...........................................................................88

8 Terminology and guidelines.................................................... 88

8.1 Definitions........................................................................ 88

8.2 Examples......................................................................... 89

8.3 Typical-value conditions.................................................. 89

8.4 Relationship between ratings and operating

requirements....................................................................90

8.5 Guidelines for ratings and operating requirements..........90

9 Revision History...................................................................... 90