STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM
| 参数名称 | 属性值 |
| 厂商名称 | AMD(超微) |
| 包装说明 | FBGA, BGA88,10X12,32 |
| Reach Compliance Code | compli |
| 最长访问时间 | 85 ns |
| JESD-30 代码 | R-PBGA-B88 |
| 内存集成电路类型 | MEMORY CIRCUIT |
| 混合内存类型 | FLASH+PSRAM |
| 端子数量 | 88 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装等效代码 | BGA88,10X12,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 电源 | 3 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.000005 A |
| 最大压摆率 | 0.045 mA |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| AM50DL128CH85IS | AM50DL128CH | AM50DL128CH70IS | AM50DL128CH56IS | AM50DL128CH56IT | AM50DL128CH70IT | AM50DL128CH85IT | |
|---|---|---|---|---|---|---|---|
| 描述 | STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM | STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM | STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM | STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM | STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM | STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM | STACKED MULTI-CHIP PACKAGE (MCP) FLASH MEMORY AND SRAM |
| 厂商名称 | AMD(超微) | - | AMD(超微) | AMD(超微) | - | AMD(超微) | AMD(超微) |
| 包装说明 | FBGA, BGA88,10X12,32 | - | FBGA, BGA88,10X12,32 | FBGA, BGA88,10X12,32 | FBGA, BGA88,10X12,32 | FBGA, BGA88,10X12,32 | FBGA, BGA88,10X12,32 |
| Reach Compliance Code | compli | - | compli | compli | compli | compli | compli |
| 最长访问时间 | 85 ns | - | 70 ns | 55 ns | 55 ns | 70 ns | 85 ns |
| JESD-30 代码 | R-PBGA-B88 | - | R-PBGA-B88 | R-PBGA-B88 | R-PBGA-B88 | R-PBGA-B88 | R-PBGA-B88 |
| 内存集成电路类型 | MEMORY CIRCUIT | - | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 混合内存类型 | FLASH+PSRAM | - | FLASH+PSRAM | FLASH+PSRAM | FLASH+PSRAM | FLASH+PSRAM | FLASH+PSRAM |
| 端子数量 | 88 | - | 88 | 88 | 88 | 88 | 88 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | - | FBGA | FBGA | FBGA | FBGA | FBGA |
| 封装等效代码 | BGA88,10X12,32 | - | BGA88,10X12,32 | BGA88,10X12,32 | BGA88,10X12,32 | BGA88,10X12,32 | BGA88,10X12,32 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, FINE PITCH | - | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
| 电源 | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.000005 A | - | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.000005 A |
| 最大压摆率 | 0.045 mA | - | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA | 0.045 mA |
| 标称供电电压 (Vsup) | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | - | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
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