SRAM 4M X36 2.5V I/O SLOW ZBT
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | TQFP |
| 包装说明 | LQFP, QFP100,.63X.87 |
| 针数 | 100 |
| 制造商包装代码 | PKG100 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.A |
| Samacsys Description | TQFP 14.0 X 20.0 X 1.4 MM |
| 最长访问时间 | 3.8 ns |
| 其他特性 | PIPELINED ARCHITECTURE |
| 最大时钟频率 (fCLK) | 150 MHz |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PQFP-G100 |
| JESD-609代码 | e3 |
| 长度 | 20 mm |
| 内存密度 | 4718592 bit |
| 内存集成电路类型 | ZBT SRAM |
| 内存宽度 | 36 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 100 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 128KX36 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装等效代码 | QFP100,.63X.87 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.5,3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大待机电流 | 0.04 A |
| 最小待机电流 | 3.14 V |
| 最大压摆率 | 0.325 mA |
| 最大供电电压 (Vsup) | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 14 mm |
| Base Number Matches | 1 |
| 71V2546S150PFG8 | 71V2546S133PFG | 71V2546S100PFG8 | 71V2546S100BGI8 | 71V2546S133PFG8 | 71V2546S100PFG | 71V2546S133BG8 | |
|---|---|---|---|---|---|---|---|
| 描述 | SRAM 4M X36 2.5V I/O SLOW ZBT | SRAM 4M X36 2.5V I/O SLOW ZBT | SRAM 4M X36 2.5V I/O SLOW ZBT | SRAM 4MEG ZBT W/ 2.5V I/O | SRAM 4M X36 2.5V I/O SLOW ZBT | SRAM 4M X36 2.5V I/O SLOW ZBT | SRAM 4MEG ZBT W/ 2.5V I/O |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | TQFP | TQFP | TQFP | PBGA | TQFP | TQFP | PBGA |
| 包装说明 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | BGA, BGA119,7X17,50 | LQFP, QFP100,.63X.87 | LQFP, QFP100,.63X.87 | BGA, BGA119,7X17,50 |
| 针数 | 100 | 100 | 100 | 119 | 100 | 100 | 119 |
| 制造商包装代码 | PKG100 | PKG100 | PKG100 | BG119 | PKG100 | PKG100 | BG119 |
| Reach Compliance Code | compliant | compliant | compliant | not_compliant | compliant | compliant | not_compliant |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 3.8 ns | 4.2 ns | 5 ns | 5 ns | 4.2 ns | 5 ns | 4.2 ns |
| 其他特性 | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE |
| 最大时钟频率 (fCLK) | 150 MHz | 133 MHz | 100 MHz | 100 MHz | 133 MHz | 100 MHz | 133 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PBGA-B119 | R-PQFP-G100 | R-PQFP-G100 | R-PBGA-B119 |
| JESD-609代码 | e3 | e3 | e3 | e0 | e3 | e3 | e0 |
| 长度 | 20 mm | 20 mm | 20 mm | 22 mm | 20 mm | 20 mm | 22 mm |
| 内存密度 | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit |
| 内存集成电路类型 | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM |
| 内存宽度 | 36 | 36 | 36 | 36 | 36 | 36 | 36 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 100 | 100 | 119 | 100 | 100 | 119 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 128KX36 | 128KX36 | 128KX36 | 128KX36 | 128KX36 | 128KX36 | 128KX36 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | LQFP | LQFP | BGA | LQFP | LQFP | BGA |
| 封装等效代码 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | BGA119,7X17,50 | QFP100,.63X.87 | QFP100,.63X.87 | BGA119,7X17,50 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | GRID ARRAY | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | GRID ARRAY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 225 | 260 | 260 | 225 |
| 电源 | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 2.36 mm | 1.6 mm | 1.6 mm | 2.36 mm |
| 最大待机电流 | 0.04 A | 0.04 A | 0.04 A | 0.045 A | 0.04 A | 0.04 A | 0.04 A |
| 最小待机电流 | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| 最大压摆率 | 0.325 mA | 0.3 mA | 0.25 mA | 0.25 mA | 0.3 mA | 0.25 mA | 0.3 mA |
| 最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | OTHER | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Tin/Lead (Sn63Pb37) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Tin/Lead (Sn63Pb37) |
| 端子形式 | GULL WING | GULL WING | GULL WING | BALL | GULL WING | GULL WING | BALL |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | BOTTOM | QUAD | QUAD | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 20 | 30 | 30 | 20 |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Samacsys Description | TQFP 14.0 X 20.0 X 1.4 MM | TQFP 14.0 X 20.0 X 1.4 MM | TQFP 14.0 X 20.0 X 1.4 MM | - | TQFP 14.0 X 20.0 X 1.4 MM | TQFP 14.0 X 20.0 X 1.4 MM | PBGA 14. X 22.0 MM X 1.27 MM PITCH |
RF/无线
stm32/stm8
微控制器 MCU
Microchip MCU
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