Gate Drivers Secondary Side Synch Rectifier Driver
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | TSSOP |
| 包装说明 | HTSSOP, |
| 针数 | 28 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER |
| 控制技术 | PULSE WIDTH MODULATION |
| 最大输入电压 | 28 V |
| 最小输入电压 | 4.5 V |
| 标称输入电压 | 12 V |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e3 |
| 长度 | 9.7 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 最大输出电流 | 5 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HTSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 表面贴装 | YES |
| 切换器配置 | PUSH-PULL |
| 技术 | BICMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4.4 mm |
| Base Number Matches | 1 |
| MAX5059AUI+ | MAX5058AUI+ | MAX5059EUI-T | MAX5058EUI-T | MAX5058EUI | MAX5058AUI+T | MAX5059EUI+T | MAX5059EUI | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Gate Drivers Secondary Side Synch Rectifier Driver | Gate Drivers Secondary Side Synch Rectifier Driver | Gate Drivers Secondary Side Synch Rectifier Driver | Gate Drivers Secondary Side Synch Rectifier Driver | Gate Drivers Secondary Side Synch Rectifier Driver | Gate Drivers Secondary Side Synch Rectifier Driver | Gate Drivers Secondary Side Synch Rectifier Driver | Gate Drivers Secondary Side Synch Rectifier Driver |
| 是否无铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 包装说明 | HTSSOP, | HTSSOP, | HTSSOP, | HTSSOP, | 4.40 MM, MO-153, TSSOP-28 | HTSSOP, | HTSSOP, | 4.40 MM, MO-153, TSSOP-28 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | not_compliant | compliant | compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER | SWITCHING CONTROLLER |
| 控制技术 | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION |
| 最大输入电压 | 28 V | 28 V | 28 V | 28 V | 28 V | 28 V | 28 V | 28 V |
| 最小输入电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称输入电压 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
| JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 |
| JESD-609代码 | e3 | e3 | e0 | e0 | e0 | e3 | e3 | e0 |
| 长度 | 9.7 mm | 9.7 mm | 9.7 mm | 9.7 mm | 9.7 mm | 9.7 mm | 9.7 mm | 9.7 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 最大输出电流 | 5 A | 5 A | 5 A | 5 A | 5 A | 5 A | 5 A | 5 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HTSSOP | HTSSOP | HTSSOP | HTSSOP | HTSSOP | HTSSOP | HTSSOP | HTSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 245 | 245 | 245 | 260 | 260 | 245 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 切换器配置 | PUSH-PULL | PUSH-PULL | PUSH-PULL | PUSH-PULL | PUSH-PULL | PUSH-PULL | PUSH-PULL | PUSH-PULL |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | TIN LEAD | TIN LEAD | Tin/Lead (Sn85Pb15) | MATTE TIN | MATTE TIN | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm | 4.4 mm |
| Is Samacsys | N | - | N | N | N | - | N | N |
| Base Number Matches | 1 | - | 1 | 1 | 1 | - | 1 | 1 |
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