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IS66WVH8M8BLL-100B1LI-TR

产品描述SRAM 64Mb 8Mbx8 3.0V 100MHz HyperRAM
产品类别存储   
文件大小2MB,共65页
制造商ISSI(芯成半导体)
官网地址http://www.issi.com/
标准
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IS66WVH8M8BLL-100B1LI-TR概述

SRAM 64Mb 8Mbx8 3.0V 100MHz HyperRAM

IS66WVH8M8BLL-100B1LI-TR规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
ISSI(芯成半导体)
产品种类
Product Category
SRAM
RoHSDetails
封装 / 箱体
Package / Case
FBGA-24
Moisture SensitiveYes
工厂包装数量
Factory Pack Quantity
2500

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IS66WVH8M8ALL/BLL
IS67WVH8M8ALL/BLL
8M x 8 HyperRAM™
AUGUST
2016
Overview
The IS66/67WVH8M8ALL/BLL are integrated memory device containing 64Mbit Pseudo Static Random
Access Memory using a self-refresh DRAM array organized as 8M words by 8 bits. The device supports a
HyperBus interface, Very Low Signal Count (Address, Command and data through 8 DQ pins),
Hidden
Refresh Operation, and Automotive Temperature Operation, designed specially for Mobile and
Automotive applications.
Distinctive Characteristics
HyperBus
TM
Low Signal Count Interface
3.0V I/O, 11 bus signals
– Single ended clock (CK)
High Performance
Up to 333MB/s
Double-Data Rate (DDR) - two data transfers per clock
166-MHz clock rate (333 MB/s) at 1.8V V
CC
100-MHz clock rate (200 MB/s) at 3.0V V
CC
Sequential burst transactions
Configurable Burst Characteristics
– Wrapped burst lengths:
– 16 bytes (8 clocks)
– 32 bytes (16 clocks)
– 64 bytes (32 clocks)
– 128 bytes (64 clocks)
– Linear burst
– Hybrid option - one wrapped burst followed by linear burst
– Wrapped or linear burst type selected in each transaction
– Configurable output drive strength
1.8V I/O, 12 bus signals
– Differential clock (CK, CK#)
Chip Select (CS#)
8-bit data bus (DQ[7:0])
Read-Write Data Strobe (RWDS)
Bidirectional Data Strobe / Mask
Output at the start of all transactions to indicate refresh latency
Output during read transactions as Read Data Strobe
Input during write transactions as Write Data Mask
RESET#
CS#
CK
CK#
V
CC
V
CC
Q
DQ[7:0]
RWDS
Package and Die Options
– 25-ball FBGA footprint
– 24-ball FBGA footprint
V
SS
V
SS
Q
Copyright © 2016 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI
assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device
specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be
expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated
Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.- www.issi.com
Rev.A
06/28/2016
1

IS66WVH8M8BLL-100B1LI-TR相似产品对比

IS66WVH8M8BLL-100B1LI-TR IS66WVH8M8ALL-166B1LI-TR IS66WVH8M8BLL-100B1LI
描述 SRAM 64Mb 8Mbx8 3.0V 100MHz HyperRAM SRAM 64Mb 8Mbx8 1.8V 166MHz HyperRAM SRAM 64Mb 8Mbx8 3.0V 100MHz HyperRAM
Product Attribute Attribute Value Attribute Value Attribute Value
制造商
Manufacturer
ISSI(芯成半导体) ISSI(芯成半导体) ISSI(芯成半导体)
产品种类
Product Category
SRAM SRAM SRAM
RoHS Details Details Details
封装 / 箱体
Package / Case
FBGA-24 FBGA-24 TFGBA-24
Moisture Sensitive Yes Yes Yes
工厂包装数量
Factory Pack Quantity
2500 2500 480
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