Interface Development Tools XRA1201PIL24-0A-EB
| 参数名称 | 属性值 |
| Product Attribute | Attribute Value |
| 制造商 Manufacturer | Exar |
| 产品种类 Product Category | Interface Development Tools |
| RoHS | Details |
| 系列 Packaging | Bulk |
| 工厂包装数量 Factory Pack Quantity | 1 |
| XRA1201PIL24-0A-EB | XRA1201IL24TR-F | XRA1201PIG24-0A-EB | XRA1201IG24TR-F | XRA1201IL24-F | XRA1201PIL24TR-F | |
|---|---|---|---|---|---|---|
| 描述 | Interface Development Tools XRA1201PIL24-0A-EB | Interface - I/O Expanders 16 Bit I2C SMBus GPIO Expander | Interface Development Tools XRA1201PIG24-0A-EB | Interface - I/O Expanders 16 Bit I2C SMBus GPIO Expander | Interface - I/O Expanders 16 Bit I2C SMBus GPIO Expander | Interface - I/O Expanders 16 Bit I2C SMBus GPIO Expander |
| 是否无铅 | - | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | - | 符合 | 符合 | 符合 |
| 厂商名称 | - | Exar | - | Exar | Exar | Exar |
| 零件包装代码 | - | QFN | - | TSSOP | QFN | QFN |
| 包装说明 | - | HVQCCN, LCC24,.16SQ,20 | - | TSSOP, TSSOP24,.25 | HVQCCN, LCC24,.16SQ,20 | HVQCCN, LCC24,.16SQ,20 |
| 针数 | - | 24 | - | 24 | 24 | 24 |
| Reach Compliance Code | - | compliant | - | compliant | compliant | compliant |
| ECCN代码 | - | EAR99 | - | EAR99 | EAR99 | EAR99 |
| JESD-30 代码 | - | S-XQCC-N24 | - | R-PDSO-G24 | S-XQCC-N24 | S-XQCC-N24 |
| JESD-609代码 | - | e3 | - | e3 | e3 | e3 |
| 长度 | - | 4 mm | - | 7.8 mm | 4 mm | 4 mm |
| 湿度敏感等级 | - | 2 | - | 1 | 2 | 2 |
| 位数 | - | 16 | - | 16 | 16 | 16 |
| I/O 线路数量 | - | 16 | - | 16 | 16 | 16 |
| 端口数量 | - | 2 | - | 2 | 2 | 2 |
| 端子数量 | - | 24 | - | 24 | 24 | 24 |
| 最高工作温度 | - | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | UNSPECIFIED | - | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | - | HVQCCN | - | TSSOP | HVQCCN | HVQCCN |
| 封装等效代码 | - | LCC24,.16SQ,20 | - | TSSOP24,.25 | LCC24,.16SQ,20 | LCC24,.16SQ,20 |
| 封装形状 | - | SQUARE | - | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | - | 260 | - | 260 | 260 | 260 |
| 电源 | - | 1.8/3.3 V | - | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1 mm | - | 1.2 mm | 1 mm | 1 mm |
| 最大供电电压 | - | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | - | 1.65 V | - | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 | - | 1.8 V | - | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | - | YES | - | YES | YES | YES |
| 技术 | - | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | - | NO LEAD | - | GULL WING | NO LEAD | NO LEAD |
| 端子节距 | - | 0.5 mm | - | 0.65 mm | 0.5 mm | 0.5 mm |
| 端子位置 | - | QUAD | - | DUAL | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | - | 40 | - | 40 | 40 | 40 |
| 宽度 | - | 4 mm | - | 4.4 mm | 4 mm | 4 mm |
| uPs/uCs/外围集成电路类型 | - | PARALLEL IO PORT, GENERAL PURPOSE | - | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE | PARALLEL IO PORT, GENERAL PURPOSE |
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