product brief
Intel® Solid State Drive Data Center Family for PCIe®
Consistently Amazing
Make the Switch to Faster Data
Deliver breakthrough performance with Intel PCIe Solid State Drives.
Breakthrough Performance
1
The Intel® Solid State Drive (SSD) Data
Center Family for PCIe brings extreme
data throughput directly to Intel® Xeon®
processors with up to six times faster
data transfer speed than 6 Gbps SAS/
SATA SSDs.The Intel SSD Data Center
Family for PCIe is capable of reading data
up to 2.8GB/s and 460k Input/Output
Operations Per Second (IOPS) and writ-
ing up to 2.0GB/s and 175k IOPS.
The performance of a single drive from
the Intel SSD Data Center Family for
PCIe, specifically the Intel® SSD DC
P3700 Series (460K IOPS), can replace
the performance of 7 SATA SSDs
aggregated through an HBA (~500K
IOPS). At 200 IOPS per Hard Disk Drive
(HDD), 2,300 15K HDDs would be needed
to match the performance of one Intel
SSD Data Center Family for PCIe device.
(HET) enables the Intel DC P3700 Series to
achieve 17 drive writes per day over a five
year drive life.
Modernize Data Center Storage
NVMe is engineered for current and future
Non-Volatile Memory (NVM) technologies,
unlike SAS/SATA SSDs. NVMe overcomes
SAS/SATA SSD performance limitations
by optimizing hardware and software to
take full advantage of NVM SSD technol-
ogy. Intel Xeon processors efficiently
transfer data in fewer clock cycles with the
NVMe optimized software stack compared
to the legacy Advance Host Controller
Interface (AHCI) stack, reducing latency
and overhead. Direct CPU connection also
eliminates Host-Bus-Adapter (HBA) cards,
further reducing latency and TCO.
Comprehensive Solution
Intel‘s product line enables extensive
system compatibility, completes
numerous industry standard compliance
certifications, and delivers Intel drivers,
supporting industry driver development.
The Intel SSD Data Center Family for
PCIe includes the Intel Solid State Drive
DC P3700, P3600, and P3500 Series
providing a full range of endurance up to
17 full-capacity writes per day, capacity
up to 2TB, and 2.5-inch and Add-in-
Card (AIC) form factors. Intel-enabled
NVMe software drivers are provided
by major operating system vendors
including Microsoft* Server 2012 and
2008, Windows* 7, 8, and 8.1 Red Hat*
7.0/6.6/6.5, SLES* 11 SP3, UEFI* 2.3.1,
and the Linux* Open Source development
community. The new 2.5-inch form
factor with hot-swap capability provides
convenient front panel serviceability
allowing quick, uninterrupted installation.
The AIC form factor conveniently fits in
half-height, half-length (HHHL) slots.
Non-Volatile Memory Storage Solutions
Servers can now support more
users simultaneously, compute on
larger data sets, and address high-
performance computing at lower
Total Cost of Ownership (TCO).1
Intel® SSD Data Center Tool provides
a powerful set of management
capabilities.
Intel led the industry in creation of a
new Non-Volatile Memory Express*
(NVMe™) storage interface standard.
Intel is driving transition to NVMe
SSDs by providing a comprehensive
product line.
For more information, visit
www.intel.com/
design/flash/nand/managessd.htm
Intel SSD Data Center Family for PCIe’s
consistently amazing performance
provides fast, unwavering data streams
directly to Intel Xeon processors mak-
ing server data transfers efficient. SSD
performance consistency provides
scalable throughput when multiple SSDs
are unified into a single storage volume.
The massive storage bandwidth increase
feeds Intel Xeon processor systems giv-
ing data center servers a performance
boost.
Proven Quality and Reliability
Intel SSD Data Center Family for PCIe
devices are based on Intel-developed
controller, firmware, and leading manu-
facturing process NAND flash memory.
Rigorous qualification and compatibility
testing ensures a highly reliable SSD.
By combin-ing SSD NAND management
techniques and NAND silicon enhance-
ments, High Endurance Technology
Intel® Solid State Drive Data Center Family for PCIe®
2
TECHNICAL SPECIFICATIONS
1
PRODUCT FAMILY
INTEL® SOLID STATE DRIVE DATA CENTER FAMILY FOR PCIe®
SERIES NAME
Capacities
Sequential
Sustained
Random I/O
Operations
Read
Write
Read
Write
INTEL® SSD DC P3500 SERIES
400GB, 1.2TB, 2TB
Up to 2500
Up to 1700
Up to 450
Up to 35
Up to 85
INTEL® SSD DC P3600 SERIES
400GB, 800GB, 1.2TB, 1.6TB, 2TB
Up to 2600
Up to 1700
Up to 450
Up to 56
Up to 160
INTEL® SSD DC P3700 SERIES
400GB, 800GB, 1.6TB, 2TB
Up to 2800
Up to 2000
Up to 460
Up to 175
Up to 265
Performance
2,3
(MB/s)
70/30 Read/Write
per Second 4KB
K-IOPS
2, 3
Lifetime Endurance
4
Latency
5
Up to:
0.3 Drive Writes Per Day
3 Drive Writes Per Day
20µs / 20µs
17 Drive Writes Per Day
Read/Write
2.5-inch
15mm/up to 125 grams
Active: <25W (Write) / <11W (Read)
Interface
Form Factor
Height / Weight
Life Expectancy
Power Consumption
6
NAND Flash Memory
Operating Temperature
7
RoHS Compliance
Software Support
Product Ordering
Non-Volatile Memory express (NVMe™) PCIe 3.0 x4
AIC
Half-Height Half-Length (HHHL)/195 grams
Idle: 4W
Typical
2 million hours Mean Time Between Failures (MTBF), 230 years
Intel® NAND Flash Memory Multi-Level Cell (MLC) 20nm
2.5-inch FF:
0° C to 35° C ambient temperature with suggested airflow, 0° to 70° C case temperature
AIC:
0° C to 55° C ambient temperature with suggested airflow
Meets the requirements of European Union (EU) RoHS Compliance Directives
Intel® Solid State Drive Data Center Tool, NVMe Drivers:
www.intel.com
Solid State Drive Computing Starts with Intel Inside®. To order visit
www.intel.com/ssd
Solid State Drive Computing Starts with Intel Inside®. For more information,
visit
www.intel.com/ssd
1
2
3
Based on the Intel®
Solid State Drive DC P3500, P3600 and P3700 Series Product Specifications. Random I/O Operations based on Thousand (K) IOPS
Performance varies by capacity and is measured using IOMeter* with Queue Depth 128, for sequential workload Queue Depth 128 with single worker. For Random workload Queue Depth 32, with 4 workers.
Measurements are performed on full span of logical block address (LBA) range on an SSD that is filled to capacity with data. IOPS setup: Intel® Core
TM
i7-3770K CPU @ 3.50GHz, 8GB of system memory, Windows*
Server 2012, and IOMeter tool were used. DC P3700 system performance is configuration dependent. Random performance is collected with 4 workers each with 32 QD.
Using JESD218 standard with JESD219 workload, Terabytes Written (TBW)
Average latency measured with 4KB sequential I/O at Queue Depth
1
Active power measured during execution of Full Sequential Workload with 128KB transfer size, idle power is measured when there is no I/O to SSD.
For suggested airflow please refer to the product specification document.
4
5
6
7
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “unde-
fined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without
notice. Do not finalize a design with this information.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific
computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in
fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system
hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering
purchasing. For more information on performance tests and on the performance of Intel products, go to: http://www.intel.com/performance/resources/benchmark_limitations.htm.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on
request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this
document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel’s Web site at www.intel.com.
Copyright © 2015 Intel Corporation. All rights reserved. Intel, Intel Xeon, the Intel logo, and Intel Inside are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Printed in the USA
151203/jm/ra
Please Recycle
330591-005US
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
