100MHz Current Feedback Amplifier
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 8 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 商用集成电路类型 | VIDEO AMPLIFIER |
| JESD-30 代码 | R-CDIP-T8 |
| JESD-609代码 | e0 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 15 V |
| 最小供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| LT1223MJ8 | LT1223 | LT1223_05 | LT1223CN8 | LT1223CS8 | LT1223CJ8 | |
|---|---|---|---|---|---|---|
| 描述 | 100MHz Current Feedback Amplifier | 100MHz Current Feedback Amplifier | 100MHz Current Feedback Amplifier | 100MHz Current Feedback Amplifier | 100MHz Current Feedback Amplifier | 100MHz Current Feedback Amplifier |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Linear ( ADI ) | - | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | DIP | - | - | DIP | SOIC | DIP |
| 包装说明 | DIP, | - | - | DIP, | SOP, | DIP, |
| 针数 | 8 | - | - | 8 | 8 | 8 |
| Reach Compliance Code | unknow | - | - | not_compliant | not_compliant | unknow |
| ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
| JESD-30 代码 | R-CDIP-T8 | - | - | R-PDIP-T8 | R-PDSO-G8 | R-CDIP-T8 |
| JESD-609代码 | e0 | - | - | e0 | e0 | e0 |
| 功能数量 | 1 | - | - | 1 | 1 | 1 |
| 端子数量 | 8 | - | - | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | - | - | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | - | - | DIP | SOP | DIP |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | - | IN-LINE | SMALL OUTLINE | IN-LINE |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | - | - | 3.937 mm | 1.752 mm | 5.08 mm |
| 表面贴装 | NO | - | - | NO | YES | NO |
| 技术 | BIPOLAR | - | - | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | - | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | - | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | - | - | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | - | - | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | - | - | 7.62 mm | 3.899 mm | 7.62 mm |
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