Clock Buffer 3.3V PLL ZERO DELAY CLOCK BUFFER
| 参数名称 | 属性值 |
| Brand Name | Integrated Device Technology |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP16,.25 |
| 针数 | 16 |
| 制造商包装代码 | DCG16 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 系列 | 2309 |
| 输入调节 | STANDARD |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e3 |
| 长度 | 9.9314 mm |
| 逻辑集成电路类型 | PLL BASED CLOCK DRIVER |
| 最大I（ol） | 0.012 A |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 反相输出次数 | |
| 端子数量 | 16 |
| 实输出次数 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Sup | 8.7 ns |
| 传播延迟（tpd） | 8.7 ns |
| 认证状态 | Not Qualified |
| Same Edge Skew-Max（tskwd） | 0.25 ns |
| 座面最大高度 | 1.7272 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.937 mm |
| 最小 fmax | 133 MHz |
| Base Number Matches | 1 |
| 2309A-1DCGI8 | 2309A-1HPGGI | 2309A-1HDCGI8 | 2309A-1HDCG | 2309A-1HDCI | 2309A-1HDCG8 | 2309A-1HDCGI | |
|---|---|---|---|---|---|---|---|
| 描述 | Clock Buffer 3.3V PLL ZERO DELAY CLOCK BUFFER | Clock Buffer 3.3V PLL ZERO DELAY CLOCK BUFFER | Clock Buffer 3.3V PLL ZERO DELAY CLOCK BUFFER | Clock Buffer 3.3V PLL ZERO DELAY CLOCK BUFFER | Clock Buffer 3.3V PLL ZERO DELAY CLOCK BUFFER | Clock Buffer 3.3V PLL ZERO DELAY CLOCK BUFFER | Clock Buffer 3.3V PLL ZERO DELAY CLOCK BUFFER |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | TSSOP | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | SOP, SOP16,.25 | TSSOP, TSSOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | not_compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e0 | e3 | e3 |
| 逻辑集成电路类型 | PLL BASED CLOCK DRIVER | PLL BASED CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER | PLL BASED CLOCK DRIVER | LOW SKEW CLOCK DRIVER | LOW SKEW CLOCK DRIVER |
| 最大I（ol） | 0.012 A | 0.012 A | 0.012 A | 0.012 A | 0.012 A | 0.012 A | 0.012 A |
| 湿度敏感等级 | 3 | 1 | 3 | 3 | 1 | 3 | 3 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSSOP | SOP | SOP | SOP | SOP | SOP |
| 封装等效代码 | SOP16,.25 | TSSOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Sup | 8.7 ns | 8.7 ns | 8.7 ns | 8.7 ns | 8.7 ns | 8.7 ns | 8.7 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Brand Name | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | - | Integrated Device Technology | Integrated Device Technology |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 |
| 制造商包装代码 | DCG16 | PGG16 | DCG16 | DCG16 | - | DCG16 | DCG16 |
| 系列 | 2309 | 2309 | - | 2309 | 2309 | - | 2309 |
| 输入调节 | STANDARD | STANDARD | - | MUX | STANDARD | - | MUX |
| 功能数量 | 1 | 1 | - | 1 | 1 | - | 1 |
| 实输出次数 | 8 | 8 | - | 8 | 8 | - | 8 |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | - | 3-STATE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | - | 260 | 260 |
| Same Edge Skew-Max（tskwd） | 0.25 ns | 0.7 ns | - | 0.25 ns | 0.7 ns | - | 0.25 ns |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | - | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | - | 3 V | 3 V | - | 3 V |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | - | 30 | 30 |
| 最小 fmax | 133 MHz | 133 MHz | - | 133 MHz | 133 MHz | - | 133 MHz |
模拟与混合信号
模拟与混合信号
微控制器 MCU
stm32/stm8
模拟电子
嵌入式系统
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
