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74LVT244APW,112: 产品描述Buffers & Line Drivers OCTAL BUFF/LDRVR 3ST 3.3V; 产品类别逻辑逻辑; 文件大小219KB，共17页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74LVT244APW,112概述

Buffers & Line Drivers OCTAL BUFF/LDRVR 3ST 3.3V

74LVT244APW,112规格参数

参数名称	属性值
Brand Name	NXP Semiconductor
是否Rohs认证	符合
零件包装代码	TSSOP2
包装说明	TSSOP, TSSOP20,.25
针数	20
制造商包装代码	SOT360-1
Reach Compliance Code	compliant
控制类型	ENABLE LOW
系列	LVT
JESD-30 代码	R-PDSO-G20
JESD-609代码	e4
长度	6.5 mm
负载电容（CL）	50 pF
逻辑集成电路类型	BUS DRIVER
最大I（ol）	0.032 A
湿度敏感等级	1
位数	4
功能数量	2
端口数量	2
端子数量	20
最高工作温度	85 °C
最低工作温度	-40 °C
输出特性	3-STATE
输出极性	TRUE
封装主体材料	PLASTIC/EPOXY
封装代码	TSSOP
封装等效代码	TSSOP20,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法	TUBE
峰值回流温度（摄氏度）	260
电源	3.3 V
最大电源电流（ICC）	12 mA
Prop。Delay @ Nom-Sup	4.1 ns
传播延迟（tpd）	5 ns
认证状态	Not Qualified
座面最大高度	1.1 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	BICMOS
温度等级	INDUSTRIAL
端子面层	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	4.4 mm
Base Number Matches	1

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74LVT244A; 74LVTH244A

3.3 V octal buffer/line driver; 3-state

Rev. 5 — 16 August 2017

Product data sheet

General description

The 74LVT244A; 74LVTH244A is a high-performance BiCMOS product designed for V

operation at 3.3 V.

This device is an octal buffer that is ideal for driving bus lines. The device features two

output enables (1OE, 2OE), each controlling four of the 3-state outputs.

Features and benefits

•

Octal bus interface

3-state buffers

Output capability: +64 mA and -32 mA

TTL input and output switching levels

Input and output interface capability to systems at 5 V supply

Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs

Live insertion and extraction permitted

Power-up 3-state

No bus current loading when output is tied to 5 V bus

Latch-up protection

–

JESD78 Class II exceeds 500 mA

•

ESD protection:

–

HBM JESD22-A114E exceeds 2000 V

–

MM JESD22-A115-A exceeds 200 V

Ordering information

Package

Temperature range Name

Description

plastic small outline package; 20 leads;

body width 7.5 mm

plastic shrink small outline package; 20 leads;

body width 5.3 mm

plastic thin shrink small outline package; 20 leads;

body width 4.4 mm

Table 1. Ordering information

Type number

74LVT244AD

74LVTH244AD

74LVT244ADB

74LVTH244ADB

74LVT244APW

74LVTH244APW

74LVT244ABQ

74LVTH244ABQ

Version

SOT163-1

SOT339-1

SOT360-1

-40 °C to +85 °C

SO20

SSOP20

TSSOP20

DHVQFN20

plastic dual in-line compatible thermal enhanced

SOT764-1

very thin quad flat package; no leads; 20 terminals;

body 2.5 × 4.5 × 0.85 mm

74LVT244APW,112相似产品对比

	74LVT244APW,112	74LVTH244AD,112	74LVTH244APW,118	74LVTH244AD,118	74LVTH244ABQ-Q100X	74LVT244APW,118
描述	Buffers & Line Drivers OCTAL BUFF/LDRVR 3ST 3.3V	Buffers & Line Drivers 3.3V OCTAL BUF/LDVR	Buffers & Line Drivers 3.3V OBUFF/LDRVR	Buffers & Line Drivers 3.3V OCTAL BUF/LDVR	Buffers & Line Drivers 3.3 V octal buffer/ line driver	Buffers & Line Drivers 3.3V OCTAL 3-S DRVER
Brand Name	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	-	NXP Semiconductor
是否Rohs认证	符合	符合	符合	符合	-	符合
零件包装代码	TSSOP2	SOP	TSSOP2	SOP	-	TSSOP2
包装说明	TSSOP, TSSOP20,.25	7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20	4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20	7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20	-	4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20
针数	20	20	20	20	-	20
制造商包装代码	SOT360-1	SOT163-1	SOT360-1	SOT163-1	-	SOT360-1
Reach Compliance Code	compliant	compliant	compliant	compliant	-	compliant
控制类型	ENABLE LOW	ENABLE LOW	ENABLE LOW	ENABLE LOW	-	ENABLE LOW
系列	LVT	LVT	LVT	LVT	-	LVT
JESD-30 代码	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	R-PDSO-G20	-	R-PDSO-G20
JESD-609代码	e4	e4	e4	e4	-	e4
长度	6.5 mm	12.8 mm	6.5 mm	12.8 mm	-	6.5 mm
逻辑集成电路类型	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	-	BUS DRIVER
最大I（ol）	0.032 A	0.064 A	0.064 A	0.064 A	-	0.032 A
湿度敏感等级	1	1	1	1	-	1
位数	4	4	4	4	-	4
功能数量	2	2	2	2	-	2
端口数量	2	2	2	2	-	2
端子数量	20	20	20	20	-	20
最高工作温度	85 °C	85 °C	85 °C	85 °C	-	85 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-	-40 °C
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE
输出极性	TRUE	TRUE	TRUE	TRUE	-	TRUE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
封装代码	TSSOP	SOP	TSSOP	SOP	-	TSSOP
封装等效代码	TSSOP20,.25	SOP20,.4	TSSOP20,.25	SOP20,.25	-	TSSOP20,.25
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法	TUBE	TUBE	TAPE AND REEL	TAPE AND REEL	-	TAPE AND REEL
峰值回流温度（摄氏度）	260	260	260	260	-	260
电源	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V
Prop。Delay @ Nom-Sup	4.1 ns	3.5 ns	4.1 ns	4.1 ns	-	4.1 ns
传播延迟（tpd）	5 ns	5 ns	5 ns	5 ns	-	5 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
座面最大高度	1.1 mm	2.65 mm	1.1 mm	2.65 mm	-	1.1 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V
最小供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	-	2.7 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V
表面贴装	YES	YES	YES	YES	-	YES
技术	BICMOS	BICMOS	BICMOS	BICMOS	-	BICMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL
端子面层	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	-	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	-	GULL WING
端子节距	0.65 mm	1.27 mm	0.65 mm	1.27 mm	-	0.65 mm
端子位置	DUAL	DUAL	DUAL	DUAL	-	DUAL
处于峰值回流温度下的最长时间	30	30	30	30	-	30
宽度	4.4 mm	7.5 mm	4.4 mm	7.5 mm	-	4.4 mm
Base Number Matches	1	1	1	1	-	1

74LVT244APW,112

74LVT244APW,112概述

74LVT244APW,112规格参数

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