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74LVTH244ABQ-Q100X

产品描述Buffers & Line Drivers 3.3 V octal buffer/ line driver
产品类别半导体    逻辑   
文件大小219KB,共17页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
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74LVTH244ABQ-Q100X概述

Buffers & Line Drivers 3.3 V octal buffer/ line driver

74LVTH244ABQ-Q100X规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
NXP(恩智浦)
产品种类
Product Category
Buffers & Line Drivers
RoHSDetails
Number of Input Lines8 Input
Number of Output Lines8 Output
电源电压-最大
Supply Voltage - Max
3.6 V
电源电压-最小
Supply Voltage - Min
2.7 V
最小工作温度
Minimum Operating Temperature
- 40 C
最大工作温度
Maximum Operating Temperature
+ 85 C
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
DHVQFN-20
系列
Packaging
Reel
输出类型
Output Type
3-State
Logic Family74LVTH
Logic TypeTTL
Number of Channels8
High Level Output Current- 32 mA
Low Level Output Current+ 64 mA
工作电源电流
Operating Supply Current
3 mA
Pd-功率耗散
Pd - Power Dissipation
500 mW (1/2 W)
传播延迟时间
Propagation Delay Time
5.1 ns
工厂包装数量
Factory Pack Quantity
3000

文档预览

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74LVT244A; 74LVTH244A
3.3 V octal buffer/line driver; 3-state
Rev. 5 — 16 August 2017
Product data sheet
1
General description
The 74LVT244A; 74LVTH244A is a high-performance BiCMOS product designed for V
CC
operation at 3.3 V.
This device is an octal buffer that is ideal for driving bus lines. The device features two
output enables (1OE, 2OE), each controlling four of the 3-state outputs.
2
Features and benefits
Octal bus interface
3-state buffers
Output capability: +64 mA and -32 mA
TTL input and output switching levels
Input and output interface capability to systems at 5 V supply
Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs
Live insertion and extraction permitted
Power-up 3-state
No bus current loading when output is tied to 5 V bus
Latch-up protection
JESD78 Class II exceeds 500 mA
ESD protection:
HBM JESD22-A114E exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
3
Ordering information
Package
Temperature range Name
Description
plastic small outline package; 20 leads;
body width 7.5 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
Table 1. Ordering information
Type number
74LVT244AD
74LVTH244AD
74LVT244ADB
74LVTH244ADB
74LVT244APW
74LVTH244APW
74LVT244ABQ
74LVTH244ABQ
Version
SOT163-1
SOT339-1
SOT360-1
-40 °C to +85 °C
-40 °C to +85 °C
-40 °C to +85 °C
-40 °C to +85 °C
SO20
SSOP20
TSSOP20
DHVQFN20
plastic dual in-line compatible thermal enhanced
SOT764-1
very thin quad flat package; no leads; 20 terminals;
body 2.5 × 4.5 × 0.85 mm

74LVTH244ABQ-Q100X相似产品对比

74LVTH244ABQ-Q100X 74LVT244APW,112 74LVTH244AD,112 74LVTH244APW,118 74LVTH244AD,118 74LVT244APW,118
描述 Buffers & Line Drivers 3.3 V octal buffer/ line driver Buffers & Line Drivers OCTAL BUFF/LDRVR 3ST 3.3V Buffers & Line Drivers 3.3V OCTAL BUF/LDVR Buffers & Line Drivers 3.3V OBUFF/LDRVR Buffers & Line Drivers 3.3V OCTAL BUF/LDVR Buffers & Line Drivers 3.3V OCTAL 3-S DRVER
Brand Name - NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor
是否Rohs认证 - 符合 符合 符合 符合 符合
零件包装代码 - TSSOP2 SOP TSSOP2 SOP TSSOP2
包装说明 - TSSOP, TSSOP20,.25 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20 7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20 4.40 MM, PLASTIC, MO-153, SOT360-1, TSSOP-20
针数 - 20 20 20 20 20
制造商包装代码 - SOT360-1 SOT163-1 SOT360-1 SOT163-1 SOT360-1
Reach Compliance Code - compliant compliant compliant compliant compliant
控制类型 - ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW
系列 - LVT LVT LVT LVT LVT
JESD-30 代码 - R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20
JESD-609代码 - e4 e4 e4 e4 e4
长度 - 6.5 mm 12.8 mm 6.5 mm 12.8 mm 6.5 mm
逻辑集成电路类型 - BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
最大I(ol) - 0.032 A 0.064 A 0.064 A 0.064 A 0.032 A
湿度敏感等级 - 1 1 1 1 1
位数 - 4 4 4 4 4
功能数量 - 2 2 2 2 2
端口数量 - 2 2 2 2 2
端子数量 - 20 20 20 20 20
最高工作温度 - 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 - -40 °C -40 °C -40 °C -40 °C -40 °C
输出特性 - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 - TRUE TRUE TRUE TRUE TRUE
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - TSSOP SOP TSSOP SOP TSSOP
封装等效代码 - TSSOP20,.25 SOP20,.4 TSSOP20,.25 SOP20,.25 TSSOP20,.25
封装形状 - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法 - TUBE TUBE TAPE AND REEL TAPE AND REEL TAPE AND REEL
峰值回流温度(摄氏度) - 260 260 260 260 260
电源 - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Sup - 4.1 ns 3.5 ns 4.1 ns 4.1 ns 4.1 ns
传播延迟(tpd) - 5 ns 5 ns 5 ns 5 ns 5 ns
认证状态 - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 - 1.1 mm 2.65 mm 1.1 mm 2.65 mm 1.1 mm
最大供电电压 (Vsup) - 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) - 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 - YES YES YES YES YES
技术 - BICMOS BICMOS BICMOS BICMOS BICMOS
温度等级 - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 - Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式 - GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 - 0.65 mm 1.27 mm 0.65 mm 1.27 mm 0.65 mm
端子位置 - DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 - 30 30 30 30 30
宽度 - 4.4 mm 7.5 mm 4.4 mm 7.5 mm 4.4 mm
Base Number Matches - 1 1 1 1 1

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