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IS61NLP51236-200B3-TR

产品描述SRAM 18Mb 512Kx36 200Mhz Sync SRAM 3.3v
产品类别存储   
文件大小582KB,共37页
制造商ISSI(芯成半导体)
官网地址http://www.issi.com/
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IS61NLP51236-200B3-TR概述

SRAM 18Mb 512Kx36 200Mhz Sync SRAM 3.3v

IS61NLP51236-200B3-TR规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
ISSI(芯成半导体)
产品种类
Product Category
SRAM
RoHSN
Memory Size18 Mbit
Organization512 k x 36
Access Time3.1 ns
Maximum Clock Frequency200 MHz
接口类型
Interface Type
Parallel
电源电压-最大
Supply Voltage - Max
3.465 V
电源电压-最小
Supply Voltage - Min
3.135 V
Supply Current - Max425 mA
最小工作温度
Minimum Operating Temperature
0 C
最大工作温度
Maximum Operating Temperature
+ 70 C
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
FBGA-165
系列
Packaging
Reel
数据速率
Data Rate
SDR
类型
Type
Synchronous
Number of Ports4
Moisture SensitiveYes
工厂包装数量
Factory Pack Quantity
2000

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IS61NLP25672/IS61NVP25672
IS61NLP51236/IS61NVP51236
IS61NLP102418/IS61NVP102418 
256K x 72, 512K x 36 and 1M x 18
18Mb, PIPELINE 'NO WAIT' STATE BUS SRAM
SEPTEMBER 2011
FEATURES
• 100 percent bus utilization
• No wait cycles between Read and Write
• Internal self-timed write cycle
• Individual Byte Write Control
• Single R/W (Read/Write) control pin
• Clock controlled, registered address,
data and control
DESCRIPTION
The 18 Meg 'NLP/NVP' product family feature high-speed,
low-power synchronous static RAMs designed to provide
a burstable, high-performance, 'no wait' state, device
for networking and communications applications. They
are organized as 256K words by 72 bits, 512K words
by 36 bits and 1M words by 18 bits, fabricated with
ISSI
's
advanced CMOS technology.
Incorporating a 'no wait' state feature, wait cycles are
eliminated when the bus switches from read to write, or
write to read. This device integrates a 2-bit burst counter,
high-speed SRAM core, and high-drive capability outputs
into a single monolithic circuit.
All synchronous inputs pass through registers are controlled
by a positive-edge-triggered single clock input. Operations
may be suspended and all synchronous inputs ignored
when Clock Enable, CKE is HIGH. In this state the internal
device will hold their previous values.
All Read, Write and Deselect cycles are initiated by the ADV
input. When the ADV is HIGH the internal burst counter
is incremented. New external addresses can be loaded
when ADV is LOW.
Write cycles are internally self-timed and are initiated by
the rising edge of the clock inputs and when WE is LOW.
Separate byte enables allow individual bytes to be written.
A burst mode pin (MODE) defines the order of the burst
sequence. When tied HIGH, the interleaved burst sequence
is selected. When tied LOW, the linear burst sequence is
selected.
• Interleaved or linear burst sequence control us-
ing MODE input
• Three chip enables for simple depth expansion
and address pipelining
• Power Down mode
• Common data inputs and data outputs
CKE pin to enable clock and suspend operation
• JEDEC 100-pin TQFP, 119-ball PBGA, 165-ball
PBGA and 209-ball (x72) PBGA packages
• Power supply:
NVP: V
dd
2.5V (± 5%), V
ddq
2.5V (± 5%)
NLP: V
dd
3.3V (± 5%), V
ddq
3.3V/2.5V (± 5%)
• JTAG Boundary Scan for PBGA packages
• Industrial temperature available
• Lead-free available
• Leaded option available upon request
FAST ACCESS TIME
Symbol 
t
kq
t
kc
Parameter 
Clock Access Time
Cycle Time
Frequency
-250 
2.6
4
250
-200 
3.1
5
200
Units
ns
ns
MHz
Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on
any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause
failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written
assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. — www.issi.com
Rev.  O
09/19/2011
1

IS61NLP51236-200B3-TR相似产品对比

IS61NLP51236-200B3-TR IS61NVP51236-200B3I IS61NVP25672-250B1 IS61NLP51236-200B3 IS61NVP51236-200B3I-TR IS61NLP102418-200TQ-TR IS61NLP25672-200B1 IS61NLP102418-250B3-TR
描述 SRAM 18Mb 512Kx36 200Mhz Sync SRAM 3.3v SRAM 18Mb 512Kx36 Sync SRAM 2.5v SRAM 18Mb 256Kx72 250Mhz 2.5v - I/O SRAM 18Mb 512Kx36 200Mhz Sync SRAM 3.3v SRAM 18Mb 512Kx36 Sync SRAM 2.5v SRAM 18Mb 1Mbx18 200Mhz Sync SRAM 3.3v SRAM 18Mb 256Kx72 200Mhz Sync SRAM 3.3v SRAM 18Mb 1Mbx18 250Mhz Sync SRAM 3.3v
Product Attribute Attribute Value Attribute Value Attribute Value - Attribute Value Attribute Value - Attribute Value
制造商
Manufacturer
ISSI(芯成半导体) ISSI(芯成半导体) ISSI(芯成半导体) - ISSI(芯成半导体) ISSI(芯成半导体) - ISSI(芯成半导体)
产品种类
Product Category
SRAM SRAM SRAM - SRAM SRAM - SRAM
RoHS N N N - N N - N
Memory Size 18 Mbit 18 Mbit 18 Mbit - 18 Mbit 18 Mbit - 18 Mbit
Organization 512 k x 36 512 k x 36 256 k x 72 - 512 k x 36 1 M x 18 - 1 M x 18
Access Time 3.1 ns 3.1 ns 2.6 ns - 3.1 ns 3.1 ns - 2.6 ns
Maximum Clock Frequency 200 MHz 200 MHz 250 MHz - 200 MHz 200 MHz - 250 MHz
接口类型
Interface Type
Parallel Parallel Parallel - Parallel Parallel - Parallel
电源电压-最大
Supply Voltage - Max
3.465 V 2.625 V 2.625 V - 2.625 V 3.465 V - 3.465 V
电源电压-最小
Supply Voltage - Min
3.135 V 2.375 V 2.375 V - 2.375 V 3.135 V - 3.135 V
Supply Current - Max 425 mA 475 mA 600 mA - 475 mA 425 mA - 450 mA
最小工作温度
Minimum Operating Temperature
0 C - 40 C 0 C - - 40 C 0 C - 0 C
最大工作温度
Maximum Operating Temperature
+ 70 C + 85 C + 70 C - + 85 C + 70 C - + 70 C
安装风格
Mounting Style
SMD/SMT SMD/SMT SMD/SMT - SMD/SMT SMD/SMT - SMD/SMT
封装 / 箱体
Package / Case
FBGA-165 FBGA-165 PBGA-209 - FBGA-165 TQFP-100 - FBGA-165
系列
Packaging
Reel Tray Tube - Reel Reel - Reel
数据速率
Data Rate
SDR SDR SDR - SDR SDR - SDR
类型
Type
Synchronous Synchronous Synchronous - Synchronous Synchronous - Synchronous
Number of Ports 4 4 8 - 4 2 - 2
Moisture Sensitive Yes Yes Yes - Yes Yes - Yes
工厂包装数量
Factory Pack Quantity
2000 144 84 - 2000 800 - 2000
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