Communication ICs - Various Enhanced Bit Error Rate Tester (BERT)
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | LCC |
| 包装说明 | QCCJ, LDCC44,.7SQ |
| 针数 | 44 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| JESD-30 代码 | S-PQCC-J44 |
| JESD-609代码 | e3 |
| 长度 | 16.585 mm |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 44 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC44,.7SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 最大压摆率 | 0.06 mA |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 电信集成电路类型 | TELECOM CIRCUIT |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 16.585 mm |
| DS2174Q+ | DS2174QN-TR | DS2174QN+ | DS2174Q | DS2174QN/T&R | DS2174Q+T&R | DS2174Q/T&R | |
|---|---|---|---|---|---|---|---|
| 描述 | Communication ICs - Various Enhanced Bit Error Rate Tester (BERT) | Communication ICs - Various Enhanced Bit Error Rate Tester (BERT) | Communication ICs - Various Enhanced Bit Error Rate Tester (BERT) | Communication ICs - Various Enhanced Bit Error Rate Tester (BERT) | Communication ICs - Various ENHANCED BIT ERROR RATE TESTER IND | Communication ICs - Various Enhanced Bit Error Rate Tester (BERT) | Communication ICs - Various ENHANCED BIT ERROR RATE TESTER COMM |
| 是否无铅 | 不含铅 | - | 不含铅 | 含铅 | 含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 符合 | - | 符合 | 不符合 | 不符合 | 符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 零件包装代码 | LCC | - | LCC | LCC | LCC | LCC | LCC |
| 包装说明 | QCCJ, LDCC44,.7SQ | - | QCCJ, LDCC44,.7SQ | PLASTIC, LCC-44 | PLASTIC, LCC-44 | QCCJ, LDCC44,.7SQ | PLASTIC, LCC-44 |
| 针数 | 44 | - | 44 | 44 | 44 | 44 | 44 |
| Reach Compliance Code | compliant | - | compliant | not_compliant | not_compliant | compliant | not_compliant |
| JESD-30 代码 | S-PQCC-J44 | - | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 | S-PQCC-J44 |
| JESD-609代码 | e3 | - | e3 | e0 | e0 | e3 | e0 |
| 长度 | 16.585 mm | - | 16.585 mm | 16.585 mm | 16.585 mm | 16.585 mm | 16.585 mm |
| 湿度敏感等级 | 3 | - | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 44 | - | 44 | 44 | 44 | 44 | 44 |
| 最高工作温度 | 70 °C | - | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | - | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
| 封装等效代码 | LDCC44,.7SQ | - | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | - | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 245 | 245 | 260 | 245 |
| 电源 | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | - | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm |
| 最大压摆率 | 0.06 mA | - | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA |
| 标称供电电压 | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES |
| 电信集成电路类型 | TELECOM CIRCUIT | - | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 温度等级 | COMMERCIAL | - | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | - | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | - | J BEND | J BEND | J BEND | J BEND | J BEND |
| 端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | - | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 16.585 mm | - | 16.585 mm | 16.585 mm | 16.585 mm | 16.585 mm | 16.585 mm |
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