Buffers & Line Drivers 3.6 V XSON6
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-06-14 00:00:00 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | SON |
| 包装说明 | SON, SOLCC6,.04,12 |
| 针数 | 6 |
| 制造商包装代码 | SOT1115 |
| Reach Compliance Code | compliant |
| 系列 | AUP/ULP/V |
| JESD-30 代码 | R-PDSO-N6 |
| JESD-609代码 | e3 |
| 长度 | 1 mm |
| 负载电容（CL） | 30 pF |
| 逻辑集成电路类型 | BUFFER |
| 最大I（ol） | 0.0017 A |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 输入次数 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SON |
| 封装等效代码 | SOLCC6,.04,12 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 包装方法 | TAPE AND REEL |
| 电源 | 1.2/3.3 V |
| Prop。Delay @ Nom-Sup | 20.1 ns |
| 传播延迟（tpd） | 20.1 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | YES |
| 座面最大高度 | 0.35 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V |
| 标称供电电压 (Vsup) | 1.1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.3 mm |
| 端子位置 | DUAL |
| 宽度 | 0.9 mm |
| Base Number Matches | 1 |
| 74AUP1G17GN,132 | 74AUP1G17GM,132 | 74AUP1G17GM,115 | 74AUP1G17GF,132 | 74AUP1G17GX,125 | 74AUP1G17GS,132 | 74AUP1G17GW,125 | |
|---|---|---|---|---|---|---|---|
| 描述 | Buffers & Line Drivers 3.6 V XSON6 | Buffers & Line Drivers 1.8V SINGL LOW-PWR | Buffers & Line Drivers 1.8V SINGLE SCHMITT | Buffers & Line Drivers 1.8V SINGL LOW-PWR | Buffers & Line Drivers 74AUP1G17GX/X2SON5/REEL 7" Q3/ | Buffers & Line Drivers 3.6 V XSON6 | Buffers & Line Drivers 1.8V SINGLE SCHMITT |
| Brand Name | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | SON, SOLCC6,.04,12 | VSON, SOLCC6,.04,20 | VSON, SOLCC6,.04,20 | VSON, SOLCC6,.04,14 | SON, LCC5(UNSPEC) | VSON, SOLCC6,.04,14 | 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5 |
| 制造商包装代码 | SOT1115 | SOT886 | SOT886 | SOT891 | SOT1226 | SOT1202 | SOT353-1 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 系列 | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
| JESD-30 代码 | R-PDSO-N6 | R-PDSO-N6 | R-PDSO-N6 | S-PDSO-N6 | S-PDSO-N5 | S-PDSO-N6 | R-PDSO-G5 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 1 mm | 1.45 mm | 1.45 mm | 1 mm | 0.8 mm | 1 mm | 2.05 mm |
| 负载电容（CL） | 30 pF | 30 pF | 30 pF | 30 pF | 30 pF | 30 pF | 30 pF |
| 逻辑集成电路类型 | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
| 最大I（ol） | 0.0017 A | 0.0017 A | 0.0017 A | 0.0017 A | 0.0017 A | 0.0017 A | 0.0017 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 6 | 6 | 6 | 6 | 5 | 6 | 5 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SON | VSON | VSON | VSON | SON | VSON | TSSOP |
| 封装等效代码 | SOLCC6,.04,12 | SOLCC6,.04,20 | SOLCC6,.04,20 | SOLCC6,.04,14 | LCC5(UNSPEC) | SOLCC6,.04,14 | TSSOP5/6,.08 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| 电源 | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V |
| Prop。Delay @ Nom-Sup | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns |
| 传播延迟（tpd） | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | YES | YES | YES | YES | YES | YES | YES |
| 座面最大高度 | 0.35 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.35 mm | 0.35 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| 标称供电电压 (Vsup) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | GULL WING |
| 端子节距 | 0.3 mm | 0.5 mm | 0.5 mm | 0.35 mm | 0.48 mm | 0.35 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 0.9 mm | 1 mm | 1 mm | 1 mm | 0.8 mm | 1 mm | 1.25 mm |
| 零件包装代码 | SON | SON | SON | SON | SON | - | TSSOP |
| 针数 | 6 | 6 | 6 | 6 | 5 | - | 5 |
| Base Number Matches | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | - | - | 260 |
| 处于峰值回流温度下的最长时间 | - | 30 | 30 | 30 | - | - | 30 |
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