AND Gate, F/FAST Series, 4-Func, 2-Input, TTL, CDFP14, CERPACK-14
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| 零件包装代码 | DFP |
| 包装说明 | CERPACK-14 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 系列 | F/FAST |
| JESD-30 代码 | R-GDFP-F14 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | AND GATE |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装等效代码 | FL14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 传播延迟（tpd） | 7.5 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 2.032 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 6.2865 mm |
| Base Number Matches | 1 |
| 54F08FM | 54F08LMQB | 54F08FMQB | 54F08DM | 54F08DMQB | 74F08SJCX | 74F08SJC | 54F08LM | |
|---|---|---|---|---|---|---|---|---|
| 描述 | AND Gate, F/FAST Series, 4-Func, 2-Input, TTL, CDFP14, CERPACK-14 | AND Gate, F/FAST Series, 4-Func, 2-Input, TTL, CQCC20, CERAMIC, LCC-20 | AND Gate, F/FAST Series, 4-Func, 2-Input, TTL, CDFP14, CERPACK-14 | AND Gate, F/FAST Series, 4-Func, 2-Input, TTL, CDIP14, CERAMIC, DIP-14 | AND Gate, F/FAST Series, 4-Func, 2-Input, TTL, CDIP14, CERAMIC, DIP-14 | AND Gate, F/FAST Series, 4-Func, 2-Input, TTL, PDSO14, 0.300 INCH, EIAJ, PLASTIC, SOP-14 | AND Gate, F/FAST Series, 4-Func, 2-Input, TTL, PDSO14, 0.300 INCH, EIAJ, PLASTIC, SOP-14 | AND Gate, F/FAST Series, 4-Func, 2-Input, TTL, CQCC20, CERAMIC, LCC-20 |
| 零件包装代码 | DFP | QLCC | DFP | DIP | DIP | SOIC | SOIC | QLCC |
| 包装说明 | CERPACK-14 | QCCN, LCC20,.35SQ | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | SOP, | SOP, | QCCN, |
| 针数 | 14 | 20 | 14 | 14 | 14 | 14 | 14 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 代码 | R-GDFP-F14 | S-CQCC-N20 | R-GDFP-F14 | R-GDIP-T14 | R-GDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | S-CQCC-N20 |
| 逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 20 | 14 | 14 | 14 | 14 | 14 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | QCCN | DFP | DIP | DIP | SOP | SOP | QCCN |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | CHIP CARRIER | FLATPACK | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | CHIP CARRIER |
| 传播延迟（tpd） | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 6.3 ns | 6.3 ns | 7.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.032 mm | 1.905 mm | 2.032 mm | 5.08 mm | 5.08 mm | 2.1 mm | 2.1 mm | 1.905 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | NO | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| 端子形式 | FLAT | NO LEAD | FLAT | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| 宽度 | 6.2865 mm | 8.89 mm | 6.2865 mm | 7.62 mm | 7.62 mm | 5.3 mm | 5.3 mm | 8.89 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | - | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | - | - |
| 封装等效代码 | FL14,.3 | LCC20,.35SQ | FL14,.3 | DIP14,.3 | DIP14,.3 | - | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - | - | - |
| 施密特触发器 | NO | NO | NO | NO | NO | - | - | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - |
| 长度 | - | 8.89 mm | - | 19.43 mm | 19.43 mm | 10.1 mm | 10.1 mm | 8.89 mm |
stm32/stm8
工作这点儿事
无线连接
stm32/stm8
微控制器 MCU
TI技术论坛
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
