71V25761SA183BQGI,71V25761SA183BQGI pdf中文资料,71V25761SA183BQGI引脚图,71V25761SA183BQGI电路-Datasheet-电子工程世界

Datasheet> 器件分类 > 存储> 存储> 71V25761SA183BQGI

71V25761SA183BQGI: 产品描述Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA165, 15 X 13 MM, GREEN, FBGA-165; 产品类别存储存储; 文件大小324KB，共21页; 制造商IDT (Integrated Device Technology); 标准

下载文档详细参数选型对比全文预览

71V25761SA183BQGI概述

Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA165, 15 X 13 MM, GREEN, FBGA-165

71V25761SA183BQGI规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	BGA
包装说明	TBGA, BGA165,11X15,40
针数	165
Reach Compliance Code	compliant
ECCN代码	3A991.B.2.A
最长访问时间	3.3 ns
其他特性	PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)	183 MHz
I/O 类型	COMMON
JESD-30 代码	R-PBGA-B165
JESD-609代码	e1
长度	15 mm
内存密度	4718592 bit
内存集成电路类型	CACHE SRAM
内存宽度	36
湿度敏感等级	3
功能数量	1
端子数量	165
字数	131072 words
字数代码	128000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	128KX36
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	TBGA
封装等效代码	BGA165,11X15,40
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	260
电源	2.5,3.3 V
认证状态	Not Qualified
座面最大高度	1.2 mm
最大待机电流	0.035 A
最小待机电流	3.14 V
最大压摆率	0.35 mA
最大供电电压 (Vsup)	3.465 V
最小供电电压 (Vsup)	3.135 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	30
宽度	13 mm
Base Number Matches	1

71V25761SA183BQGI相似产品对比

	71V25761SA183BQGI	71V25761YSA166BQGI	71V25761YSA200BQG	71V25761S183BGG	71V25761S183BGGI	71V25761SA166BGGI	71V25761SA166BGG	71V25761SA183BQG
描述	Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA165, 15 X 13 MM, GREEN, FBGA-165	Cache SRAM, 128KX36, 3.5ns, CMOS, PBGA165, 15 X 13 MM, GREEN, FBGA-165	Cache SRAM, 128KX36, 3.1ns, CMOS, PBGA165, 15 X 13 MM, GREEN, FBGA-165	Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA119, 22 X 14 MM, GREEN, PLASTIC, MS-028AA, BGA-119	Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA119, 22 X 14 MM, GREEN, PLASTIC, MS-028AA, BGA-119	Cache SRAM, 128KX36, 3.5ns, CMOS, PBGA119, 22 X 14 MM, GREEN, PLASTIC, MS-028AA, BGA-119	Cache SRAM, 128KX36, 3.5ns, CMOS, PBGA119, 22 X 14 MM, GREEN, PLASTIC, MS-028AA, BGA-119	Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA165, 15 X 13 MM, GREEN, FBGA-165
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	TBGA, BGA165,11X15,40	TBGA, BGA165,11X15,40	TBGA, BGA165,11X15,40	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	BGA, BGA119,7X17,50	TBGA, BGA165,11X15,40
针数	165	165	165	119	119	119	119	165
Reach Compliance Code	compliant	unknown	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	3.3 ns	3.5 ns	3.1 ns	3.3 ns	3.3 ns	3.5 ns	3.5 ns	3.3 ns
其他特性	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)	183 MHz	166 MHz	200 MHz	183 MHz	183 MHz	166 MHz	166 MHz	183 MHz
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B165
JESD-609代码	e1	e1	e1	e1	e1	e1	e1	e1
长度	15 mm	15 mm	15 mm	22 mm	22 mm	22 mm	22 mm	15 mm
内存密度	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit	4718592 bit
内存集成电路类型	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
内存宽度	36	36	36	36	36	36	36	36
湿度敏感等级	3	3	3	3	3	3	3	3
功能数量	1	1	1	1	1	1	1	1
端子数量	165	165	165	119	119	119	119	165
字数	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000	128000	128000	128000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	85 °C	70 °C	70 °C	85 °C	85 °C	70 °C	70 °C
组织	128KX36	128KX36	128KX36	128KX36	128KX36	128KX36	128KX36	128KX36
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TBGA	TBGA	TBGA	BGA	BGA	BGA	BGA	TBGA
封装等效代码	BGA165,11X15,40	BGA165,11X15,40	BGA165,11X15,40	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA119,7X17,50	BGA165,11X15,40
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY, THIN PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	260	NOT SPECIFIED	NOT SPECIFIED	260	260	260	260	260
电源	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	1.2 mm	1.2 mm	2.36 mm	2.36 mm	2.36 mm	2.36 mm	1.2 mm
最大待机电流	0.035 A	0.035 A	0.03 A	0.03 A	0.035 A	0.035 A	0.03 A	0.03 A
最小待机电流	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V	3.14 V
最大压摆率	0.35 mA	0.33 mA	0.36 mA	0.34 mA	0.35 mA	0.33 mA	0.32 mA	0.34 mA
最大供电电压 (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
最小供电电压 (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	1 mm	1 mm	1 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	30	NOT SPECIFIED	NOT SPECIFIED	30	30	30	30	30
宽度	13 mm	13 mm	13 mm	14 mm	14 mm	14 mm	14 mm	13 mm
Base Number Matches	1	1	1	1	1	1	1	1
是否无铅	不含铅	-	-	不含铅	不含铅	不含铅	不含铅	不含铅

71V25761SA183BQGI

71V25761SA183BQGI概述

71V25761SA183BQGI规格参数

71V25761SA183BQGI相似产品对比

推荐资源