Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA119, 22 X 14 MM, GREEN, PLASTIC, MS-028AA, BGA-119
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | BGA |
| 包装说明 | BGA, BGA119,7X17,50 |
| 针数 | 119 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 3.3 ns |
| 其他特性 | PIPELINED ARCHITECTURE |
| 最大时钟频率 (fCLK) | 183 MHz |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PBGA-B119 |
| JESD-609代码 | e1 |
| 长度 | 22 mm |
| 内存密度 | 4718592 bit |
| 内存集成电路类型 | CACHE SRAM |
| 内存宽度 | 36 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 119 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 128KX36 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装等效代码 | BGA119,7X17,50 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.5,3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.36 mm |
| 最大待机电流 | 0.03 A |
| 最小待机电流 | 3.14 V |
| 最大压摆率 | 0.34 mA |
| 最大供电电压 (Vsup) | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 14 mm |
| Base Number Matches | 1 |
| 71V25761S183BGG | 71V25761YSA166BQGI | 71V25761YSA200BQG | 71V25761S183BGGI | 71V25761SA166BGGI | 71V25761SA166BGG | 71V25761SA183BQG | 71V25761SA183BQGI | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA119, 22 X 14 MM, GREEN, PLASTIC, MS-028AA, BGA-119 | Cache SRAM, 128KX36, 3.5ns, CMOS, PBGA165, 15 X 13 MM, GREEN, FBGA-165 | Cache SRAM, 128KX36, 3.1ns, CMOS, PBGA165, 15 X 13 MM, GREEN, FBGA-165 | Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA119, 22 X 14 MM, GREEN, PLASTIC, MS-028AA, BGA-119 | Cache SRAM, 128KX36, 3.5ns, CMOS, PBGA119, 22 X 14 MM, GREEN, PLASTIC, MS-028AA, BGA-119 | Cache SRAM, 128KX36, 3.5ns, CMOS, PBGA119, 22 X 14 MM, GREEN, PLASTIC, MS-028AA, BGA-119 | Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA165, 15 X 13 MM, GREEN, FBGA-165 | Cache SRAM, 128KX36, 3.3ns, CMOS, PBGA165, 15 X 13 MM, GREEN, FBGA-165 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | BGA, BGA119,7X17,50 | TBGA, BGA165,11X15,40 | TBGA, BGA165,11X15,40 | BGA, BGA119,7X17,50 | BGA, BGA119,7X17,50 | BGA, BGA119,7X17,50 | TBGA, BGA165,11X15,40 | TBGA, BGA165,11X15,40 |
| 针数 | 119 | 165 | 165 | 119 | 119 | 119 | 165 | 165 |
| Reach Compliance Code | compliant | unknown | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 3.3 ns | 3.5 ns | 3.1 ns | 3.3 ns | 3.5 ns | 3.5 ns | 3.3 ns | 3.3 ns |
| 其他特性 | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE | PIPELINED ARCHITECTURE |
| 最大时钟频率 (fCLK) | 183 MHz | 166 MHz | 200 MHz | 183 MHz | 166 MHz | 166 MHz | 183 MHz | 183 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PBGA-B119 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B165 | R-PBGA-B165 |
| JESD-609代码 | e1 | e1 | e1 | e1 | e1 | e1 | e1 | e1 |
| 长度 | 22 mm | 15 mm | 15 mm | 22 mm | 22 mm | 22 mm | 15 mm | 15 mm |
| 内存密度 | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit |
| 内存集成电路类型 | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| 内存宽度 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 119 | 165 | 165 | 119 | 119 | 119 | 165 | 165 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C |
| 组织 | 128KX36 | 128KX36 | 128KX36 | 128KX36 | 128KX36 | 128KX36 | 128KX36 | 128KX36 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | TBGA | TBGA | BGA | BGA | BGA | TBGA | TBGA |
| 封装等效代码 | BGA119,7X17,50 | BGA165,11X15,40 | BGA165,11X15,40 | BGA119,7X17,50 | BGA119,7X17,50 | BGA119,7X17,50 | BGA165,11X15,40 | BGA165,11X15,40 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | NOT SPECIFIED | NOT SPECIFIED | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V | 2.5,3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.36 mm | 1.2 mm | 1.2 mm | 2.36 mm | 2.36 mm | 2.36 mm | 1.2 mm | 1.2 mm |
| 最大待机电流 | 0.03 A | 0.035 A | 0.03 A | 0.035 A | 0.035 A | 0.03 A | 0.03 A | 0.035 A |
| 最小待机电流 | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| 最大压摆率 | 0.34 mA | 0.33 mA | 0.36 mA | 0.35 mA | 0.33 mA | 0.32 mA | 0.34 mA | 0.35 mA |
| 最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1.27 mm | 1 mm | 1 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | NOT SPECIFIED | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 14 mm | 13 mm | 13 mm | 14 mm | 14 mm | 14 mm | 13 mm | 13 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否无铅 | 不含铅 | - | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
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