IC AC SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERAMIC, FP-14, Gate
| 参数名称 | 属性值 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | DFP, |
| Reach Compliance Code | unknown |
| 系列 | AC |
| JESD-30 代码 | R-GDFP-F14 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | NAND GATE |
| 功能数量 | 2 |
| 输入次数 | 4 |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟（tpd） | 9 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.032 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 6.2865 mm |
| Base Number Matches | 1 |
| 74AC20FCQR | 54AC20FMQB | 54AC20DMQB | HMTSW-209-06-G-Q-200-LA | 74AC20PCQR | |
|---|---|---|---|---|---|
| 描述 | IC AC SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERAMIC, FP-14, Gate | IC AC SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERAMIC, FP-14, Gate | IC AC SERIES, DUAL 4-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14, Gate | Board Stacking Connector, 18 Contact(s), 2 Row(s), Male, Right Angle, Solder Terminal, ROHS COMPLIANT | IC AC SERIES, DUAL 4-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14, Gate |
| 包装说明 | DFP, | DFP, FL14,.3 | DIP, DIP14,.3 | ROHS COMPLIANT | PLASTIC, DIP-14 |
| Reach Compliance Code | unknown | unknown | unknown | compliant | unknown |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 5.08 mm | 2.54 mm |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | - | - | National Semiconductor（TI ） |
| 系列 | AC | AC | AC | - | AC |
| JESD-30 代码 | R-GDFP-F14 | R-GDFP-F14 | R-GDIP-T14 | - | R-PDIP-T14 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | - | 50 pF |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | - | NAND GATE |
| 功能数量 | 2 | 2 | 2 | - | 2 |
| 输入次数 | 4 | 4 | 4 | - | 4 |
| 端子数量 | 14 | 14 | 14 | - | 14 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | - | 85 °C |
| 最低工作温度 | -40 °C | -55 °C | -55 °C | - | -40 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY |
| 封装代码 | DFP | DFP | DIP | - | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | IN-LINE | - | IN-LINE |
| 传播延迟（tpd） | 9 ns | 10 ns | 10 ns | - | 9 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 2.032 mm | 2.032 mm | 5.08 mm | - | 5.08 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | - | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | - | 2 V |
| 标称供电电压 (Vsup) | 3.3 V | 5 V | 5 V | - | 3.3 V |
| 表面贴装 | YES | YES | NO | - | NO |
| 技术 | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | MILITARY | - | INDUSTRIAL |
| 端子形式 | FLAT | FLAT | THROUGH-HOLE | - | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL |
| 宽度 | 6.2865 mm | 6.2865 mm | 7.62 mm | - | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | - | 1 |
| 是否Rohs认证 | - | 不符合 | 不符合 | 符合 | 不符合 |
| JESD-609代码 | - | e0 | e0 | e4 | e0 |
| 最大I（ol） | - | 0.012 A | 0.012 A | - | 0.012 A |
| 封装等效代码 | - | FL14,.3 | DIP14,.3 | - | DIP14,.3 |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 电源 | - | 3.3/5 V | 3.3/5 V | - | 3.3/5 V |
| Prop。Delay @ Nom-Sup | - | 11 ns | 11 ns | - | 10 ns |
| 施密特触发器 | - | NO | NO | - | NO |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
