Flash PLD, 25ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Cypress(赛普拉斯) |
| 零件包装代码 | QLCC |
| 包装说明 | CERAMIC, LCC-28 |
| 针数 | 28 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 30.3 MHz |
| JESD-30 代码 | S-CQCC-N28 |
| JESD-609代码 | e0 |
| 长度 | 11.43 mm |
| 专用输入次数 | 11 |
| I/O 线路数量 | 10 |
| 输入次数 | 22 |
| 输出次数 | 10 |
| 产品条款数 | 132 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC28,.45SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5 V |
| 可编程逻辑类型 | FLASH PLD |
| 传播延迟 | 25 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 1.9812 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 11.43 mm |
| Base Number Matches | 1 |
| 5962-89841043A | 5962-8984106KA | 5962-89841053A | 5962-8984105LA | 5962-8984110KA | |
|---|---|---|---|---|---|
| 描述 | Flash PLD, 25ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28 | Flash PLD, 10ns, PAL-Type, CMOS, CDFP24, CERPACK-24 | Flash PLD, 15ns, PAL-Type, CMOS, CQCC28, CERAMIC, LCC-28 | Flash PLD, 15ns, PAL-Type, CMOS, CDIP24, 0.300 INCH, CERDIP-24 | Flash PLD, 25ns, PAL-Type, CMOS, CDFP24, CERAMIC, DFP-24 |
| 厂商名称 | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
| 零件包装代码 | QLCC | DFP | QLCC | DIP | DFP |
| 包装说明 | CERAMIC, LCC-28 | DFP, FL24,.4 | CERAMIC, LCC-28 | 0.300 INCH, CERDIP-24 | DFP, FL24,.4 |
| 针数 | 28 | 24 | 28 | 24 | 24 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| 最大时钟频率 | 30.3 MHz | 76.9 MHz | 42 MHz | 50 MHz | 30.3 MHz |
| JESD-30 代码 | S-CQCC-N28 | R-GDFP-F24 | S-CQCC-N28 | R-GDIP-T24 | R-GDFP-F24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 专用输入次数 | 11 | 11 | 11 | 11 | 11 |
| I/O 线路数量 | 10 | 10 | 10 | 10 | 10 |
| 输入次数 | 22 | 22 | 22 | 22 | 22 |
| 输出次数 | 10 | 10 | 10 | 10 | 10 |
| 产品条款数 | 132 | 132 | 132 | 132 | 132 |
| 端子数量 | 28 | 24 | 28 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | DFP | QCCN | DIP | DFP |
| 封装等效代码 | LCC28,.45SQ | FL24,.4 | LCC28,.45SQ | DIP24,.3 | FL24,.4 |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | FLATPACK | CHIP CARRIER | IN-LINE | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD |
| 传播延迟 | 25 ns | 10 ns | 15 ns | 15 ns | 25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | MIL-STD-883 | 38535Q/M;38534H;883B | MIL-STD-883 |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | TIN LEAD |
| 端子形式 | NO LEAD | FLAT | NO LEAD | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - |
| 其他特性 | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS | - |
| 长度 | 11.43 mm | 15.367 mm | 11.43 mm | 31.877 mm | - |
| 峰值回流温度（摄氏度） | 240 | 240 | 240 | NOT SPECIFIED | - |
| 座面最大高度 | 1.9812 mm | 2.286 mm | 1.9812 mm | 5.08 mm | - |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | NOT SPECIFIED | - |
| 宽度 | 11.43 mm | 9.652 mm | 11.43 mm | 7.62 mm | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
