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IDT70V26S25JI

产品描述Dual-Port SRAM, 16KX16, 25ns, CMOS, PQCC84, PLASTIC, LCC-84
产品类别存储   
文件大小142KB,共17页
制造商IDT (Integrated Device Technology)
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IDT70V26S25JI概述

Dual-Port SRAM, 16KX16, 25ns, CMOS, PQCC84, PLASTIC, LCC-84

IDT70V26S25JI规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码LCC
包装说明QCCJ, LDCC84,1.2SQ
针数84
Reach Compliance Codenot_compliant
ECCN代码EAR99
Base Number Matches1

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HIGH-SPEED 3.3V
16K x 16 DUAL-PORT
STATIC RAM
Features
True Dual-Ported memory cells which allow simultaneous
reads of the same memory location
High-speed access
– Commercial: 25/35/55ns (max.)
Low-power operation
– IDT70V26S
Active: 300mW (typ.)
Standby: 3.3mW (typ.)
– IDT70V26L
Active: 300mW (typ.)
Standby: 660
µ
W (typ.)
Separate upper-byte and lower-byte control for multiplexed
bus compatibility
x
IDT70V26S/L
x
x
x
x
x
x
x
x
x
x
x
IDT70V26 easily expands data bus width to 32 bits or more
using the Master/Slave select when cascading more than
one device
M/S = V
IH
for
BUSY
output flag on Master
M/S = V
IL
for
BUSY
input on Slave
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
TTL-compatible, single 3.3V (±0.3V) power supply
Available in 84-pin PGA and PLCC
Industrial temperature range (-40°C to +85°C) is available
for selected speeds
Functional Block Diagram
R/W
L
UB
L
R/W
R
UB
R
LB
L
CE
L
OE
L
LB
R
CE
R
OE
R
I/O
8L
-I/O
15L
I/O
Control
I/O
0L
-I/O
7L
BUSY
L
A
13L
A
0L
(1,2)
I/O
8R
-I/O
15R
I/O
Control
I/O
0R
-I/O
7R
BUSY
R
Address
Decoder
14
(1,2)
MEMORY
ARRAY
14
Address
Decoder
A
13R
A
0R
CE
L
ARBITRATION
SEMAPHORE
LOGIC
CE
R
SEM
L
M/S
NOTES:
1. (MASTER):
BUSY
is output; (SLAVE):
BUSY
is input.
2.
BUSY
outputs are non-tri-stated push-pull.
SEM
R
2945 drw 01
JUNE 2000
1
©2000 Integrated Device Technology, Inc.
DSC 2945/13

IDT70V26S25JI相似产品对比

IDT70V26S25JI IDT70V26L35G IDT70V26L25JI IDT70V26L25J IDT70V26L25G IDT70V26S25GI IDT70V26L25GI
描述 Dual-Port SRAM, 16KX16, 25ns, CMOS, PQCC84, PLASTIC, LCC-84 Dual-Port SRAM, 16KX16, 35ns, CMOS, CPGA84, CERAMIC, PGA-84 Dual-Port SRAM, 16KX16, 25ns, CMOS, PQCC84, PLASTIC, LCC-84 Dual-Port SRAM, 16KX16, 25ns, CMOS, PQCC84, PLASTIC, LCC-84 Dual-Port SRAM, 16KX16, 25ns, CMOS, CPGA84, CERAMIC, PGA-84 Dual-Port SRAM, 16KX16, 25ns, CMOS, CPGA84, CERAMIC, PGA-84 Dual-Port SRAM, 16KX16, 25ns, CMOS, CPGA84, CERAMIC, PGA-84
是否无铅 含铅 含铅 含铅 含铅 含铅 不含铅 不含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 LCC PGA LCC LCC PGA PGA PGA
包装说明 QCCJ, LDCC84,1.2SQ PGA, PGA84M,11X11 QCCJ, LDCC84,1.2SQ QCCJ, LDCC84,1.2SQ PGA, PGA84M,11X11 PGA, PGA84M,11X11 PGA, PGA84M,11X11
针数 84 84 84 84 84 84 84
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 - 35 ns - - 25 ns 25 ns 25 ns
I/O 类型 - COMMON - - COMMON COMMON COMMON
JESD-30 代码 - S-CPGA-P84 - - S-CPGA-P84 S-CPGA-P84 S-CPGA-P84
JESD-609代码 - e0 - - e0 e0 e0
长度 - 30.6705 mm - - 30.6705 mm 30.6705 mm 30.6705 mm
内存密度 - 262144 bit - - 262144 bit 262144 bit 262144 bit
内存集成电路类型 - DUAL-PORT SRAM - - DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 - 16 - - 16 16 16
功能数量 - 1 - - 1 1 1
端口数量 - 2 - - 2 2 2
端子数量 - 84 - - 84 84 84
字数 - 16384 words - - 16384 words 16384 words 16384 words
字数代码 - 16000 - - 16000 16000 16000
工作模式 - ASYNCHRONOUS - - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 - 70 °C - - 70 °C 85 °C 85 °C
组织 - 16KX16 - - 16KX16 16KX16 16KX16
输出特性 - 3-STATE - - 3-STATE 3-STATE 3-STATE
封装主体材料 - CERAMIC, METAL-SEALED COFIRED - - CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 - PGA - - PGA PGA PGA
封装等效代码 - PGA84M,11X11 - - PGA84M,11X11 PGA84M,11X11 PGA84M,11X11
封装形状 - SQUARE - - SQUARE SQUARE SQUARE
封装形式 - GRID ARRAY - - GRID ARRAY GRID ARRAY GRID ARRAY
并行/串行 - PARALLEL - - PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) - 225 - - 225 NOT SPECIFIED NOT SPECIFIED
电源 - 3.3 V - - 3.3 V 3.3 V 3.3 V
认证状态 - Not Qualified - - Not Qualified Not Qualified Not Qualified
座面最大高度 - 5.207 mm - - 5.207 mm 5.207 mm 5.207 mm
最大待机电流 - 0.003 A - - 0.003 A 0.006 A 0.003 A
最小待机电流 - 3 V - - 3 V 3 V 3 V
最大压摆率 - 0.12 mA - - 0.14 mA 0.2 mA 0.185 mA
最大供电电压 (Vsup) - 3.6 V - - 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) - 3 V - - 3 V 3 V 3 V
标称供电电压 (Vsup) - 3.3 V - - 3.3 V 3.3 V 3.3 V
表面贴装 - NO - - NO NO NO
技术 - CMOS - - CMOS CMOS CMOS
温度等级 - COMMERCIAL - - COMMERCIAL INDUSTRIAL INDUSTRIAL
端子面层 - Tin/Lead (Sn/Pb) - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 - PIN/PEG - - PIN/PEG PIN/PEG PIN/PEG
端子节距 - 2.54 mm - - 2.54 mm 2.54 mm 2.54 mm
端子位置 - PERPENDICULAR - - PERPENDICULAR PERPENDICULAR PERPENDICULAR
处于峰值回流温度下的最长时间 - 30 - - 30 NOT SPECIFIED NOT SPECIFIED
宽度 - 30.6705 mm - - 30.6705 mm 30.6705 mm 30.6705 mm

 
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