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IDT70V26L25G

产品描述Dual-Port SRAM, 16KX16, 25ns, CMOS, CPGA84, CERAMIC, PGA-84
产品类别存储    存储   
文件大小142KB,共17页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT70V26L25G概述

Dual-Port SRAM, 16KX16, 25ns, CMOS, CPGA84, CERAMIC, PGA-84

IDT70V26L25G规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码PGA
包装说明PGA, PGA84M,11X11
针数84
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间25 ns
其他特性SEMAPHORE; AUTOMATIC POWER-DOWN
I/O 类型COMMON
JESD-30 代码S-CPGA-P84
JESD-609代码e0
长度30.6705 mm
内存密度262144 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度16
功能数量1
端口数量2
端子数量84
字数16384 words
字数代码16000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织16KX16
输出特性3-STATE
可输出YES
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码PGA
封装等效代码PGA84M,11X11
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)225
电源3.3 V
认证状态Not Qualified
座面最大高度5.207 mm
最大待机电流0.003 A
最小待机电流3 V
最大压摆率0.14 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式PIN/PEG
端子节距2.54 mm
端子位置PERPENDICULAR
处于峰值回流温度下的最长时间30
宽度30.6705 mm

文档预览

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HIGH-SPEED 3.3V
16K x 16 DUAL-PORT
STATIC RAM
Features
True Dual-Ported memory cells which allow simultaneous
reads of the same memory location
High-speed access
– Commercial: 25/35/55ns (max.)
Low-power operation
– IDT70V26S
Active: 300mW (typ.)
Standby: 3.3mW (typ.)
– IDT70V26L
Active: 300mW (typ.)
Standby: 660
µ
W (typ.)
Separate upper-byte and lower-byte control for multiplexed
bus compatibility
x
IDT70V26S/L
x
x
x
x
x
x
x
x
x
x
x
IDT70V26 easily expands data bus width to 32 bits or more
using the Master/Slave select when cascading more than
one device
M/S = V
IH
for
BUSY
output flag on Master
M/S = V
IL
for
BUSY
input on Slave
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling
between ports
Fully asynchronous operation from either port
TTL-compatible, single 3.3V (±0.3V) power supply
Available in 84-pin PGA and PLCC
Industrial temperature range (-40°C to +85°C) is available
for selected speeds
Functional Block Diagram
R/W
L
UB
L
R/W
R
UB
R
LB
L
CE
L
OE
L
LB
R
CE
R
OE
R
I/O
8L
-I/O
15L
I/O
Control
I/O
0L
-I/O
7L
BUSY
L
A
13L
A
0L
(1,2)
I/O
8R
-I/O
15R
I/O
Control
I/O
0R
-I/O
7R
BUSY
R
Address
Decoder
14
(1,2)
MEMORY
ARRAY
14
Address
Decoder
A
13R
A
0R
CE
L
ARBITRATION
SEMAPHORE
LOGIC
CE
R
SEM
L
M/S
NOTES:
1. (MASTER):
BUSY
is output; (SLAVE):
BUSY
is input.
2.
BUSY
outputs are non-tri-stated push-pull.
SEM
R
2945 drw 01
JUNE 2000
1
©2000 Integrated Device Technology, Inc.
DSC 2945/13

IDT70V26L25G相似产品对比

IDT70V26L25G IDT70V26L35G IDT70V26S25JI IDT70V26L25JI IDT70V26L25J IDT70V26S25GI IDT70V26L25GI
描述 Dual-Port SRAM, 16KX16, 25ns, CMOS, CPGA84, CERAMIC, PGA-84 Dual-Port SRAM, 16KX16, 35ns, CMOS, CPGA84, CERAMIC, PGA-84 Dual-Port SRAM, 16KX16, 25ns, CMOS, PQCC84, PLASTIC, LCC-84 Dual-Port SRAM, 16KX16, 25ns, CMOS, PQCC84, PLASTIC, LCC-84 Dual-Port SRAM, 16KX16, 25ns, CMOS, PQCC84, PLASTIC, LCC-84 Dual-Port SRAM, 16KX16, 25ns, CMOS, CPGA84, CERAMIC, PGA-84 Dual-Port SRAM, 16KX16, 25ns, CMOS, CPGA84, CERAMIC, PGA-84
是否无铅 含铅 含铅 含铅 含铅 含铅 不含铅 不含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 PGA PGA LCC LCC LCC PGA PGA
包装说明 PGA, PGA84M,11X11 PGA, PGA84M,11X11 QCCJ, LDCC84,1.2SQ QCCJ, LDCC84,1.2SQ QCCJ, LDCC84,1.2SQ PGA, PGA84M,11X11 PGA, PGA84M,11X11
针数 84 84 84 84 84 84 84
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 25 ns 35 ns - - - 25 ns 25 ns
I/O 类型 COMMON COMMON - - - COMMON COMMON
JESD-30 代码 S-CPGA-P84 S-CPGA-P84 - - - S-CPGA-P84 S-CPGA-P84
JESD-609代码 e0 e0 - - - e0 e0
长度 30.6705 mm 30.6705 mm - - - 30.6705 mm 30.6705 mm
内存密度 262144 bit 262144 bit - - - 262144 bit 262144 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM - - - DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 16 16 - - - 16 16
功能数量 1 1 - - - 1 1
端口数量 2 2 - - - 2 2
端子数量 84 84 - - - 84 84
字数 16384 words 16384 words - - - 16384 words 16384 words
字数代码 16000 16000 - - - 16000 16000
工作模式 ASYNCHRONOUS ASYNCHRONOUS - - - ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C - - - 85 °C 85 °C
组织 16KX16 16KX16 - - - 16KX16 16KX16
输出特性 3-STATE 3-STATE - - - 3-STATE 3-STATE
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED - - - CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装代码 PGA PGA - - - PGA PGA
封装等效代码 PGA84M,11X11 PGA84M,11X11 - - - PGA84M,11X11 PGA84M,11X11
封装形状 SQUARE SQUARE - - - SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY - - - GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL - - - PARALLEL PARALLEL
峰值回流温度(摄氏度) 225 225 - - - NOT SPECIFIED NOT SPECIFIED
电源 3.3 V 3.3 V - - - 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified - - - Not Qualified Not Qualified
座面最大高度 5.207 mm 5.207 mm - - - 5.207 mm 5.207 mm
最大待机电流 0.003 A 0.003 A - - - 0.006 A 0.003 A
最小待机电流 3 V 3 V - - - 3 V 3 V
最大压摆率 0.14 mA 0.12 mA - - - 0.2 mA 0.185 mA
最大供电电压 (Vsup) 3.6 V 3.6 V - - - 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V - - - 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V - - - 3.3 V 3.3 V
表面贴装 NO NO - - - NO NO
技术 CMOS CMOS - - - CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL - - - INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 PIN/PEG PIN/PEG - - - PIN/PEG PIN/PEG
端子节距 2.54 mm 2.54 mm - - - 2.54 mm 2.54 mm
端子位置 PERPENDICULAR PERPENDICULAR - - - PERPENDICULAR PERPENDICULAR
处于峰值回流温度下的最长时间 30 30 - - - NOT SPECIFIED NOT SPECIFIED
宽度 30.6705 mm 30.6705 mm - - - 30.6705 mm 30.6705 mm

 
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