16-BIT, 50MHz, OTHER DSP, CQCC68, CERAMIC, LCC-68
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | LCC |
| 包装说明 | QCCJ, |
| 针数 | 68 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.2.C |
| 地址总线宽度 | 16 |
| 桶式移位器 | YES |
| 位大小 | 32 |
| 边界扫描 | NO |
| 最大时钟频率 | 50 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FIXED POINT |
| 集成缓存 | NO |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-CQCC-J68 |
| 长度 | 24.13 mm |
| 低功率模式 | NO |
| 端子数量 | 68 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 3.68 mm |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 24.13 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| 5962-8861902ZX | 5962-8861901XX | 5962-8861901ZX | 5962-8861902XX | SMJ320C26FDM | TMS320C28FZL | TMS320C28FNL | TMS320C28PHL | SMJ320C26FJM | SMJ320C26GBM | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 16-BIT, 50MHz, OTHER DSP, CQCC68, CERAMIC, LCC-68 | 16-BIT, 40MHz, OTHER DSP, CPGA68, CERAMIC, PGA-68 | 16-BIT, 40MHz, OTHER DSP, CQCC68, CERAMIC, LCC-68 | 16-BIT, 50MHz, OTHER DSP, CPGA68, CERAMIC, PGA-68 | 16-BIT, 40MHz, OTHER DSP, CQCC68 | IC 16-BIT, 40.96 MHz, OTHER DSP, CQCC68, Digital Signal Processor | 16-BIT, 40.96MHz, OTHER DSP, PQCC68 | 16-BIT, 40.96MHz, OTHER DSP, PQFP80 | 16-BIT, 40MHz, OTHER DSP, CQCC68 | 16-BIT, 40MHz, OTHER DSP, CPGA68 |
| 包装说明 | QCCJ, | PGA, | QCCJ, | PGA, | QCCN, LCC68,.95SQ | QCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | QFP, QFP80,.7X.9,32 | QCCJ, LDCC68,1.0SQ | PGA, PGA68,11X11 |
| Reach Compliance Code | compliant | compli | compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli | _compli |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.2.C | 3A001.A.2.C |
| 地址总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 桶式移位器 | YES | YES | YES | YES | NO | NO | NO | NO | NO | NO |
| 位大小 | 32 | 32 | 32 | 32 | 16 | 16 | 16 | 16 | 16 | 16 |
| 边界扫描 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 最大时钟频率 | 50 MHz | 40 MHz | 40 MHz | 50 MHz | 40 MHz | 40.96 MHz | 40.96 MHz | 40.96 MHz | 40 MHz | 40 MHz |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 集成缓存 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-CQCC-J68 | S-CPGA-P68 | S-CQCC-J68 | S-CPGA-P68 | S-CQCC-N68 | S-GQCC-J68 | S-PQCC-J68 | R-PQFP-G80 | S-CQCC-J68 | S-CPGA-P68 |
| 低功率模式 | NO | NO | NO | NO | YES | YES | YES | YES | YES | YES |
| 端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 80 | 68 | 68 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | - | - | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ | PGA | QCCJ | PGA | QCCN | QCCJ | QCCJ | QFP | QCCJ | PGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | GRID ARRAY | CHIP CARRIER | GRID ARRAY | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | FLATPACK | CHIP CARRIER | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | YES | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| 端子形式 | J BEND | PIN/PEG | J BEND | PIN/PEG | NO LEAD | J BEND | J BEND | GULL WING | J BEND | PIN/PEG |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | PERPENDICULAR | QUAD | PERPENDICULAR | QUAD | QUAD | QUAD | QUAD | QUAD | PERPENDICULAR |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| 厂商名称 | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 长度 | 24.13 mm | 24.38 mm | 24.13 mm | 24.38 mm | 24.13 mm | 23.94 mm | 24.2316 mm | 20 mm | 24.13 mm | - |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | 38535Q/M;38534H;883B | - | - | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 座面最大高度 | 3.68 mm | 2.23 mm | 3.68 mm | 2.23 mm | 3.05 mm | 4.57 mm | 4.57 mm | 3.1 mm | 3.68 mm | - |
| 宽度 | 24.13 mm | 24.38 mm | 24.13 mm | 24.38 mm | 24.13 mm | 23.94 mm | 24.2316 mm | 14 mm | 24.13 mm | - |
| 是否Rohs认证 | - | - | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 其他特性 | - | - | - | - | PID CONTROL; 1536 WORDS DATA/PROG RAM | PID CONTROL; 256 WORDS DATA/PROG RAM | PID CONTROL; 256 WORDS DATA/PROG RAM | PID CONTROL; 256 WORDS DATA/PROG RAM | PID CONTROL; 1536 WORDS DATA/PROG RAM | PID CONTROL; 1536 WORDS DATA/PROG RAM |
| 外部中断装置数量 | - | - | - | - | 3 | 4 | 4 | 4 | 3 | 3 |
| 串行 I/O 数 | - | - | - | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 计时器数量 | - | - | - | - | 1 | 1 | 1 | 1 | 1 | 1 |
| 片上数据RAM宽度 | - | - | - | - | 16 | 16 | 16 | 16 | 16 | 16 |
| 片上程序ROM宽度 | - | - | - | - | 16 | 16 | 16 | 16 | 16 | 16 |
| 封装等效代码 | - | - | - | - | LCC68,.95SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | QFP80,.7X.9,32 | LDCC68,1.0SQ | PGA68,11X11 |
| 电源 | - | - | - | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| RAM（字数） | - | - | - | - | 1568 | 544 | 544 | 544 | 1568 | 1568 |
| ROM可编程性 | - | - | - | - | MROM | MROM | MROM | MROM | MROM | MROM |
| 最大压摆率 | - | - | - | - | 185 mA | 185 mA | 185 mA | 185 mA | 185 mA | 185 mA |
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