电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

IDT72V3670L7-5PFGI

产品描述FIFO, 8KX36, 5ns, Synchronous, CMOS, PQFP128, GREEN, PLASTIC, TQFP-128
产品类别存储    存储   
文件大小366KB,共46页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 选型对比 全文预览

IDT72V3670L7-5PFGI概述

FIFO, 8KX36, 5ns, Synchronous, CMOS, PQFP128, GREEN, PLASTIC, TQFP-128

IDT72V3670L7-5PFGI规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明LFQFP, QFP128,.63X.87,20
针数128
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间5 ns
其他特性RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
最大时钟频率 (fCLK)133.3 MHz
周期时间7.5 ns
JESD-30 代码R-PQFP-G128
JESD-609代码e3
长度20 mm
内存密度294912 bit
内存集成电路类型OTHER FIFO
内存宽度36
湿度敏感等级3
功能数量1
端子数量128
字数8192 words
字数代码8000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织8KX36
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装等效代码QFP128,.63X.87,20
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源3.3 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.015 A
最大压摆率0.04 mA
最大供电电压 (Vsup)3.45 V
最小供电电压 (Vsup)3.15 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn) - annealed
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度14 mm
Base Number Matches1

文档预览

下载PDF文档
3.3V HIGH-DENSITY SUPERSYNC™ II 36-BIT FIFO
1,024 x 36, 2,048 x 36
4,096 x 36, 8,192 x 36
16,384 x 36, 32,768 x 36
IDT72V3640, IDT72V3650
IDT72V3660, IDT72V3670
IDT72V3680, IDT72V3690
Zero latency retransmit
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Program programmable flags by either serial or parallel means
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
JTAG port, provided for Boundary Scan function (PBGA Only)
Independent Read and Write Clocks (permit reading and writing
simultaneously)
Available in a 128-pin Thin Quad Flat Pack (TQFP) or a 144-pin Plastic
Ball Grid Array (PBGA) (with additional features)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts available, see ordering information
FEATURES:
Choose among the following memory organizations:
Commercial
IDT72V3640
1,024 x 36
IDT72V3650
2,048 x 36
IDT72V3660
4,096 x 36
IDT72V3670
8,192 x 36
IDT72V3680
16,384 x 36
IDT72V3690
32,768 x 36
Up to 166 MHz Operation of the Clocks
User selectable Asynchronous read and/or write ports (PBGA Only)
User selectable input and output port bus-sizing
- x36 in to x36 out
- x36 in to x18 out
- x36 in to x9 out
- x18 in to x36 out
- x9 in to x36 out
Pin to Pin compatible to the higher density of IDT72V36100 and
IDT72V36110
Big-Endian/Little-Endian user selectable byte representation
5V input tolerant
Fixed, low first word latency
FUNCTIONAL BLOCK DIAGRAM
*Available on the PBGA package only.
D
0
-D
n
(x36, x18 or x9)
WEN
WCLK/WR
*
INPUT REGISTER
LD SEN
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
*
ASYW
WRITE CONTROL
LOGIC
RAM ARRAY
1,024 x 36, 2,048 x 36
4,096 x 36, 8,192 x 36
16,384 x 36, 32,768 x 36
FLAG
LOGIC
WRITE POINTER
READ POINTER
BE
IP
BM
IW
OW
MRS
PRS
TCK
*
TRST
*
TMS
**
TDI
*
TDO
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
RM
ASYR
*
RCLK/RD
JTAG CONTROL
(BOUNDARY SCAN)
*
OE
Q
0
-Q
n
(x36, x18 or x9)
REN
*
4667 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The SuperSync II FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©
2008 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
OCTOBER 22, 2008
DSC-4667/16

IDT72V3670L7-5PFGI相似产品对比

IDT72V3670L7-5PFGI IDT72V3690L6BBG8 IDT72V3690L6BBG IDT72V3690L6PFG8 IDT72V3690L7-5PFGI IDT72V3670L6PFG8
描述 FIFO, 8KX36, 5ns, Synchronous, CMOS, PQFP128, GREEN, PLASTIC, TQFP-128 FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144 FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-144 FIFO, 32KX36, 4ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128 FIFO, 32KX36, 5ns, Synchronous, CMOS, PQFP128, GREEN, PLASTIC, TQFP-128 FIFO, 8KX36, 4ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP BGA BGA QFP QFP QFP
包装说明 LFQFP, QFP128,.63X.87,20 BGA, BGA, BGA144,12X12,40 LFQFP, LFQFP, QFP128,.63X.87,20 LFQFP,
针数 128 144 144 128 128 128
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 5 ns 4 ns 4 ns 4 ns 5 ns 4 ns
其他特性 RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
周期时间 7.5 ns 6 ns 6 ns 6 ns 7.5 ns 6 ns
JESD-30 代码 R-PQFP-G128 S-PBGA-B144 S-PBGA-B144 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128
JESD-609代码 e3 e1 e1 e3 e3 e3
长度 20 mm 13 mm 13 mm 20 mm 20 mm 20 mm
内存密度 294912 bit 1179648 bit 1179648 bit 1179648 bit 1179648 bit 294912 bit
内存宽度 36 36 36 36 36 36
湿度敏感等级 3 3 3 3 3 3
功能数量 1 1 1 1 1 1
端子数量 128 144 144 128 128 128
字数 8192 words 32768 words 32768 words 32768 words 32768 words 8192 words
字数代码 8000 32000 32000 32000 32000 8000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 70 °C 70 °C 70 °C 85 °C 70 °C
组织 8KX36 32KX36 32KX36 32KX36 32KX36 8KX36
可输出 YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP BGA BGA LFQFP LFQFP LFQFP
封装形状 RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.97 mm 1.97 mm 1.6 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V
最小供电电压 (Vsup) 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 Matte Tin (Sn) - annealed TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu) MATTE TIN Matte Tin (Sn) - annealed MATTE TIN
端子形式 GULL WING BALL BALL GULL WING GULL WING GULL WING
端子节距 0.5 mm 1 mm 1 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD BOTTOM BOTTOM QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 14 mm 13 mm 13 mm 14 mm 14 mm 14 mm
Base Number Matches 1 1 1 1 1 -
无线电通信
RT 无线电通信怎么入门啊~~~...
f33 嵌入式系统
LCD显示SD卡中的图片,出现一些问题
D卡中有三个照片,每次照片出来总有点小问题 经过询问别人 应该时转换时 要实现屏幕复位 我想问下 如何设置屏幕复位信号 我通过写了一个类似与 rst_n的信号,但是不知道将那些 信号归0,行 ......
阿宝阿阿宝 FPGA/CPLD
MSP430系列中功耗最低的是?
请问MSP430系列单片机里面,功耗最低的是那款单片机?MSP430FR5969这款单片机的功耗怎么样? ...
henry 微控制器 MCU
TinyM0开发板的20针脚位定义?
自己收到ZLG的TinyM0的学习板的CK100是采用LPC1343F,通过20针连接LPC1114,不知道这个20针是什么定义的! 是标准的JTAG脚位吗?...
蓝雨夜 NXP MCU
使用STM32CubeMX生成MCU工程,简单3步连上云端,轻松打造物联网应用
本帖最后由 dql2016 于 2016-11-11 20:18 编辑 降低开发门槛一直是我们追求的目标,目前机智云自助生成的STM32方案工程采用的是STM32的标准库函数(又称STD库,对于STM32F103系列最新版本为 ......
dql2016 stm32/stm8
用VC++6.0实现PC机与单片机之间的串口数据交换
工业控制领域(如DCS系统),经常涉及到串行通信问题。为了实现微机和单片机之间的数据交换,人们用各种不同方法实现串行通信,如DOS下采用汇编语言或C语言,但在Windows 环境下却存在一些困难 ......
rain 单片机

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1708  1021  582  1013  316  35  21  12  7  17 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved