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IDT72V3670L6PFG8

产品描述FIFO, 8KX36, 4ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128
产品类别存储    存储   
文件大小366KB,共46页
制造商IDT (Integrated Device Technology)
标准  
下载文档 详细参数 选型对比 全文预览

IDT72V3670L6PFG8概述

FIFO, 8KX36, 4ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128

IDT72V3670L6PFG8规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明LFQFP,
针数128
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间4 ns
其他特性RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
周期时间6 ns
JESD-30 代码R-PQFP-G128
JESD-609代码e3
长度20 mm
内存密度294912 bit
内存宽度36
湿度敏感等级3
功能数量1
端子数量128
字数8192 words
字数代码8000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织8KX36
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)3.45 V
最小供电电压 (Vsup)3.15 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层MATTE TIN
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度14 mm

文档预览

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3.3V HIGH-DENSITY SUPERSYNC™ II 36-BIT FIFO
1,024 x 36, 2,048 x 36
4,096 x 36, 8,192 x 36
16,384 x 36, 32,768 x 36
IDT72V3640, IDT72V3650
IDT72V3660, IDT72V3670
IDT72V3680, IDT72V3690
Zero latency retransmit
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Program programmable flags by either serial or parallel means
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
Easily expandable in depth and width
JTAG port, provided for Boundary Scan function (PBGA Only)
Independent Read and Write Clocks (permit reading and writing
simultaneously)
Available in a 128-pin Thin Quad Flat Pack (TQFP) or a 144-pin Plastic
Ball Grid Array (PBGA) (with additional features)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts available, see ordering information
FEATURES:
Choose among the following memory organizations:
Commercial
IDT72V3640
1,024 x 36
IDT72V3650
2,048 x 36
IDT72V3660
4,096 x 36
IDT72V3670
8,192 x 36
IDT72V3680
16,384 x 36
IDT72V3690
32,768 x 36
Up to 166 MHz Operation of the Clocks
User selectable Asynchronous read and/or write ports (PBGA Only)
User selectable input and output port bus-sizing
- x36 in to x36 out
- x36 in to x18 out
- x36 in to x9 out
- x18 in to x36 out
- x9 in to x36 out
Pin to Pin compatible to the higher density of IDT72V36100 and
IDT72V36110
Big-Endian/Little-Endian user selectable byte representation
5V input tolerant
Fixed, low first word latency
FUNCTIONAL BLOCK DIAGRAM
*Available on the PBGA package only.
D
0
-D
n
(x36, x18 or x9)
WEN
WCLK/WR
*
INPUT REGISTER
LD SEN
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
*
ASYW
WRITE CONTROL
LOGIC
RAM ARRAY
1,024 x 36, 2,048 x 36
4,096 x 36, 8,192 x 36
16,384 x 36, 32,768 x 36
FLAG
LOGIC
WRITE POINTER
READ POINTER
BE
IP
BM
IW
OW
MRS
PRS
TCK
*
TRST
*
TMS
**
TDI
*
TDO
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
RM
ASYR
*
RCLK/RD
JTAG CONTROL
(BOUNDARY SCAN)
*
OE
Q
0
-Q
n
(x36, x18 or x9)
REN
*
4667 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The SuperSync II FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©
2008 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
OCTOBER 22, 2008
DSC-4667/16

IDT72V3670L6PFG8相似产品对比

IDT72V3670L6PFG8 IDT72V3670L7-5PFGI IDT72V3690L6BBG8 IDT72V3690L6BBG IDT72V3690L6PFG8 IDT72V3690L7-5PFGI
描述 FIFO, 8KX36, 4ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128 FIFO, 8KX36, 5ns, Synchronous, CMOS, PQFP128, GREEN, PLASTIC, TQFP-128 FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, PLASTIC, BGA-144 FIFO, 32KX36, 4ns, Synchronous, CMOS, PBGA144, 13 X 13 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-144 FIFO, 32KX36, 4ns, Synchronous, CMOS, PQFP128, PLASTIC, TQFP-128 FIFO, 32KX36, 5ns, Synchronous, CMOS, PQFP128, GREEN, PLASTIC, TQFP-128
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP QFP BGA BGA QFP QFP
包装说明 LFQFP, LFQFP, QFP128,.63X.87,20 BGA, BGA, BGA144,12X12,40 LFQFP, LFQFP, QFP128,.63X.87,20
针数 128 128 144 144 128 128
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 4 ns 5 ns 4 ns 4 ns 4 ns 5 ns
其他特性 RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
周期时间 6 ns 7.5 ns 6 ns 6 ns 6 ns 7.5 ns
JESD-30 代码 R-PQFP-G128 R-PQFP-G128 S-PBGA-B144 S-PBGA-B144 R-PQFP-G128 R-PQFP-G128
JESD-609代码 e3 e3 e1 e1 e3 e3
长度 20 mm 20 mm 13 mm 13 mm 20 mm 20 mm
内存密度 294912 bit 294912 bit 1179648 bit 1179648 bit 1179648 bit 1179648 bit
内存宽度 36 36 36 36 36 36
湿度敏感等级 3 3 3 3 3 3
功能数量 1 1 1 1 1 1
端子数量 128 128 144 144 128 128
字数 8192 words 8192 words 32768 words 32768 words 32768 words 32768 words
字数代码 8000 8000 32000 32000 32000 32000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 85 °C 70 °C 70 °C 70 °C 85 °C
组织 8KX36 8KX36 32KX36 32KX36 32KX36 32KX36
可输出 YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP BGA BGA LFQFP LFQFP
封装形状 RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.97 mm 1.97 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V 3.45 V
最小供电电压 (Vsup) 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V 3.15 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL
端子面层 MATTE TIN Matte Tin (Sn) - annealed TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu) MATTE TIN Matte Tin (Sn) - annealed
端子形式 GULL WING GULL WING BALL BALL GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 1 mm 1 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD BOTTOM BOTTOM QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 14 mm 14 mm 13 mm 13 mm 14 mm 14 mm
Base Number Matches - 1 1 1 1 1
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