Programmable Logic Device
参数名称 | 属性值 |
厂商名称 | Integrated Circuit Systems(IDT ) |
包装说明 | , |
Reach Compliance Code | unknown |
Base Number Matches | 1 |
PEEL20CG10CI20 | PEEL20CG10C-25 | PEEL20CG10CI25 | PEEL20CG10PI35 | PEEL20CG10J-35 | PEEL20CG10J-20 | PEEL20CG10C-20 | PEEL20CG10P-35 | PEEL20CG10C-35 | |
---|---|---|---|---|---|---|---|---|---|
描述 | Programmable Logic Device | EE PLD, 25ns, PAL-Type, CMOS, CDIP24 | Programmable Logic Device | Programmable Logic Device | EE PLD, 35ns, PAL-Type, CMOS, PQCC24 | EE PLD, 20ns, PAL-Type, CMOS, PQCC24 | EE PLD, 20ns, PAL-Type, CMOS, CDIP24 | EE PLD, 35ns, PAL-Type, CMOS, PDIP24 | EE PLD, 35ns, PAL-Type, CMOS, CDIP24 |
厂商名称 | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) | Integrated Circuit Systems(IDT ) |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
是否Rohs认证 | - | 不符合 | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
架构 | - | PAL-TYPE | - | - | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
最大时钟频率 | - | 33.3 MHz | - | - | 20 MHz | 37 MHz | 37 MHz | 20 MHz | 20 MHz |
JESD-30 代码 | - | R-XDIP-T24 | - | - | S-PQCC-J24 | S-PQCC-J24 | R-XDIP-T24 | R-PDIP-T24 | R-XDIP-T24 |
JESD-609代码 | - | e0 | - | - | e0 | e0 | e0 | e0 | e0 |
输入次数 | - | 22 | - | - | 22 | 22 | 22 | 22 | 22 |
输出次数 | - | 10 | - | - | 10 | 10 | 10 | 10 | 10 |
产品条款数 | - | 92 | - | - | 92 | 92 | 92 | 92 | 92 |
端子数量 | - | 24 | - | - | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | - | 70 °C | - | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
输出函数 | - | MACROCELL | - | - | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | - | CERAMIC | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC |
封装代码 | - | DIP | - | - | QCCJ | QCCJ | DIP | DIP | DIP |
封装等效代码 | - | DIP24,.3 | - | - | LDCC24,.44SQ | LDCC24,.44SQ | DIP24,.3 | DIP24,.3 | DIP24,.3 |
封装形状 | - | RECTANGULAR | - | - | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | IN-LINE | - | - | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE |
电源 | - | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | 5 V |
可编程逻辑类型 | - | EE PLD | - | - | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
传播延迟 | - | 25 ns | - | - | 35 ns | 20 ns | 20 ns | 35 ns | 35 ns |
认证状态 | - | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 | - | 5 V | - | - | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | - | NO | - | - | YES | YES | NO | NO | NO |
技术 | - | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | COMMERCIAL | - | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | - | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | - | THROUGH-HOLE | - | - | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | - | 2.54 mm | - | - | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | - | DUAL | - | - | QUAD | QUAD | DUAL | DUAL | DUAL |
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