Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
*As per JEDEC51 standard (multilayer board).
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics
(Note 2)
TSSOP
Junction-to-Ambient Thermal Resistance (B
JA
) .......38.3NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................3NC/W
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) .......... 35
N
C/W
Junction-to-Case Thermal Resistance (B
JC
) ..............2.7NC/W
Note 1:
Self-protected against transient voltages exceeding these limits for
≤
50ns under normal operation and loads up to the
maximum rated output current.
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V
SUP
= V
SUPSW
= 14V, V
EN
= 14V, L1 = 2.2FH, C
IN
= 4.7FF, C
OUT
= 22FF, C
BIAS
= 1FF, C
BST
= 0.1FF, R
FOSC
= 12kI,
T
A
= T
J
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.)
PARAMETER
Supply Voltage
Load Dump Event Supply
Voltage
SYMBOL
V
SUP,
V
SUPSW
V
SUP_LD
t
LD
< 1s
Standby mode, no load, V
OUT
= 5V,
V
FSYNC
= 0V
Standby mode, no load, V
OUT
= 3.3V,
V
FSYNC
= 0V
V
EN
= 0V
V
SUP
= V
SUPSW
= 6V to 42V,
I
BIAS
= 0 to 10mA
V
BIAS
rising
4.7
2.95
28
22
5
5
3.15
450
+175
15
CONDITIONS
MIN
3.5
TYP
MAX
36
42
40
FA
35
8
5.4
3.40
650
FA
V
V
mV
NC
NC
UNITS
V
V
Supply Current
I
SUP_STANDBY
Shutdown Supply Current
BIAS Regulator Voltage
BIAS Undervoltage Lockout
BIAS Undervoltage-Lockout
Hysteresis
Thermal Shutdown Threshold
Thermal Shutdown Threshold
Hysteresis
I
SHDN
V
BIAS
V
UVBIAS
www.maximintegrated.com
Maxim Integrated
│
2
MAX16936/MAX16938
36V, 220kHz to 2.2MHz Step-Down Converters
with 28µA Quiescent Current
Electrical Characteristics (continued)
(V
SUP
= V
SUPSW
= 14V, V
EN
= 14V, L1 = 2.2FH, C
IN
= 4.7FF, C
OUT
= 22FF, C
BIAS
= 1FF, C
BST
= 0.1FF, R
FOSC
= 12kI,
T
A
= T
J
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.)
PARAMETER
OUTPUT VOLTAGE (OUT)
V
OUT_5V
FPWM Mode Output Voltage
(Note 3)
V
OUT_3.3V
V
OUT_5V
V
OUT_3.3V
V
FB
= V
BIAS,
6V < V
SUPSW
< 36V,
MAX16936/38/38____A/V+, fixed-
frequency mode
V
FB
= V
BIAS,
6V < V
SUPSW
< 36V,
MAX16936/38____B/V+, fixed-frequency
mode
No load, V
FB
= V
BIAS,
MAX16936/38____A/V+, skip mode
V
FB
= V
BIAS,
6V < V
SUPSW
< 36V,
MAX16936/38____B/V+, skip mode
V
FB
= V
BIAS
, 300mA < I
LOAD
< 2.5A
V
FB
= V
BIAS
, 6V < V
SUPSW
< 36V
I
BST_ON
BST Input Current
LX Current Limit
LX Rise Time
Skip-Mode Current Threshold
Spread Spectrum
High-Side Switch
On-Resistance
High-Side Switch Leakage
Current
Low-Side Switch
On-Resistance
Low-Side Switch
Leakage Current
TRANSCONDUCTANCE AMPLIFIER (COMP)
FB Input Current
FB Regulation Voltage
FB Line Regulation
Transconductance
(from FB to COMP)
Minimum On-Time
Maximum Duty Cycle
I
FB
V
FB
DV
LINE
g
m
t
ON_MIN
DC
MAX
FB connected to an external resistor-
divider, 6V < V
SUPSW
< 36V (Note 5)
6V < V
SUPSW
< 36V
V
FB
= 1V, V
BIAS
= 5V
(Note 4)
0.99
20
1.0
0.02
700
80
98
100
1.015
nA
V
%/V
FS
ns
%
R
ON_L
R
ON_H
I
SKIP_TH
I
BST_OFF
I
LX
High-side MOSFET on, V
BST
- V
LX
= 5V
High-side MOSFET off, V
BST
- V
LX
= 5V,
T
A
= +25°C
Peak inductor current
R
FOSC
= 12kW
T
A
= +25°C
MAX16936
MAX16938
150
200
3
3.75
4
300
400
f
OSC
Q6%
100
1
1.5
220
3
3
1
mI
FA
I
FA
400
500
1
4.9
5
5.1
V
3.234
4.9
3.234
3.3
5
3.3
0.5
0.02
1.5
2
5
4.5
3.366
5.15
V
3.4
%
%/V
mA
FA
A
ns
mA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Skip-Mode Output Voltage
(Note 4)
Load Regulation
Line Regulation
Spread spectrum enabled
I
LX
= 1A, V
BIAS
= 5V
High-side MOSFET off, V
SUP
= 36V,
V
LX
= 0V, T
A
= +25NC
I
LX
= 0.2A, V
BIAS
= 5V
V
LX
= 36V, T
A
= +25NC
www.maximintegrated.com
Maxim Integrated
│
3
MAX16936/MAX16938
36V, 220kHz to 2.2MHz Step-Down Converters
with 28µA Quiescent Current
Electrical Characteristics (continued)
(V
SUP
= V
SUPSW
= 14V, V
EN
= 14V, L1 = 2.2FH, C
IN
= 4.7FF, C
OUT
= 22FF, C
BIAS
= 1FF, C
BST
= 0.1FF, R
FOSC
= 12kI,
T
A
= T
J
= -40NC to +125NC, unless otherwise noted. Typical values are at T
A
= +25NC.)
PARAMETER
OSCILLATOR FREQUENCY
Oscillator Frequency
EXTERNAL CLOCK INPUT (FSYNC)
External Input Clock
Acquisition Time
External Input Clock
Frequency
External Input Clock High
Threshold
External Input Clock Low
Threshold
Soft-Start Time
ENABLE INPUT (EN)
Enable Input High Threshold
Enable Input Low Threshold
Enable Threshold-Voltage
Hysteresis
Enable Input Current
POWER GOOD (PGOOD)
PGOOD
Switching Level
PGOOD
Debounce Time
PGOOD
Output Low Voltage
PGOOD
Leakage Current
SYNCOUT Low Voltage
SYNCOUT Leakage Current
FSYNC Leakage Current
OVERVOLTAGE PROTECTION
Overvoltage-Protection
Threshold
Note
Note
Note
Note
3:
4:
5:
6:
V
OUT
rising
(monitored at FB pin)
V
OUT
falling
(monitored at FB pin)
MAX16936
MAX16938
MAX16936
MAX16938
107
105
105
102
%
I
SINK
= 5mA
V
OUT
in regulation, T
A
= +25NC
I
SINK
= 5mA
T
A
= +25NC
T
A
= +25NC
V
TH_RISING
V
TH_FALLING
V
FB
rising, V
PGOOD
= high
V
FB
falling, V
PGOOD
= low
93
90
10
95
92
25
97
94
50
0.4
1
0.4
1
1
%V
FB
Fs
V
FA
V
FA
FA
V
EN_HI
V
EN_LO
V
EN_HYS
I
EN
T
A
= +25NC
0.2
0.1
1
2.4
0.6
V
FA
V
V
FSYNC_HI
V
FSYNC_LO
t
SS
t
FSYNC
R
FOSC
= 12kI (Note 6)
V
FSYNC
rising
V
FSYNC
falling
5.6
8
1.8
1.4
0.4
12
1
2.6
Cycles
MHz
V
V
ms
R
FOSC
= 73.2kI
R
FOSC
= 12kI
340
2.0
400
2.2
460
2.4
kHz
MHz
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Device not in dropout condition.
Guaranteed by design; not production tested.
FB regulation voltage is 1%, 1.01V (max), for -40°C < T
A
< +105°C.
Contact the factory for SYNC frequency outside the specified range.
2008年7月9日, CombOLED 研究项目的工作重点是开发出高性价比的生产工艺,以实现有机发光二极管 (OLED) 的量产。欧司朗光电半导体公司固态照明部主管 Bernhard Stapp 表示:“该项目由欧盟提供资金支持,欧司朗负责协调运作,旨在为推行新型照明光源应用创造必要的条件。”这包括采用性价比卓越的方法构建新型元件架构,从而生产出大幅面透明光源。作为 LED 市场的创新推...[详细]
UHF和HF都是一般的技术分类,不过每一类都有独立的支持协议。HF在13.56MHz频段更具有一致性,虽然国际业内行业标准很多。UHF RFID在858-960MHz频段已商业化。同时也有多种国际标准支持,包括EPC global Gen 2。 标签与读写器通过无线链接交换数据。链接可以通过适合任何频段的、具有不同读取范围和抗干扰性的EMF或RF场实现。HF RFID技术主要通过电磁场传送信...[详细]