64 Megabit CMOS 3.0 Volt Flash Memory with 50MHz SPI (Serial Peripheral Interface) Bus
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | SOIC |
| 包装说明 | 0.300 INCH, PLASTIC, MS-013AA, SOP-16 |
| 针数 | 16 |
| Reach Compliance Code | unknow |
| ECCN代码 | 3A991.B.1.A |
| 最大时钟频率 (fCLK) | 50 MHz |
| 数据保留时间-最小值 | 20 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 10.3 mm |
| 内存密度 | 67108864 bi |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 字数 | 67108864 words |
| 字数代码 | 64000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 64MX1 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 3/3.3 V |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 串行总线类型 | SPI |
| 最大待机电流 | 0.00001 A |
| 最大压摆率 | 0.013 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 类型 | NOR TYPE |
| 宽度 | 7.5 mm |
| 写保护 | HARDWARE/SOFTWARE |
| Base Number Matches | 1 |
| S25FL064A0LMAI001 | S25FL064A0LMAI000 | S25FL064A0LMFI000 | S25FL064A | S25FL064A0LMFI003 | S25FL064A0LMAI003 | S25FL064A0LMFI001 | |
|---|---|---|---|---|---|---|---|
| 描述 | 64 Megabit CMOS 3.0 Volt Flash Memory with 50MHz SPI (Serial Peripheral Interface) Bus | 64 Megabit CMOS 3.0 Volt Flash Memory with 50MHz SPI (Serial Peripheral Interface) Bus | 64 Megabit CMOS 3.0 Volt Flash Memory with 50MHz SPI (Serial Peripheral Interface) Bus | 64 Megabit CMOS 3.0 Volt Flash Memory with 50MHz SPI (Serial Peripheral Interface) Bus | 64 Megabit CMOS 3.0 Volt Flash Memory with 50MHz SPI (Serial Peripheral Interface) Bus | 64 Megabit CMOS 3.0 Volt Flash Memory with 50MHz SPI (Serial Peripheral Interface) Bus | 64 Megabit CMOS 3.0 Volt Flash Memory with 50MHz SPI (Serial Peripheral Interface) Bus |
| 是否Rohs认证 | 不符合 | 不符合 | 符合 | - | 符合 | 不符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | - | SOIC | SOIC | SOIC |
| 包装说明 | 0.300 INCH, PLASTIC, MS-013AA, SOP-16 | 0.300 INCH, PLASTIC, MS-013AA, SOP-16 | 0.300 INCH, LEAD FREE, PLASTIC, MS-013AA, SOP-16 | - | 0.300 INCH, LEAD FREE, PLASTIC, MS-013AA, SOP-16 | 0.300 INCH, PLASTIC, MS-013AA, SOP-16 | 0.300 INCH, LEAD FREE, PLASTIC, MS-013AA, SOP-16 |
| 针数 | 16 | 16 | 16 | - | 16 | 16 | 16 |
| Reach Compliance Code | unknow | unknow | unknow | - | unknow | unknow | unknow |
| ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | - | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A |
| 最大时钟频率 (fCLK) | 50 MHz | 50 MHz | 50 MHz | - | 50 MHz | 50 MHz | 50 MHz |
| 数据保留时间-最小值 | 20 | 20 | 20 | - | 20 | 20 | 20 |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e3 | - | e3 | e0 | e3 |
| 长度 | 10.3 mm | 10.3 mm | 10.3 mm | - | 10.3 mm | 10.3 mm | 10.3 mm |
| 内存密度 | 67108864 bi | 67108864 bi | 67108864 bi | - | 67108864 bi | 67108864 bi | 67108864 bi |
| 内存集成电路类型 | FLASH | FLASH | FLASH | - | FLASH | FLASH | FLASH |
| 内存宽度 | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | - | 16 | 16 | 16 |
| 字数 | 67108864 words | 67108864 words | 67108864 words | - | 67108864 words | 67108864 words | 67108864 words |
| 字数代码 | 64000000 | 64000000 | 64000000 | - | 64000000 | 64000000 | 64000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 组织 | 64MX1 | 64MX1 | 64MX1 | - | 64MX1 | 64MX1 | 64MX1 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | - | SOP | SOP | SOP |
| 封装等效代码 | SOP16,.4 | SOP16,.4 | SOP16,.4 | - | SOP16,.4 | SOP16,.4 | SOP16,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 240 | 240 | 260 | - | 260 | 240 | 260 |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | - | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 编程电压 | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 2.65 mm | 2.65 mm | - | 2.65 mm | 2.65 mm | 2.65 mm |
| 串行总线类型 | SPI | SPI | SPI | - | SPI | SPI | SPI |
| 最大待机电流 | 0.00001 A | 0.00001 A | 0.00001 A | - | 0.00001 A | 0.00001 A | 0.00001 A |
| 最大压摆率 | 0.013 mA | 0.013 mA | 0.013 mA | - | 0.013 mA | 0.013 mA | 0.013 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | - | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | - | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | Matte Tin (Sn) | - | Matte Tin (Sn) | TIN LEAD | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 40 | - | 40 | 30 | 40 |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | - | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 7.5 mm | 7.5 mm | 7.5 mm | - | 7.5 mm | 7.5 mm | 7.5 mm |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| Base Number Matches | 1 | 1 | 1 | - | 1 | 1 | 1 |
| 是否无铅 | - | 含铅 | 不含铅 | - | 不含铅 | 含铅 | 不含铅 |
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