SRAM 3Mb 128Kx24 10ns Async SRAM 3.3v
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ISSI(芯成半导体) |
| 零件包装代码 | BGA |
| 包装说明 | BGA, BGA119,7X17,50 |
| 针数 | 119 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.A |
| Factory Lead Time | 8 weeks |
| 最长访问时间 | 10 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PBGA-B119 |
| JESD-609代码 | e1 |
| 长度 | 22 mm |
| 内存密度 | 3145728 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 24 |
| 功能数量 | 1 |
| 端子数量 | 119 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 128KX24 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装等效代码 | BGA119,7X17,50 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.41 mm |
| 最大待机电流 | 0.01 A |
| 最小待机电流 | 3 V |
| 最大压摆率 | 0.18 mA |
| 最大供电电压 (Vsup) | 3.63 V |
| 最小供电电压 (Vsup) | 2.97 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 14 mm |
| Base Number Matches | 1 |

| IS61LV12824-10BL | IS61LV12824-10TQLI | IS61LV12824-10TQLI-TR | IS61LV12824-10B | IS61LV12824-8BL-TR | IS61LV12824-8TQ-TR | IS61LV12824-10TQ-TR | IS61LV12824-8BL | IS61LV12824-10TQI | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | SRAM 3Mb 128Kx24 10ns Async SRAM 3.3v | SRAM 3Mb 128Kx24 10ns Async SRAM 3.3v | SRAM 3Mb 128Kx24 10ns Async SRAM 3.3v | SRAM 3Mb 128Kx24 10ns Async SRAM 3.3v | SRAM 3M (128Kx24) 8ns Async SRAM 3.3v | SRAM 3Mb 128Kx24 8ns 3.3v Async SRAM 3.3v | SRAM 3Mb 128Kx24 10ns Async SRAM 3.3v | SRAM 3M (128Kx24) 8ns Async SRAM 3.3v | SRAM 3Mb 128Kx24 10ns Async SRAM 3.3v |
| Product Attribute | - | Attribute Value | Attribute Value | Attribute Value | Attribute Value | Attribute Value | Attribute Value | Attribute Value | - |
| 制造商 Manufacturer |
- | ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) | ISSI(芯成半导体) | - |
| 产品种类 Product Category |
- | SRAM | SRAM | SRAM | SRAM | SRAM | SRAM | SRAM | - |
| RoHS | - | Details | Details | N | Details | N | N | Details | - |
| Memory Size | - | 3 Mbit | 3 Mbit | 3 Mbit | 3 Mbit | 3 Mbit | 3 Mbit | 3 Mbit | - |
| Organization | - | 128 k x 24 | 128 k x 24 | 128 k x 24 | - | 128 k x 24 | 128 k x 24 | - | - |
| Access Time | - | 10 ns | 10 ns | 10 ns | 8 ns | 8 ns | 10 ns | 8 ns | - |
| 接口类型 Interface Type |
- | Parallel | Parallel | Parallel | - | Parallel | Parallel | - | - |
| 电源电压-最大 Supply Voltage - Max |
- | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | - |
| 电源电压-最小 Supply Voltage - Min |
- | 2.97 V | 2.97 V | 2.97 V | 3.135 V | 3.135 V | 2.97 V | 3.135 V | - |
| Supply Current - Max | - | 210 mA | 210 mA | 180 mA | 210 mA | 210 mA | 180 mA | 210 mA | - |
| 最小工作温度 Minimum Operating Temperature |
- | - 40 C | - 40 C | 0 C | 0 C | 0 C | 0 C | 0 C | - |
| 最大工作温度 Maximum Operating Temperature |
- | + 85 C | + 85 C | + 70 C | + 70 C | + 70 C | + 70 C | + 70 C | - |
| 安装风格 Mounting Style |
- | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT | SMD/SMT | - |
| 封装 / 箱体 Package / Case |
- | TQFP-100 | TQFP-100 | PBGA-119 | PBGA-119 | TQFP-100 | TQFP-100 | PBGA-119 | - |
| 系列 Packaging |
- | Tube | Reel | Tube | Reel | Reel | Reel | Tray | - |
| 数据速率 Data Rate |
- | SDR | SDR | SDR | SDR | SDR | SDR | SDR | - |
| 类型 Type |
- | Asynchronous | Asynchronous | Asynchronous | Asynchronous | Asynchronous | Asynchronous | Asynchronous | - |
| Number of Ports | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| Moisture Sensitive | - | Yes | Yes | Yes | Yes | Yes | Yes | Yes | - |
| 工厂包装数量 Factory Pack Quantity |
- | 72 | 800 | 84 | 1000 | 800 | 800 | 84 | - |
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