4M SRAM (512-kword X 8-bit)
R1LV0408C-C | R1LV0408CSB-5SC | R1LV0408CSP-7LC | R1LV0408CSP-5SC | R1LV0408CSA-7LC | R1LV0408CSA-5SC | R1LV0408CSB-7LC | |
---|---|---|---|---|---|---|---|
描述 | 4M SRAM (512-kword X 8-bit) | 4M SRAM (512-kword X 8-bit) | 4M SRAM (512-kword X 8-bit) | 4M SRAM (512-kword X 8-bit) | 4M SRAM (512-kword X 8-bit) | 4M SRAM (512-kword X 8-bit) | 4M SRAM (512-kword X 8-bit) |
零件包装代码 | - | - | SOIC | SOIC | TSOP | TSOP | TSOP2 |
包装说明 | - | - | 0.525 INCH, PLASTIC, SOP-32 | SOP, | TSSOP, | TSSOP, | TSOP2, |
针数 | - | - | 32 | 32 | 28 | 28 | 32 |
Reach Compliance Code | - | - | unknow | compli | compli | compli | unknow |
ECCN代码 | - | - | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | - | - | 70 ns | 55 ns | 70 ns | 55 ns | 70 ns |
JESD-30 代码 | - | - | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
长度 | - | - | 20.75 mm | 20.75 mm | 11.8 mm | 11.8 mm | 20.95 mm |
内存密度 | - | - | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi |
内存集成电路类型 | - | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | - | - | 8 | 8 | 8 | 8 | 8 |
功能数量 | - | - | 1 | 1 | 1 | 1 | 1 |
端子数量 | - | - | 32 | 32 | 32 | 32 | 32 |
字数 | - | - | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | - | - | 512000 | 512000 | 512000 | 512000 | 512000 |
工作模式 | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | - | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | - | - | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
组织 | - | - | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | - | SOP | SOP | TSSOP | TSSOP | TSOP2 |
封装形状 | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE |
并行/串行 | - | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | - | 3.05 mm | 3.05 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | - | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | - | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
标称供电电压 (Vsup) | - | - | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | - | - | YES | YES | YES | YES | YES |
技术 | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | - | OTHER | OTHER | OTHER | OTHER | OTHER |
端子形式 | - | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | - | - | 1.27 mm | 1.27 mm | 0.5 mm | 0.5 mm | 1.27 mm |
端子位置 | - | - | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | - | - | 11.4 mm | 11.4 mm | 8 mm | 8 mm | 10.16 mm |
厂商名称 | - | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
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