电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

WBC-B0202AA-01-13R3-G

产品描述Resistor Networks & Arrays
产品类别无源元件   
文件大小351KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
下载文档 详细参数 全文预览

WBC-B0202AA-01-13R3-G在线购买

供应商 器件名称 价格 最低购买 库存  
WBC-B0202AA-01-13R3-G - - 点击查看 点击购买

WBC-B0202AA-01-13R3-G概述

Resistor Networks & Arrays

WBC-B0202AA-01-13R3-G规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
TT Electronics plc
产品种类
Product Category
Resistor Networks & Arrays
NumOfPackaging1

文档预览

下载PDF文档
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
分享CCS7.3 安装步骤
1.首先到TI官网进行下载最新本CCS7.3。 2.下载完成后,双击CCS_SETUP.EXE进行安装。安装路径注意不要有中文 3.按照提示,点击continue,next…………. 到达如下界面选择性安装。选择的 ......
Aguilera DSP 与 ARM 处理器
spi 驱动74hc595的问题
107867我用spi方式驱动74hc595, 595接的是共阳数码管 当我使用ckp=1// 空闲时是高电平 cke=1//从低电平到高电平发数据 数码管显示没问题 当我使用ckp=0;//空闲时是低 ......
king3306 Microchip MCU
再次请教版主
版主,我现在对FSMC好迷惑啊。不知道有没有什么资料。 现在的问题是: FSMC在bank1中的那4个片选NE1~4是如何判断接法?比如,为什么LCD液晶的片选要接NE4? 接其它的片选不行吗?那 ......
calvin83 stm32/stm8
也谈WEBENCH,不仅仅是活动
坛子里大多数兄弟可能是通过活动才知道WEBENCH这个工具的吧,这一块我接触的时间还是比较长的。因为最早从TI没有收购国家半导体的时候我就已经在用这个工具了,当时是国半的芯片LM2596,LM5007 ......
starcool 模拟与混合信号
PCB电路版图设计的常见问题
问题2:导线、飞线和网络有什么区别?  答:导线也称铜膜走线,简称导线,用于连接各个焊点,是印刷电路板最重要的部分,印刷电路板设计都是围绕如何布置导线来进行的。  与导线有关的另外 ......
fighting PCB设计
msp430单片机开发实录(4)
此内容由EEWORLD论坛网友tiankai001原创,如需转载或用于商业用途需征得作者同意并注明出处 msp430单片机开发实录(4) 现象: 调试一款单独供电的时钟芯片,该芯片是I2 ......
tiankai001 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2101  669  1056  2164  281  42  14  29  50  12 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved