Latches OCTAL 3-STATE LATCH
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SSOP |
| 包装说明 | 5.30 MM, PLASTIC, MO-150, SOT-339-1, SSOP-20 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 系列 | HCT |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e4 |
| 长度 | 7.2 mm |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I(ol) | 0.006 A |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 包装方法 | TUBE |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 45 ns |
| 传播延迟(tpd) | 48 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 5.3 mm |
| Base Number Matches | 1 |

| 74HCT373DB | 74HC373D | 74HC373BQ-G | 74HCT373BQ-G | 74HCT373DB-T | 74HCT373PW-T | 74HC373DB-T | 74HCT373D-T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Latches OCTAL 3-STATE LATCH | Latches OCTAL D LATCH 3STATE | Latches OCTAL 3-STATE LATCH | Latches OCTAL 3-STATE LATCH | Latches OCTAL 3-STATE LATCH | Latches OCTAL 3-STATE LATCH | Latches OCTAL 3-STATE LATCH | Latches OCTAL D LATCH 3STATE |
| 是否Rohs认证 | 符合 | 符合 | - | - | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | - | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SSOP | SOIC | - | - | SSOP | TSSOP | SSOP | SOIC |
| 包装说明 | 5.30 MM, PLASTIC, MO-150, SOT-339-1, SSOP-20 | 7.50 MM, PLASTIC, MS-013, SOT-163-1, SOP-20 | - | - | SSOP, | TSSOP, | SSOP, | SOP, SOP20,.4 |
| 针数 | 20 | 20 | - | - | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | - | - | unknown | unknown | unknown | unknown |
| 系列 | HCT | HC/UH | - | - | HCT | HCT | HC/UH | HCT |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | - | - | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609代码 | e4 | e4 | - | - | e4 | e4 | e4 | e4 |
| 长度 | 7.2 mm | 12.8 mm | - | - | 7.2 mm | 6.5 mm | 7.2 mm | 12.8 mm |
| 负载电容(CL) | 50 pF | 50 pF | - | - | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | - | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 湿度敏感等级 | 1 | 1 | - | - | 1 | 1 | 1 | 1 |
| 位数 | 8 | 8 | - | - | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | - | - | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | - | - | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | - | - | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | - | - | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | - | - | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | SOP | - | - | SSOP | TSSOP | SSOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | - | - | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | 260 | 260 | - | - | 260 | 260 | 260 | 260 |
| 传播延迟(tpd) | 48 ns | 265 ns | - | - | 48 ns | 48 ns | 265 ns | 48 ns |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2 mm | 2.65 mm | - | - | 2 mm | 1.1 mm | 2 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V | 6 V | - | - | 5.5 V | 5.5 V | 6 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 2 V | - | - | 4.5 V | 4.5 V | 2 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | - | - | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | - | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | - | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | - | - | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | - | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | - | 30 | 30 | 30 | 30 |
| 宽度 | 5.3 mm | 7.5 mm | - | - | 5.3 mm | 4.4 mm | 5.3 mm | 7.5 mm |
| Base Number Matches | 1 | 1 | - | - | 1 | 1 | 1 | 1 |
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