PL
IA
N
T
Features
n
Available in E6 series
n
Low unit height of 3.3 mm
n
High current
n
RoHS compliant*
Applications
n
Input/output of DC/DC converters
n
Power supplies for:
*R
oH
S
C
OM
• Portable communication equipment
• Camcorders
• LCD TVs
• Car radios
LE
AD
F
RE
E
SRR0603 Series - Shielded Power Inductors
General Specifications
Test Voltage ...................................1 Volt
Reflow Soldering .. 230 °C, 50 sec. max.
Operating Temperature
................................-40 °C to +125 °C
(Temperature rise included)
Storage Temperature .. -40 °C to +125 °C
Resistance to Soldering Heat
................................. 260 °C for 5 sec.
Materials
Core ............................... Ferrite DR & RI
Wire ............................Enameled copper
Base .....................................LCP E4008
Terminal ....................................Cu/Ni/Sn
Rated Current
...............Ind. drop of 10 % typ. at Isat
Temperature Rise
.....................40 °C max. at rated Irms
Packaging .................. 1000 pcs. per reel
Product Dimensions
6.5 ± 0.2
(.256 ± .008)
6.5 ± 0.2
(.256 ± .008 )
MAX.
3.3
(.130)
Electrical Specifications
Test
Frequency
(MHz)
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Inductance
1 KHz
Bourns Part No.
µH
SRR0603-220ML
SRR0603-470KL
SRR0603-330KL
SRR0603-150ML
SRR0603-100ML
SRR0603-6R8ML
SRR0603-4R7ML
SRR0603-3R3ML
SRR0603-2R5ML
SRR0603-1R5ML
6.8
15
10
4.7
3.3
2.5
1.5
Q
Tol. % Ref.
22
SRR0603-102KL
SRR0603-681KL
SRR0603-471KL
SRR0603-331KL
SRR0603-221KL
SRR0603-151KL
SRR0603-101KL
SRR0603-680KL
1000
680
470
330
220
150
100
68
47
33
± 20
± 20
± 20
± 20
± 20
± 20
± 20
± 20
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
± 10
16
16
16
13
13
16
19
20
20
13
17
18
20
22
22
11
13
15
2.52
2.52
2.52
7.96
7.96
7.96
7.96
7.96
SRF
Min.
(MHz)
25.0
20.0
25.0
32.0
45.0
85.0
90.0
95.0
0.100
0.18
0.12
0.070
0.055
0.040
0.032
RDC
Max.
(Ω)
I rms
Max.
(A)
2.20
2.00
1.80
1.20
0.90
1.10
1.60
0.252
0.796
0.796
0.796
0.796
0.796
0.796
2.52
2.52
2.52
10.0
8.0
9.0
13.0
16.0
0.27
3.0
3.5
4.0
4.5
5.0
14.00
10.50
6.70
4.20
2.70
1.90
1.50
0.90
0.55
0.43
0.70
0.60
0.50
1.05
1.20
1.50
1.75
2.20
2.60
2.95
3.50
I sat
Typ.
(A)
**K-
Factor
135
112
77
92
172
205
255
303
335
424
0.10
0.12
0.15
0.18
0.20
0.25
0.30
0.40
0.13
0.15
0.19
0.24
0.31
0.39
0.44
0.53
0.73
0.83
17
20
25
30
36
43
53
64
**K-Factor: To calculate core flux density, Bp-p (gauss) = K x L(µH) x
Δ
I (peak-to-peak ripple current, A),
determine core loss from
Core Loss vs. Flux Density
plot.
100
2.0 ± 0.2
(.099 ± .008)
0.7 ± 0.1
(.028 ± .004)
Core Loss vs. Flux Density
1000
100
5.0 ± 0.2
(.197 ± .008)
Core Loss (mW)
10
800 KHz
500 KHz
300 KHz
200 KHz
100 KHz
50 KHz
10 KHz
0.7 ± 0.1
(.028 ± .004)
1
Recommended Layout
2.5
(.099)
4.5
(.177)
1.5
(.060)
0.10
0.01
100
1000
10000
Flux Density Bp-p (gauss)
Schematic
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device
performance may vary over time.
Users should verify actual device performance in their specific applications.
DIMENSIONS:
MM
(INCHES)
(.0
微控制器 MCU
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