HDMI05-CL01F3
5-line IPAD™, HDMI™ control line ESD protection
Datasheet
-
production data
Features
•
Low line capacitance
•
High efficiency in ESD protection
•
Lead-free package
•
Very thin package
•
High reliability offered by monolithic integration
Leed-free Flip-Chip package
(8 bumps)
•
High reduction of parasitic elements through
integration and wafer level packaging
Complies with the standards:
•
IEC 61000-4-2 Level 4
– ± 15 kV (air discharge)
– ± 8 kV (contact discharge)
•
IEC 61000-4-2 Level 1
– ± 2 kV (air discharge)
– ± 2 kV (contact discharge)
Figure 1. Pin configuration (bump side) and
schematic
Application
Where ESD protection for HDMI control lines
(CEC, HPD, SCL and SDA) is required:
•
Mobile phones and communication systems
•
Portable multimedia players
•
Camcorder, digital still cameras
Description
The HDMI05-CL01F3 chip is a low capacitance
ESD protection for HDMI control pins. It also
integrates a pull-up resistor for I²C bus and a pull-
down resistor for hot plug detect.
The ESD protection circuitry prevents damage to
the protected device when subjected to ESD
surges up to 15 kV.
TM:
IPAD is a trademark of STMicroelectronics. HDMI, the
HDMI logo and High-Definition Multimedia Interface
are trademarks or registered trademarks of HDMI
Licensing LLC.
July 2015
This is information on a product in full production.
DocID17458 Rev 3
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www.st.com
Characteristics
HDMI05-CL01F3
1
Characteristics
Table 1. Absolute maximum ratings (T
amb
= 25 °C)
Symbol
Parameter
External pins (A1, A2, A3, B3 and C3):
ESD IEC 61000-4-2, level 4 - air discharge
ESD IEC 61000-4-2, level 4 - contact discharge
Internal pin (C1):
ESD IEC 61000-4-2, level 1 - air discharge
ESD IEC 61000-4-2, level 1 - contact discharge
Line resistance power dissipation at 70 °C
Operating temperature range
Storage temperature range
Value
Unit
V
PP
15
8
2
2
60
-30 to + 85
-55 to + 150
kV
P
d
T
op
T
stg
mW
°C
°C
Figure 2. Electrical characteristics - definitions
I
Symbol
V
BR
=
I
RM
=
V
RM
=
C
line
=
Parameter
Breakdown voltage
Leakage current @ V
RM
Stand-off voltage
Line capacitance
V
BR
V
RM
I
R
I
RM
I
RM
I
R
V
RM
V
BR
V
Table 2. Electrical characteristics (T
amb
= 25 °C)
Symbol
V
BR
I
RM
R
1
, R
2
R
3
C
line
V
line
= 0 V, V
osc
= 30 mV, F = 1 MHz
(measured under zero light conditions, B2 and C2
bumps connect together)
I
R
= 1 mA
V
RM
= 3 V per line
1575
80
8
Test condition
Min.
14
50
1750
100
10
200
1925
120
12
Typ.
Max.
Unit
V
nA
Ω
kΩ
pF
2/8
DocID17458 Rev 3
HDMI05-CL01F3
Characteristics
Figure 3. S21(dB) versus frequency on
A1
0
-2
-4
-6
-8
- 10
- 12
- 14
- 16
- 18
- 20
- 22
100k
1M
10M
100M
Figure 4. Analog crosstalk measurements
B3-A3
0
-5
- 10
- 15
- 20
- 25
- 30
- 35
S21 (dB)
A1_0V
A1_3.6V
A1_2.5V
A1_5.5V
Crosstalk (dB)
B3_A3_0V
B3_A3_3.6V
B3_A3_2.5V
B3_A3_5.5V
F(Hz)
1G
- 40
100k
1M
10M
100M
1G
F(Hz)
Figure 5. Digital crosstalk measurement
A3-B3 with 5 V applied on C1
1 V/Div
Output
C2
Figure 6. ESD response to IEC 61000-4-2
(+8 kV contact discharge) on CEC line (A2)
20 V/Div
20 ns/Div
50 mV/Div
Input
VCL
C1
20 ns/Div
C2
20 ns/Div
Figure 7. ESD response to IEC 61000-4-2
(-8 kV contact discharge) on CEC line (A2)
C2
Figure 8. Line capacitance versus reverse
applied voltage on A2-B2
10
C(pF)
20 V/Div
VCL
8.0
6.0
4.0
2.0
20 ns/Div
0.0
0
2
4
6
8
10
12
V
R
(V)
14
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8
Typical application schematic
HDMI05-CL01F3
2
Typical application schematic
Figure 9. Implementation with HDMI type C connector
HDMI DRIVER
TYPE C
HDMI CONNECTOR
4 TMDS channel
A1 A2 A3 B1 B3 C1 C2 C3
5V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
2 x 1K75
TMDS DATA2 SHIELD
TMDS DATA2 +
TMDS DATA2 -
TMDS DATA1 SHIELD
TMDS DATA1 +
TMDS DATA1 -
TMDS DATA0 SHIELD
TMDS DATA0 +
TMDS DATA0 -
TMDS CLK SHIELD
TMDS CLK +
TMDS CLK -
DDC/ EEC GROUND
CEC
SCL
SDA
RESERVED
+5V POWER
HOT PLUG DETECT
B2
ESDAULC6-8F3
5V
CEC
SCL
SDA
HPD
HDMI05-CL01F3
4/8
DocID17458 Rev 3
100K
HDMI05-CL01F3
Package information
3
Package information
•
•
Epoxy meets UL94, V0
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
3.1
Flip-Chip package information
Figure 10. Flip-Chip package outline
400 µm ± 40
255 µm ± 40
605 µm ± 55
400 µm ± 40
170 µm
1.14 mm ± 30 µm
DocID17458 Rev 3
1.14 mm ± 30 µm
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8
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