CD4030B CMOS Quad Exclusive-OR Gate
| 参数名称 | 属性值 |
| IOH(Max)(mA) | -6.8 |
| VCC(Max)(V) | 18 |
| Output type | Push-Pull |
| Rating | Catalog |
| VCC(Min)(V) | 3 |
| Input type | Standard CMOS |
| IOL(Max)(mA) | 6.8 |
| Approx. price(US$) | 0.11 | 1ku |
| Data rate(Max)(Mbps) | 8 |
| Package Group | PDIP|14,SOIC|14,SO|14,TSSOP|14 |
| Operating temperature range(C) | -55 to 125 |
| Inputs per channel | 4 |
| Features | Standard Speed (tpd > 50ns) |
| Technology Family | CD4000 |
| Channels(#) | 4 |
| CD4030B | CD4030BF | CD4030BF3A | JM38510/05353BCA | M38510/05353BCA | CD4030B-MIL | |
|---|---|---|---|---|---|---|
| 描述 | CD4030B CMOS Quad Exclusive-OR Gate | CMOS Quad Exclusive-OR Gate 14-CDIP -55 to 125 | CMOS Quad Exclusive-OR Gate 14-CDIP -55 to 125 | CMOS Quad Exclusive-OR Gate 14-CDIP -55 to 125 | CMOS Quad Exclusive-OR Gate 14-CDIP -55 to 125 | CD4030B-MIL CMOS Quad Exclusive-OR Gate |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 零件包装代码 | - | DIP | DIP | DIP | DIP | - |
| 包装说明 | - | DIP-14 | DIP, DIP14,.3 | DIP, | DIP, DIP14,.3 | - |
| 针数 | - | 14 | 14 | 14 | 14 | - |
| Reach Compliance Code | - | not_compliant | not_compliant | not_compliant | not_compliant | - |
| 系列 | - | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 | - |
| JESD-30 代码 | - | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | R-GDIP-T14 | - |
| 长度 | - | 19.43 mm | 19.56 mm | 19.56 mm | 19.56 mm | - |
| 逻辑集成电路类型 | - | XOR GATE | XOR GATE | XOR GATE | XOR GATE | - |
| 最大I（ol） | - | 0.0015 A | 0.0015 A | 0.0015 A | 0.0015 A | - |
| 功能数量 | - | 4 | 4 | 4 | 4 | - |
| 输入次数 | - | 2 | 2 | 2 | 2 | - |
| 端子数量 | - | 14 | 14 | 14 | 14 | - |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C | - |
| 封装主体材料 | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
| 封装代码 | - | DIP | DIP | DIP | DIP | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 传播延迟（tpd） | - | 280 ns | 280 ns | 280 ns | 350 ns | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Qualified | - |
| 座面最大高度 | - | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | - |
| 最大供电电压 (Vsup) | - | 18 V | 18 V | 18 V | 15 V | - |
| 最小供电电压 (Vsup) | - | 3 V | 3 V | 3 V | 4.5 V | - |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | - |
| 表面贴装 | - | NO | NO | NO | NO | - |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | - | MILITARY | MILITARY | MILITARY | MILITARY | - |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
| 端子位置 | - | DUAL | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 宽度 | - | 7.62 mm | 7.62 mm | 7.62 mm | 6.67 mm | - |
无线连接
微控制器 MCU
嵌入式系统
51单片机
嵌入式系统
微控制器 MCU
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
