Fixed-Point Digital Signal Processor 118-BGA MICROSTAR JUNIOR -10 to 70
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | BGA-118 |
| Reach Compliance Code | compliant |
| Factory Lead Time | 1 week |
| 地址总线宽度 | |
| 桶式移位器 | NO |
| 边界扫描 | YES |
| 最大时钟频率 | 12 MHz |
| 外部数据总线宽度 | |
| 格式 | FIXED POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B118 |
| JESD-609代码 | e1 |
| 长度 | 7 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 3 |
| 端子数量 | 118 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -10 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 座面最大高度 | 1 mm |
| 最大供电电压 | 1.43 V |
| 最小供电电压 | 1.24 V |
| 标称供电电压 | 1.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 宽度 | 7 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| TMS320C5545AZQW12 | TMS320C5545AZQW10 | TMS320C5545AZQW06 | TMS320C5545AZQW10R | TMS320C5545 | |
|---|---|---|---|---|---|
| 描述 | Fixed-Point Digital Signal Processor 118-BGA MICROSTAR JUNIOR -10 to 70 | Fixed-Point Digital Signal Processor 118-BGA MICROSTAR JUNIOR -10 to 70 | Fixed-Point Digital Signal Processor 118-BGA MICROSTAR JUNIOR -10 to 70 | Fixed-Point Digital Signal Processor 118-BGA MICROSTAR JUNIOR -10 to 70 | TMS320C5545 Fixed-Point Digital Signal Processor |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - |
| 是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - |
| 包装说明 | BGA-118 | VFBGA, | BGA-118 | BGA-118 | - |
| Reach Compliance Code | compliant | compliant | compliant | compliant | - |
| 桶式移位器 | NO | NO | NO | NO | - |
| 边界扫描 | YES | YES | YES | YES | - |
| 最大时钟频率 | 12 MHz | 12 MHz | - | 12 MHz | - |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | - |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | - |
| JESD-30 代码 | S-PBGA-B118 | S-PBGA-B118 | S-PBGA-B118 | S-PBGA-B118 | - |
| JESD-609代码 | e1 | e1 | e1 | e1 | - |
| 长度 | 7 mm | 7 mm | 7 mm | 7 mm | - |
| 低功率模式 | YES | YES | YES | YES | - |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | - |
| 端子数量 | 118 | 118 | 118 | 118 | - |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | - |
| 最低工作温度 | -10 °C | -10 °C | -10 °C | -10 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | VFBGA | VFBGA | VFBGA | VFBGA | - |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | - |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - |
| 座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm | - |
| 最大供电电压 | 1.43 V | 1.43 V | 1.15 V | 1.43 V | - |
| 最小供电电压 | 1.24 V | 1.24 V | 0.998 V | 1.24 V | - |
| 标称供电电压 | 1.3 V | 1.3 V | 1.05 V | 1.3 V | - |
| 表面贴装 | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | - |
| 端子形式 | BALL | BALL | BALL | BALL | - |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | - |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - |
| 宽度 | 7 mm | 7 mm | 7 mm | 7 mm | - |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | - |
| Base Number Matches | 1 | - | 1 | 1 | - |
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