Datasheet> 器件分类 > 存储> 存储> HN58C256AT-85

文档预览

HN58C256AT-85: 产品描述32K X 8 EEPROM 5V, 85 ns, PDSO28, PLASTIC, TSOP-28; 产品类别存储存储; 文件大小170KB，共27页; 制造商Renesas(瑞萨电子); 官网地址https://www.renesas.com/

下载文档详细参数选型对比全文预览

HN58C256AT-85概述

32K X 8 EEPROM 5V, 85 ns, PDSO28, PLASTIC, TSOP-28

HN58C256AT-85规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	Renesas(瑞萨电子)
零件包装代码	TSOP
包装说明	TSSOP, TSSOP28,.53,22
针数	28
Reach Compliance Code	unknown
ECCN代码	EAR99
最长访问时间	85 ns
其他特性	100K ERASE/WRITE CYCLES; DATA RETENTION 10 YEARS; SOFTWARE DATA PROTECTION
命令用户界面	NO
数据轮询	YES
数据保留时间-最小值	10
耐久性	100000 Write/Erase Cycles
JESD-30 代码	R-PDSO-G28
JESD-609代码	e0
长度	11.8 mm
内存密度	262144 bit
内存集成电路类型	EEPROM
内存宽度	8
功能数量	1
端子数量	28
字数	32768 words
字数代码	32000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	32KX8
封装主体材料	PLASTIC/EPOXY
封装代码	TSSOP
封装等效代码	TSSOP28,.53,22
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
页面大小	64 words
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	5 V
编程电压	5 V
认证状态	Not Qualified
座面最大高度	1.2 mm
最大待机电流	0.00002 A
最大压摆率	0.03 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	0.5 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
切换位	YES
宽度	8 mm
最长写入周期时间 (tWC)	10 ms
Base Number Matches	1

文档预览

下载PDF文档

全文
预览

To all our customers

Regarding the change of names mentioned in the document, such as Hitachi

Electric and Hitachi XX, to Renesas Technology Corp.

The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas

Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)

Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand

names are mentioned in the document, these names have in fact all been changed to Renesas

Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and

corporate statement, no changes whatsoever have been made to the contents of the document, and

these changes do not constitute any alteration to the contents of the document itself.

Renesas Technology Home Page: http://www.renesas.com

Renesas Technology Corp.

Customer Support Dept.

April 1, 2003

Cautions

Keep safety first in your circuit designs!

1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better

and more reliable, but there is always the possibility that trouble may occur with them. Trouble with

semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate

measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or

(iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas

Technology Corporation product best suited to the customer's application; they do not convey any

license under any intellectual property rights, or any other rights, belonging to Renesas Technology

Corporation or a third party.

2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any

third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or

circuit application examples contained in these materials.

3. All information contained in these materials, including product data, diagrams, charts, programs and

algorithms represents information on products at the time of publication of these materials, and are

subject to change by Renesas Technology Corporation without notice due to product improvements or

other reasons. It is therefore recommended that customers contact Renesas Technology Corporation

or an authorized Renesas Technology Corporation product distributor for the latest product information

before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss

rising from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corporation by various

means, including the Renesas Technology Corporation Semiconductor home page

(http://www.renesas.com).

4. When using any or all of the information contained in these materials, including product data, diagrams,

charts, programs, and algorithms, please be sure to evaluate all information as a total system before

making a final decision on the applicability of the information and products. Renesas Technology

Corporation assumes no responsibility for any damage, liability or other loss resulting from the

information contained herein.

5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device

or system that is used under circumstances in which human life is potentially at stake. Please contact

Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor

when considering the use of a product contained herein for any specific purposes, such as apparatus or

systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.

6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in

whole or in part these materials.

7. If these products or technologies are subject to the Japanese export control restrictions, they must be

exported under a license from the Japanese government and cannot be imported into a country other

than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the

country of destination is prohibited.

8. Please contact Renesas Technology Corporation for further details on these materials or the products

contained therein.

HN58C256AT-85相似产品对比

	HN58C256AT-85	HN58C256AFP-10	HN58C256AP-85	HN58C256AP-10	HN58C256AFP-85	HN58C256AT-10	HN58C257AT-85	HN58C257AT-10
描述	32K X 8 EEPROM 5V, 85 ns, PDSO28, PLASTIC, TSOP-28	32KX8 EEPROM 5V, 100ns, PDSO28, 0.400 INCH, PLASTIC, SOP-28	32KX8 EEPROM 5V, 85ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28	32KX8 EEPROM 5V, 100ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28	32KX8 EEPROM 5V, 85ns, PDSO28, 0.400 INCH, PLASTIC, SOP-28	32KX8 EEPROM 5V, 100ns, PDSO28, PLASTIC, TSOP-28	32KX8 EEPROM 5V, 85ns, PDSO32, 8 X 14 MM, PLASTIC, TSOP-32	32KX8 EEPROM 5V, 100ns, PDSO32, 8 X 14 MM, PLASTIC, TSOP-32
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)
零件包装代码	TSOP	SOIC	DIP	DIP	SOIC	TSOP	TSOP	TSOP
包装说明	TSSOP, TSSOP28,.53,22	SOP, SOP28,.45	0.600 INCH, PLASTIC, DIP-28	0.600 INCH, PLASTIC, DIP-28	SOP, SOP28,.45	TSSOP, TSSOP28,.53,22	TSSOP, TSSOP32,.56,20	8 X 14 MM, PLASTIC, TSOP-32
针数	28	28	28	28	28	28	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	85 ns	100 ns	85 ns	100 ns	85 ns	100 ns	85 ns	100 ns
命令用户界面	NO	NO	NO	NO	NO	NO	NO	NO
数据轮询	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	R-PDSO-G28	R-PDSO-G28	R-PDIP-T28	R-PDIP-T28	R-PDSO-G28	R-PDSO-G28	R-PDSO-G32	R-PDSO-G32
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0
长度	11.8 mm	18.3 mm	35.6 mm	35.6 mm	18.3 mm	11.8 mm	12.4 mm	12.4 mm
内存密度	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit	262144 bit
内存集成电路类型	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
内存宽度	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1
端子数量	28	28	28	28	28	28	32	32
字数	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words	32768 words
字数代码	32000	32000	32000	32000	32000	32000	32000	32000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8	32KX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSSOP	SOP	DIP	DIP	SOP	TSSOP	TSSOP	TSSOP
封装等效代码	TSSOP28,.53,22	SOP28,.45	DIP28,.6	DIP28,.6	SOP28,.45	TSSOP28,.53,22	TSSOP32,.56,20	TSSOP32,.56,20
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
页面大小	64 words	64 words	64 words	64 words	64 words	64 words	64 words	64 words
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
编程电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	2.5 mm	5.7 mm	5.7 mm	2.5 mm	1.2 mm	1.2 mm	1.2 mm
最大待机电流	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A	0.00002 A
最大压摆率	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	NO	NO	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.5 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
切换位	YES	YES	YES	YES	YES	YES	YES	YES
宽度	8 mm	8.4 mm	15.24 mm	15.24 mm	8.4 mm	8 mm	8 mm	8 mm
最长写入周期时间 (tWC)	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms	10 ms
是否无铅	含铅	含铅	含铅	含铅	含铅	含铅	-	含铅
其他特性	100K ERASE/WRITE CYCLES; DATA RETENTION 10 YEARS; SOFTWARE DATA PROTECTION	100K ERASE/WRITE CYCLES; DATA RETENTION 10 YEARS; SOFTWARE DATA PROTECTION	-	-	100K ERASE/WRITE CYCLES; DATA RETENTION 10 YEARS; SOFTWARE DATA PROTECTION	100K ERASE/WRITE CYCLES; DATA RETENTION 10 YEARS; SOFTWARE DATA PROTECTION	100K ERASE/WRITE CYCLES; DATA RETENTION 10 YEARS; SOFTWARE DATA PROTECTION	-
数据保留时间-最小值	10	10	-	-	10	10	10	-
耐久性	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles	-	-
Base Number Matches	1	1	1	1	1	1	-	-

HN58C256AT-85

HN58C256AT-85概述

HN58C256AT-85规格参数

文档预览

HN58C256AT-85相似产品对比

推荐资源