32KX8 EEPROM 5V, 85ns, PDSO28, 0.400 INCH, PLASTIC, SOP-28
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP28,.45 |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 85 ns |
| 其他特性 | 100K ERASE/WRITE CYCLES; DATA RETENTION 10 YEARS; SOFTWARE DATA PROTECTION |
| 命令用户界面 | NO |
| 数据轮询 | YES |
| 数据保留时间-最小值 | 10 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e0 |
| 长度 | 18.3 mm |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP28,.45 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 页面大小 | 64 words |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 5 V |
| 编程电压 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.5 mm |
| 最大待机电流 | 0.00002 A |
| 最大压摆率 | 0.03 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 切换位 | YES |
| 宽度 | 8.4 mm |
| 最长写入周期时间 (tWC) | 10 ms |
| Base Number Matches | 1 |

| HN58C256AFP-85 | HN58C256AFP-10 | HN58C256AP-85 | HN58C256AP-10 | HN58C256AT-10 | HN58C256AT-85 | HN58C257AT-85 | HN58C257AT-10 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 32KX8 EEPROM 5V, 85ns, PDSO28, 0.400 INCH, PLASTIC, SOP-28 | 32KX8 EEPROM 5V, 100ns, PDSO28, 0.400 INCH, PLASTIC, SOP-28 | 32KX8 EEPROM 5V, 85ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | 32KX8 EEPROM 5V, 100ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | 32KX8 EEPROM 5V, 100ns, PDSO28, PLASTIC, TSOP-28 | 32K X 8 EEPROM 5V, 85 ns, PDSO28, PLASTIC, TSOP-28 | 32KX8 EEPROM 5V, 85ns, PDSO32, 8 X 14 MM, PLASTIC, TSOP-32 | 32KX8 EEPROM 5V, 100ns, PDSO32, 8 X 14 MM, PLASTIC, TSOP-32 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | SOIC | SOIC | DIP | DIP | TSOP | TSOP | TSOP | TSOP |
| 包装说明 | SOP, SOP28,.45 | SOP, SOP28,.45 | 0.600 INCH, PLASTIC, DIP-28 | 0.600 INCH, PLASTIC, DIP-28 | TSSOP, TSSOP28,.53,22 | TSSOP, TSSOP28,.53,22 | TSSOP, TSSOP32,.56,20 | 8 X 14 MM, PLASTIC, TSOP-32 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 85 ns | 100 ns | 85 ns | 100 ns | 100 ns | 85 ns | 85 ns | 100 ns |
| 命令用户界面 | NO | NO | NO | NO | NO | NO | NO | NO |
| 数据轮询 | YES | YES | YES | YES | YES | YES | YES | YES |
| JESD-30 代码 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G32 | R-PDSO-G32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 18.3 mm | 18.3 mm | 35.6 mm | 35.6 mm | 11.8 mm | 11.8 mm | 12.4 mm | 12.4 mm |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 32 | 32 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | DIP | DIP | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | SOP28,.45 | SOP28,.45 | DIP28,.6 | DIP28,.6 | TSSOP28,.53,22 | TSSOP28,.53,22 | TSSOP32,.56,20 | TSSOP32,.56,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 页面大小 | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.5 mm | 2.5 mm | 5.7 mm | 5.7 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大待机电流 | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A |
| 最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 切换位 | YES | YES | YES | YES | YES | YES | YES | YES |
| 宽度 | 8.4 mm | 8.4 mm | 15.24 mm | 15.24 mm | 8 mm | 8 mm | 8 mm | 8 mm |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 含铅 |
| 其他特性 | 100K ERASE/WRITE CYCLES; DATA RETENTION 10 YEARS; SOFTWARE DATA PROTECTION | 100K ERASE/WRITE CYCLES; DATA RETENTION 10 YEARS; SOFTWARE DATA PROTECTION | - | - | 100K ERASE/WRITE CYCLES; DATA RETENTION 10 YEARS; SOFTWARE DATA PROTECTION | 100K ERASE/WRITE CYCLES; DATA RETENTION 10 YEARS; SOFTWARE DATA PROTECTION | 100K ERASE/WRITE CYCLES; DATA RETENTION 10 YEARS; SOFTWARE DATA PROTECTION | - |
| 数据保留时间-最小值 | 10 | 10 | - | - | 10 | 10 | 10 | - |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
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