Dual Binary to 1-4-Decoder(High)
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Motorola ( NXP ) |
| 包装说明 | PLASTIC, DIP-16 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 系列 | 10H |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.175 mm |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 75 °C |
| 最低工作温度 | |
| 输出特性 | OPEN-EMITTER |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 最大电源电流（ICC） | 85 mA |
| Prop。Delay @ Nom-Su | 2.8 ns |
| 传播延迟（tpd） | 2.8 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.44 mm |
| 表面贴装 | NO |
| 技术 | ECL |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| MC10H172P | MC10H172 | MC10H172L | MC10H172FN | |
|---|---|---|---|---|
| 描述 | Dual Binary to 1-4-Decoder(High) | Dual Binary to 1-4-Decoder(High) | Dual Binary to 1-4-Decoder(High) | Dual Binary to 1-4-Decoder(High) |
| 厂商名称 | Motorola ( NXP ) | - | Motorola ( NXP ) | Motorola ( NXP ) |
| 包装说明 | PLASTIC, DIP-16 | - | DIP, DIP16,.3 | QCCJ, LDCC20,.4SQ |
| Reach Compliance Code | unknow | - | unknow | unknow |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 |
| 系列 | 10H | - | 10H | 10H |
| JESD-30 代码 | R-PDIP-T16 | - | R-GDIP-T16 | S-PQCC-J20 |
| JESD-609代码 | e0 | - | e0 | e0 |
| 长度 | 19.175 mm | - | 19.495 mm | 8.9662 mm |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | - | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 功能数量 | 2 | - | 2 | 2 |
| 端子数量 | 16 | - | 16 | 20 |
| 最高工作温度 | 75 °C | - | 75 °C | 75 °C |
| 输出特性 | OPEN-EMITTER | - | OPEN-EMITTER | OPEN-EMITTER |
| 输出极性 | INVERTED | - | INVERTED | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | QCCJ |
| 封装等效代码 | DIP16,.3 | - | DIP16,.3 | LDCC20,.4SQ |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | - | IN-LINE | CHIP CARRIER |
| 最大电源电流（ICC） | 85 mA | - | 85 mA | 85 mA |
| Prop。Delay @ Nom-Su | 2.8 ns | - | 2.8 ns | 2.8 ns |
| 传播延迟（tpd） | 2.8 ns | - | 2.8 ns | 2.8 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 4.44 mm | - | 5.08 mm | 4.57 mm |
| 表面贴装 | NO | - | NO | YES |
| 技术 | ECL | - | ECL | ECL |
| 温度等级 | COMMERCIAL EXTENDED | - | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | J BEND |
| 端子节距 | 2.54 mm | - | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | QUAD |
| 宽度 | 7.62 mm | - | 7.62 mm | 8.9662 mm |
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