Dual Binary to 1-4-Decoder(High)
MC10H172 | MC10H172P | MC10H172L | MC10H172FN | |
---|---|---|---|---|
描述 | Dual Binary to 1-4-Decoder(High) | Dual Binary to 1-4-Decoder(High) | Dual Binary to 1-4-Decoder(High) | Dual Binary to 1-4-Decoder(High) |
厂商名称 | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
包装说明 | - | PLASTIC, DIP-16 | DIP, DIP16,.3 | QCCJ, LDCC20,.4SQ |
Reach Compliance Code | - | unknow | unknow | unknow |
ECCN代码 | - | EAR99 | EAR99 | EAR99 |
系列 | - | 10H | 10H | 10H |
JESD-30 代码 | - | R-PDIP-T16 | R-GDIP-T16 | S-PQCC-J20 |
JESD-609代码 | - | e0 | e0 | e0 |
长度 | - | 19.175 mm | 19.495 mm | 8.9662 mm |
逻辑集成电路类型 | - | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
功能数量 | - | 2 | 2 | 2 |
端子数量 | - | 16 | 16 | 20 |
最高工作温度 | - | 75 °C | 75 °C | 75 °C |
输出特性 | - | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
输出极性 | - | INVERTED | INVERTED | INVERTED |
封装主体材料 | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
封装代码 | - | DIP | DIP | QCCJ |
封装等效代码 | - | DIP16,.3 | DIP16,.3 | LDCC20,.4SQ |
封装形状 | - | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | - | IN-LINE | IN-LINE | CHIP CARRIER |
最大电源电流(ICC) | - | 85 mA | 85 mA | 85 mA |
Prop。Delay @ Nom-Su | - | 2.8 ns | 2.8 ns | 2.8 ns |
传播延迟(tpd) | - | 2.8 ns | 2.8 ns | 2.8 ns |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 4.44 mm | 5.08 mm | 4.57 mm |
表面贴装 | - | NO | NO | YES |
技术 | - | ECL | ECL | ECL |
温度等级 | - | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | J BEND |
端子节距 | - | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | - | DUAL | DUAL | QUAD |
宽度 | - | 7.62 mm | 7.62 mm | 8.9662 mm |
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