IC 2-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP24, 1.280 X 0.310 INCH, CERDIP-24, Analog to Digital Converter
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 最大模拟输入电压 | 2.5 V |
| 最小模拟输入电压 | -2.5 V |
| 最长转换时间 | 18.5 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-GDIP-T24 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.0977% |
| 模拟输入通道数量 | 2 |
| 位数 | 10 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | BINARY |
| 输出格式 | PARALLEL, 8 BITS |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大压摆率 | 10 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8969801LC | 5962-8969802LX | 5962-8969801LB | 5962-8969802LB | 5962-8969802LA | 5962-8969802LC | 5962-8969801LA | |
|---|---|---|---|---|---|---|---|
| 描述 | IC 2-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP24, 1.280 X 0.310 INCH, CERDIP-24, Analog to Digital Converter | IC 2-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP24, 1.280 X 0.310 INCH, CERDIP-24, Analog to Digital Converter | IC 2-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP24, 1.280 X 0.310 INCH, CERDIP-24, Analog to Digital Converter | IC 2-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP24, 1.280 X 0.310 INCH, CERDIP-24, Analog to Digital Converter | IC 2-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP24, 1.280 X 0.310 INCH, CERDIP-24, Analog to Digital Converter | IC 2-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP24, 1.280 X 0.310 INCH, CERDIP-24, Analog to Digital Converter | 2-CH 10-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP24, 1.280 X 0.310 INCH, CERDIP-24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 包装说明 | DIP, | 1.280 X 0.310 INCH, CERDIP-24 | DIP, | 1.280 X 0.310 INCH, CERDIP-24 | 1.280 X 0.310 INCH, CERDIP-24 | 1.280 X 0.310 INCH, CERDIP-24 | DIP, DIP24,.3 |
| 针数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | not_compliant | unknown | not_compliant | compliant | compliant | compliant | not_compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最大模拟输入电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 最小模拟输入电压 | -2.5 V | -2.5 V | -2.5 V | -2.5 V | -2.5 V | -2.5 V | -2.5 V |
| 最长转换时间 | 18.5 µs | 18.5 µs | 18.5 µs | 18.5 µs | 18.5 µs | 18.5 µs | 18.5 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e4 | e0 |
| 最大线性误差 (EL) | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% | 0.0977% |
| 模拟输入通道数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 位数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | PARALLEL, 8 BITS | PARALLEL, WORD | PARALLEL, 8 BITS | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, 8 BITS |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 最大压摆率 | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA | 10 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | GOLD | Tin/Lead (Sn63Pb37) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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