Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS
| 参数名称 | 属性值 |
| 包装说明 | DIE, |
| Reach Compliance Code | unknown |
| 系列 | HC/UH |
| JESD-30 代码 | X-XUUC-N20 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | UNSPECIFIED |
| 封装形式 | UNCASED CHIP |
| 传播延迟（tpd） | 29 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| 总剂量 | 100k Rad(Si) V |
| Base Number Matches | 1 |
| 5962R9579201V9A | 5962R9579201VRC | 5962R9579201VXC | HCS373KMSR | HCS373DMSR | HCS373HMSR | |
|---|---|---|---|---|---|---|
| 描述 | Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS | Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, | Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20 | Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20 | Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, | Bus Driver, HC/UH Series, 1-Func, 8-Bit, True Output, CMOS |
| 包装说明 | DIE, | , | , | DFP, FL20,.3 | DIP, DIP20,.3 | DIE, |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknow |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | X-XUUC-N20 | R-CDIP-T20 | R-CDFP-F20 | R-CDFP-F20 | R-CDIP-T20 | X-XUUC-N20 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| 封装形状 | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
| 封装形式 | UNCASED CHIP | IN-LINE | FLATPACK | FLATPACK | IN-LINE | UNCASED CHIP |
| 传播延迟（tpd） | 29 ns | 29 ns | 29 ns | 29 ns | 29 ns | 29 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | NO LEAD |
| 端子位置 | UPPER | DUAL | DUAL | DUAL | DUAL | UPPER |
| JESD-609代码 | e0 | e4 | e4 | e0 | e0 | - |
| 封装代码 | DIE | - | - | DFP | DIP | DIE |
| 端子面层 | TIN LEAD | GOLD | GOLD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 总剂量 | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 200k Rad(Si) V | 200k Rad(Si) V | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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嵌入式系统
stm32/stm8
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