IC,LOGIC MUX,QUAD,2-INPUT,ACT-CMOS,DIP,16PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER |
| 最大I（ol） | 0.024 A |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 8.5 ns |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 74ACT157PCQR | 54ACT157FMQB | 54AC157FMQB | 54AC157LMQB | 74ACT157SCQR | 54ACT157DMQB | 74AC157SCQR | 54ACT157LMQB | 74AC157PCQR | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | IC,LOGIC MUX,QUAD,2-INPUT,ACT-CMOS,DIP,16PIN,PLASTIC | IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16, Multiplexer/Demultiplexer | IC AC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDFP16, CERAMIC, FP-16, Multiplexer/Demultiplexer | IC AC SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20, Multiplexer/Demultiplexer | IC,LOGIC MUX,QUAD,2-INPUT,ACT-CMOS,SOP,16PIN,PLASTIC | IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16, Multiplexer/Demultiplexer | IC,LOGIC MUX,QUAD,2-INPUT,AC-CMOS,SOP,16PIN,PLASTIC | IC ACT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20, Multiplexer/Demultiplexer | IC,LOGIC MUX,QUAD,2-INPUT,AC-CMOS,DIP,16PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP16,.3 | DFP, FL16,.3 | CERAMIC, FP-16 | QCCN, LCC20,.35SQ | SOP, SOP16,.25 | DIP, DIP16,.3 | SOP, SOP16,.25 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PDIP-T16 | R-GDFP-F16 | R-GDFP-F16 | S-CQCC-N20 | R-PDSO-G16 | R-GDIP-T16 | R-PDSO-G16 | S-CQCC-N20 | R-PDIP-T16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 最大I（ol） | 0.024 A | 0.024 A | 0.012 A | 0.012 A | 0.024 A | 0.024 A | 0.012 A | 0.024 A | 0.012 A |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 20 | 16 | 16 | 16 | 20 | 16 |
| 最高工作温度 | 85 °C | 125 °C | 125 °C | 125 °C | 85 °C | 125 °C | 85 °C | 125 °C | 85 °C |
| 最低工作温度 | -40 °C | -55 °C | -55 °C | -55 °C | -40 °C | -55 °C | -40 °C | -55 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| 封装代码 | DIP | DFP | DFP | QCCN | SOP | DIP | SOP | QCCN | DIP |
| 封装等效代码 | DIP16,.3 | FL16,.3 | FL16,.3 | LCC20,.35SQ | SOP16,.25 | DIP16,.3 | SOP16,.25 | LCC20,.35SQ | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | FLATPACK | CHIP CARRIER | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | CHIP CARRIER | IN-LINE |
| 电源 | 5 V | 5 V | 3.3/5 V | 3.3/5 V | 5 V | 5 V | 3.3/5 V | 5 V | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 8.5 ns | 9 ns | 11 ns | 11 ns | 8.5 ns | 9 ns | 9 ns | 9 ns | 9 ns |
| 表面贴装 | NO | YES | YES | YES | YES | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | MILITARY | MILITARY | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | FLAT | FLAT | NO LEAD | GULL WING | THROUGH-HOLE | GULL WING | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | National Semiconductor（TI ） | - | National Semiconductor（TI ） | - | National Semiconductor（TI ） | - | National Semiconductor（TI ） | - | National Semiconductor（TI ） |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | - |
| 系列 | - | ACT | AC | AC | - | ACT | - | ACT | - |
| 长度 | - | 9.6645 mm | 9.6645 mm | 8.89 mm | - | 19.43 mm | - | 8.89 mm | - |
| 输出次数 | - | 1 | 1 | 1 | - | 1 | - | 1 | - |
| 输出极性 | - | TRUE | TRUE | TRUE | - | TRUE | - | TRUE | - |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | - |
| 传播延迟（tpd） | - | 11.5 ns | 11.5 ns | 11.5 ns | - | 11.5 ns | - | 11.5 ns | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | - |
| 筛选级别 | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | - |
| 座面最大高度 | - | 2.032 mm | 2.032 mm | 1.905 mm | - | 5.08 mm | - | 1.905 mm | - |
| 最大供电电压 (Vsup) | - | 5.5 V | 6 V | 6 V | - | 5.5 V | - | 5.5 V | - |
| 最小供电电压 (Vsup) | - | 4.5 V | 2 V | 2 V | - | 4.5 V | - | 4.5 V | - |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - | NOT SPECIFIED | - |
| 宽度 | - | 6.604 mm | 6.604 mm | 8.89 mm | - | 7.62 mm | - | 8.89 mm | - |
电源技术
FPGA/CPLD
stm32/stm8
微控制器 MCU
单片机
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